JPH0567728A - Function trimming method for hybrid integrated circuit - Google Patents
Function trimming method for hybrid integrated circuitInfo
- Publication number
- JPH0567728A JPH0567728A JP22720891A JP22720891A JPH0567728A JP H0567728 A JPH0567728 A JP H0567728A JP 22720891 A JP22720891 A JP 22720891A JP 22720891 A JP22720891 A JP 22720891A JP H0567728 A JPH0567728 A JP H0567728A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- value
- difference
- amount
- cutting amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000009966 trimming Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 4
- 238000005520 cutting process Methods 0.000 abstract description 42
- 238000005259 measurement Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、混成集積回路として
構成された例えば増幅器の増幅特性を、その厚膜または
薄膜抵抗の一部をレーザなどで切断除去して目的のもの
にするファンクショントリミング方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a function trimming method in which the amplification characteristic of, for example, an amplifier formed as a hybrid integrated circuit is cut to a target by cutting off a part of its thick film or thin film resistance with a laser or the like. Regarding
【0002】[0002]
【従来の技術】例えば図2Aに示すような増幅器11が
混成(ハイブリッド)集積回路として構成され、その増
幅器11に含まれる厚膜は薄膜で形成された調整用抵抗
12の一部を切断除去することにより、その増幅器11
の特性、例えば出力波形の立上り、立下り特性を調整し
ている。2. Description of the Related Art For example, an amplifier 11 as shown in FIG. 2A is constructed as a hybrid integrated circuit, and a thick film included in the amplifier 11 cuts and removes a part of an adjusting resistor 12 formed of a thin film. Therefore, the amplifier 11
Of the output waveform, for example, the rising and falling characteristics of the output waveform are adjusted.
【0003】増幅器11の例えば立上り特性の値と、調
整用抵抗12の切断量との関係は、例えは図2Bに示す
ように、目標値から大きく離れている状態では抵抗の除
去量の影響が小さく、目標値に近づくに従ってわずかの
除去量でも特性が大きく変化する。For example, as shown in FIG. 2B, the relationship between the value of the rising characteristic of the amplifier 11 and the disconnection amount of the adjusting resistor 12 is influenced by the removal amount of the resistor when it is far from the target value, for example. The characteristics are small, and the characteristics greatly change with a slight removal amount as the target value is approached.
【0004】[0004]
【発明が解決しようとする課題】調整用抵抗12の一部
除去は通常レーザを照射して行うが、この切断除去速度
は通常0.5〜20mm/s程度である。この切断除去速度
に対し、増幅器11の特性を測定する速度が十分高速で
あれば、抵抗の切断除去を行いながら、同時にその特性
の測定を行い、その特性が目標値に到達したか否かの判
断を行うことができるため、高速な連続切断トリミング
を実行できる。A part of the adjusting resistor 12 is usually removed by irradiating a laser, and the cutting removal rate is usually about 0.5 to 20 mm / s. If the speed at which the characteristic of the amplifier 11 is measured is sufficiently high with respect to this cutting / removing speed, the characteristic is simultaneously measured while cutting / removing the resistor to determine whether or not the characteristic has reached the target value. Since a judgment can be made, high-speed continuous cutting trimming can be executed.
【0005】しかし、特性の測定に比較的長い時間、例
えば0.2〜0.5秒もかゝる場合は、測定と同時に切断除
去を行うと、オーバーカット、つまり目標の特性値から
許容値以上通過してしまう恐れがあり、測定しながら切
断除去を行うことはできなかった。このような場合は、
従来においてはオーバーカットしない最小の切断量を決
め、「その最小切断量だけ切断−特性測定−その測定の
判断」のプロセスを繰り返すステップ切断トリミングを
行っていた。このため、目標値に達するまでの測定回数
が多くなり、トリミングに長い時間がかゝるという問題
があった。However, if it takes a relatively long time to measure the characteristic, for example, 0.2 to 0.5 seconds, if cutting and removing are performed at the same time as the measurement, an overcut, that is, an allowable value from the target characteristic value is obtained. There was a risk of passing through the above, and cutting and removal could not be performed while measuring. In this case,
Conventionally, step cutting trimming is performed in which the minimum cutting amount that does not cause overcut is determined and the process of "cutting only the minimum cutting amount-characteristic measurement-judgment of the measurement" is repeated. As a result, the number of measurements required to reach the target value increases, and there is a problem that trimming takes a long time.
【0006】[0006]
【課題を解決するための手段】この発明によれば、ステ
ップ切断トリミングにおいて、目標値と測定値との差を
求め、その差が小さくなるに従って次のトリミング量
(切断除去量)を小さくする。According to the present invention, in step cutting trimming, the difference between the target value and the measured value is obtained, and the next trimming amount (cutting removal amount) is reduced as the difference becomes smaller.
【0007】[0007]
【実施例】図1を参照してこの発明の実施例を説明す
る。いま混合集積回路の調整用抵抗12が図1Aに示す
形状をしており、その両端の電極13,14の中間部を
線15で示す方向に切断しながら特性値の調整を行う場
合に、その切断量と特性値との関係が図1Bに示す状態
にあるとする。その切断量と特性値との関係において目
標値CG における許容特性値量ΔCに対する切断量ΔL
との比、つまり、目標値付近における特性値の変化率Δ
S=ΔC/ΔLを予め実験で求める。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described with reference to FIG. Now, the adjustment resistor 12 of the mixed integrated circuit has the shape shown in FIG. 1A, and when the characteristic value is adjusted while cutting the intermediate portion of the electrodes 13 and 14 at both ends in the direction indicated by the line 15, It is assumed that the relationship between the cutting amount and the characteristic value is in the state shown in FIG. 1B. In the relationship between the cutting amount and the characteristic value, the cutting amount ΔL with respect to the allowable characteristic value amount ΔC at the target value C G
Ratio, that is, the rate of change of the characteristic value near the target value Δ
S = ΔC / ΔL is experimentally obtained in advance.
【0008】実際のトリミングでは、特性値Cを測定
し、その測定値Cと目標値CG との差を求め、その差と
前記特性値変化率ΔSとの積を次の切断量とする。例え
ば、特性値変化率ΔSが1.0,目標値CG が3.00,最
初の測定値Cが2.72の場合、第1ステップの切断量L
は0.28mmとなる。以下切断、測定、判定ごとの測定値
C,切断量Lは例えば次のようになる。In actual trimming, the characteristic value C is measured, the difference between the measured value C and the target value C G is obtained, and the product of the difference and the characteristic value change rate ΔS is taken as the next cutting amount. For example, when the characteristic value change rate ΔS is 1.0, the target value C G is 3.00, and the first measured value C is 2.72, the cutting amount L in the first step is L.
Is 0.28 mm. Hereinafter, the measured value C and the cut amount L for each cutting, measurement and determination are as follows, for example.
【0009】 ステップ番号 ( CG − C ) × ΔS = L(mm) 1 3.00 − 2.72 × 1.0 = 0.28 2 3.00 − 2.75 × 1.0 = 0.25 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ N−1 3.00 − 2.82 × 1.0 = 0.18 N 3.00 − 2.92 × 1.0 = 0.08 この数値例での各ステップごとの切断の状態を図1Aに
線15にステップ番号を付けて示す。[0009] step number (C G - C) × ΔS = L (mm) 1 3.00 - 2.72 × 1.0 = 0.28 2 3.00 - 2.75 × 1.0 = 0.25・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ N-1 3.00 − 2.82 × 1.0 = 0.18 N 3.00 − 2.92 × 1.0 = 0.08 In this numerical example The state of cutting at each step is shown in FIG. 1A with line 15 and step numbers.
【0010】このように、この発明では目標値CG と測
定値Cとの差が大きい時は、切断量Lを大きくとり、差
が小さい時は切断量Lを小さくしてオーバーカットにな
らないようにする。従ってオーバーカットが生じないよ
うに最初から切断量をΔLずつ切断してゆく場合と比較
して、切断回数、測定回数が著しく少なくなり、トリミ
ングに必要とする時間を著しく短くすることができる。As described above, according to the present invention, when the difference between the target value C G and the measured value C is large, the cutting amount L is made large, and when the difference is small, the cutting amount L is made small to prevent overcutting. To Therefore, the number of times of cutting and the number of times of measurement are remarkably reduced, and the time required for trimming can be remarkably shortened, as compared with the case where the cutting amount is cut by ΔL from the beginning so that overcut does not occur.
【0011】例えば、混成集積回路で構成した高速パル
ス増幅器における出力波形の立上りや立下りを、デジタ
ルオシロスコープで測定して、トリミングを行って目的
とする特性にする場合などに、この発明は有効である。The present invention is effective, for example, when the rising and falling edges of the output waveform in a high-speed pulse amplifier composed of a hybrid integrated circuit are measured with a digital oscilloscope and trimmed to obtain the desired characteristics. is there.
【0012】[0012]
【発明の効果】以上述べたように、この発明によれば特
性測定値が目標値から大きくずれている時は、大きな切
断量とし、そのずれが小さくなるに従って切断量を小さ
くすることにより、切断速度に対し、特性測定、その判
定に長い時間を必要とするステップ切断トリミングにお
いて、トリミング時間を、従来よりも著しく短くするこ
とができる。As described above, according to the present invention, when the characteristic measured value is largely deviated from the target value, a large cutting amount is set, and the cutting amount is reduced as the deviation becomes smaller, so that the cutting In step cutting trimming, which requires a long time for the characteristic measurement and the determination with respect to the speed, the trimming time can be significantly shortened as compared with the conventional case.
【図1】Aは調整用抵抗とトリミングステップごとの切
断量の例を示す平面図、Bは特性値と切断量と、ステッ
プごとの切断量との関係例を示す図である。1A is a plan view showing an example of an adjustment resistance and a cutting amount for each trimming step, and FIG. 1B is a diagram showing an example of a relationship between a characteristic value, a cutting amount, and a cutting amount for each step.
【図2】Aは混合集積回路で構成された増幅器の等価回
路図、Bはその特性値と調整用抵抗の切断量との関係を
示す図である。FIG. 2A is an equivalent circuit diagram of an amplifier configured by a mixed integrated circuit, and B is a diagram showing a relationship between a characteristic value thereof and a cut amount of an adjustment resistor.
Claims (1)
小さくなるに従って次のトリミング量を小さくすること
を特徴とする混成集積回路のファンクショントリミング
方法。1. A function trimming method for a hybrid integrated circuit, characterized in that a difference between a target value and a measured value is obtained, and the next trimming amount is reduced as the difference becomes smaller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22720891A JPH0567728A (en) | 1991-09-06 | 1991-09-06 | Function trimming method for hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22720891A JPH0567728A (en) | 1991-09-06 | 1991-09-06 | Function trimming method for hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0567728A true JPH0567728A (en) | 1993-03-19 |
Family
ID=16857190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22720891A Withdrawn JPH0567728A (en) | 1991-09-06 | 1991-09-06 | Function trimming method for hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0567728A (en) |
-
1991
- 1991-09-06 JP JP22720891A patent/JPH0567728A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981203 |