JPH0569703B2 - - Google Patents
Info
- Publication number
- JPH0569703B2 JPH0569703B2 JP1133987A JP13398789A JPH0569703B2 JP H0569703 B2 JPH0569703 B2 JP H0569703B2 JP 1133987 A JP1133987 A JP 1133987A JP 13398789 A JP13398789 A JP 13398789A JP H0569703 B2 JPH0569703 B2 JP H0569703B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- filler
- resin
- prepreg
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、電気積層板の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method of manufacturing an electrical laminate.
金属板を基板として用いた多層の電気積層板の
製造方法は、たとえば、特願昭63−73671号出願
に開示されている。同製造方法は、第２図にその
工程が示されている。同図ａにみるように、金属
板２は銅板やアルミニウム板等で形成され、スル
ーホールの形成される個所に同スルーホールより
も径の大きな通孔１…が明けられている。この金
属板２には、同図ｂにみるように、片面（下面）
にプリプレグ３ａを重ねて仮接着させるようにす
る。プリプレグ３ａはガラス布や紙等を基材と
し、これにエポキシ樹脂やポリイミド等の熱硬化
性樹脂を含浸させて乾燥することによつて調製さ
れたものであり、同プリプレグ３ａは、金属板２
の通孔１の底の開口を閉塞する役目をなすだけの
ものであるため、0.1mm程度の薄いものになつて
いる。つぎに、同図ｃにみるように、金属板２の
通孔１…内に、球状粉末やガラス繊維等の充填剤
を配合した樹脂４を充填してのち、減圧脱気して
加熱することで同樹脂４を硬化させる。こうして
得られた複合体６を、同図ｄにみるように、数枚
重ねるとともに各最外層の複合体６の外側面にプ
リプレグ３ｂを介して銅箔等の金属箔１３を重ね
る。このとき、各複合体６間には、片面プリント
配線板や両面プリント配線板、多層プリント配線
板など、内層用回路を形成した回路板１２…をプ
リプレグ３ｂを介してセツトしておくようにす
る。そして、これら積層状のものを加熱加圧成形
することで、プリプレグ３ｂに含浸させた樹脂が
硬化して、各複合体６と回路板１２とが接着する
ようになり、これにより、金属板２と回路板１２
とが交互に積層した最外層に金属箔１３，１３の
接着した電気積層板の半製品を得ることができ
る。そののち、同半製品に、ドリル加工やパンチ
加工等により穿孔加工することで、スルーホール
を形成する。同スルーホールは、前記通孔１より
も小さい直径で樹脂４の部分の中心を通るもので
ある。これにより、樹脂４が一部残されるので、
スルーホールの内周と金属板２との間の電気絶縁
性が確保される。そして、スルーホールを加工し
たのち、同スルーホールの内周面に銅メツキ等の
方法で導体膜を形成したり、金属箔１３をエツチ
ング処理して外層回路を形成したりすることで、
多層の金属板２…を基板とし回路板１２…による
内層回路と金属箔１３，１３による外層回路とを
備えた多層の電気積層板が出来上るのである。
A method for manufacturing a multilayer electrical laminate using a metal plate as a substrate is disclosed, for example, in Japanese Patent Application No. 1983-73671. The steps of the manufacturing method are shown in FIG. As shown in FIG. 1A, the metal plate 2 is made of a copper plate, an aluminum plate, or the like, and has through holes 1 having a larger diameter than the through holes at the locations where the through holes are to be formed. This metal plate 2 has one side (lower side) as shown in Figure b.
The prepreg 3a is superimposed on and temporarily adhered to. The prepreg 3a is prepared by using glass cloth, paper, etc. as a base material, impregnating it with a thermosetting resin such as epoxy resin or polyimide, and drying it.
Since it only serves to close the opening at the bottom of the through hole 1, it is approximately 0.1 mm thin. Next, as shown in Figure c, resin 4 mixed with fillers such as spherical powder and glass fiber is filled into the through holes 1 of the metal plate 2, and then degassed under reduced pressure and heated. The resin 4 is cured. As shown in Figure d, several composites 6 thus obtained are stacked, and a metal foil 13 such as a copper foil is layered on the outer surface of each outermost layer of the composite 6 via a prepreg 3b. At this time, a circuit board 12 on which an inner layer circuit is formed, such as a single-sided printed wiring board, a double-sided printed wiring board, or a multilayer printed wiring board, is set between each composite body 6 via the prepreg 3b. . By heating and press-molding these laminates, the resin impregnated into the prepreg 3b is cured, and each composite 6 and the circuit board 12 are bonded to each other, thereby causing the metal plate 2 and circuit board 12
A semi-finished electrical laminate can be obtained in which metal foils 13, 13 are adhered to the outermost layer in which the metal foils 13 and 13 are alternately laminated. Thereafter, a through hole is formed in the semi-finished product by drilling, punching, or the like. The through hole has a smaller diameter than the through hole 1 and passes through the center of the resin 4 portion. As a result, some of the resin 4 remains, so
Electrical insulation between the inner periphery of the through hole and the metal plate 2 is ensured. After processing the through hole, a conductive film is formed on the inner peripheral surface of the through hole by a method such as copper plating, or an outer layer circuit is formed by etching the metal foil 13.
A multilayer electrical laminate is completed, which has the multilayer metal plates 2 as a substrate, an inner layer circuit formed by the circuit boards 12, and an outer layer circuit formed by the metal foils 13, 13.
前記電気積層板の製造方法によれば、金属板２
の通孔１に充填した樹脂４に充填剤が配合されて
いるので、前記穿孔加工をするとスルーホールの
内周面にこの充填剤が露出して同内周面が凹凸面
となり、この凹凸面がアンカー効果などを発揮す
ることで、スルーホールに内周面に施される導体
層（メツキ層）の密着性が高まるものである。そ
のほか、通孔１内の樹脂４は、予め同通孔１内に
流し込んで充填されるもので、成形時にプリプレ
グ３ｂの溶融樹脂を流入させて充填されるもので
はないので、通孔１内の樹脂４中の充填剤量が少
なくなつてスルーホールの凹凸面が不十分になつ
たり、充填剤が偏在して加熱応力が加わつたとき
に充填剤と樹脂との界面に剥離が生じたりするお
それはない等の利点を有する。 According to the method for manufacturing an electrical laminate, the metal plate 2
Since a filler is mixed in the resin 4 filled in the through hole 1, when the hole is punched, this filler is exposed on the inner circumferential surface of the through hole, and the inner circumferential surface becomes an uneven surface. By exhibiting an anchor effect, etc., the adhesion of the conductor layer (plated layer) applied to the inner peripheral surface of the through hole is increased. In addition, the resin 4 in the through hole 1 is filled by pouring it into the through hole 1 in advance, and is not filled by flowing the molten resin of the prepreg 3b during molding. If the amount of filler in the resin 4 decreases, the uneven surface of the through hole may become insufficient, or if the filler is unevenly distributed and heat stress is applied, peeling may occur at the interface between the filler and the resin. It has no such advantages.
発明が解決しようとする課題
しかし、前記通孔１に充填される樹脂４が粉粒
体であるときには必ずしも上記のようにはならな
い。樹脂４が粉粒体であるときは、同粉粒体を、
充填剤とともに、一方がプリプレグ３ａで塞がれ
た通孔１に入れてのち、同充填剤配合樹脂粉粒体
を、金属板２の上面に沿つてスキージーにより掻
き落とするようにするのが通例であつた。したが
つて、通孔１に入れられた充填剤配合樹脂粉粒体
間には隙間が残るため、前記加熱加圧成形時にプ
リプレグ３ａからの樹脂が通孔１に流れ込むよう
になつて、その流れ作用で通孔１内の充填剤が同
通孔１内において偏るようになる。その結果、ス
ルーホールを形成したときの凹凸面が不十分な凹
凸になつたり、加熱応力が加わつたときに充填剤
と樹脂との界面に剥離が生じたりする。充填剤が
偏在すると、第３図にみるように、加熱加圧成形
に伴つて上・下方向に収縮力が発生するようにな
り、その状態で同図×印の四隅Ｃ…にプリプレグ
３ａ，３ｂからの溶融樹脂が流れ込むようなこと
があると、その部分Ｃ…が他と比べて著しく高濃
度の部分になり、その結果、ここに層間クラツク
が発生しやすくなつていた。これらのことから、
スルーホール信頼性の向上を図ることができなか
つた。Problems to be Solved by the Invention However, when the resin 4 filled in the through hole 1 is a granular material, the above is not necessarily the case. When the resin 4 is a powder or granule, the powder or granule is
It is customary to put the filler together with the filler into the through hole 1 which is blocked on one side by the prepreg 3a, and then scrape off the filler-containing resin powder along the top surface of the metal plate 2 with a squeegee. It was hot. Therefore, gaps remain between the filler-containing resin powder particles placed in the through holes 1, so that the resin from the prepreg 3a flows into the through holes 1 during the heating and pressure molding, and the flow is reduced. As a result, the filler in the through hole 1 becomes uneven within the through hole 1. As a result, the uneven surface upon forming the through hole may become insufficiently uneven, or peeling may occur at the interface between the filler and the resin when thermal stress is applied. If the filler is unevenly distributed, as shown in Fig. 3, shrinkage force will be generated in the upward and downward directions as a result of hot and pressurized molding, and in this state, the prepreg 3a, When the molten resin from 3b flows in, the concentration in that part C becomes significantly higher than in other parts, and as a result, interlaminar cracks are more likely to occur here. from these things,
It was not possible to improve through-hole reliability.
前記事情に鑑みて、この発明の課題とするとこ
ろは、スルーホール信頼性に優れるようにするこ
とにある。 In view of the above circumstances, an object of the present invention is to improve through-hole reliability.
前記課題を解決するため、この発明にかかる電
気積層板の製造方法は、通孔を有する金属板の同
通孔内に充填剤配合樹脂粉粒体を振動付与により
充填した後、この金属板をプリプレグを介して複
数枚重ね、これを加熱加圧して積層成形し、その
後に前記通孔内の樹脂の部分でスルーホールを穿
孔加工するようにする。
In order to solve the above problems, the method for manufacturing an electric laminate according to the present invention includes filling the through holes of a metal plate with a filler-containing resin powder by applying vibration, and then removing the metal plate from the metal plate. A plurality of sheets are stacked with prepreg interposed therebetween, and the sheets are laminated by heating and pressurizing, and then through-holes are punched using the resin portions in the through-holes.
前記充填剤配合樹脂粉粒体の通孔内への充填
を、振動付与により行なうようにすると、振動に
より充填率が上がり、成形時にプリプレグからの
樹脂の流れ込みが少なくなつて、通孔内での充填
剤の偏りがなくなる。これにより、通孔内に充填
される樹脂として粉粒体を用いても、スルーホー
ル形成時に充填剤による凹凸面が充分に得られる
とともに、充填剤と樹脂間の界面に剥離が生じた
り、層間クラツクが発生したりすることがなくな
る。
If the filler-containing resin powder is filled into the through holes by applying vibration, the filling rate will increase due to the vibration, and the flow of resin from the prepreg during molding will be reduced, resulting in more The bias of the filler is eliminated. As a result, even if powder or granular material is used as the resin filled in the through hole, a sufficiently uneven surface due to the filler can be obtained when forming the through hole, and peeling may occur at the interface between the filler and the resin, or between the layers. Cracks will no longer occur.
以下に、この発明を、その実施例をあらわす図
面を参照しつつ詳しく説明する。
Hereinafter, the present invention will be explained in detail with reference to the drawings showing embodiments thereof.
第１図は、この発明にかかる電気積層板の製造
方法の一実施例をあらわしている。同図は、第２
図ｃに相当する充填工程をあらわし、その他の工
程は第２図に示したと同様であるので、重複した
説明は省略する。同図ａにみるように、金属板２
の通孔１内には、充填剤配合樹脂粉粒体４が多目
で盛り上がるようにして入れられる。この充填剤
配合樹脂粉粒体４には、プリプレグ３ａに含浸さ
せるものと同様のものを粉末状にしたものが使わ
れる。充填剤としては任意のものを用いることが
できるが、Al2O3、Al2O3・H2O、Al2O3・
3H2O、タルク、MgO、CaCO3、Sb2O3、Ab2O5
などの球状粉末、ＥガラスがＤガラス、Ｔガラ
ス、Ｒガラス、Ｑガラスなどのガルス繊維や、ケ
ブラー（デユポン社製）、テクノーラ（帝人社製）
などのアラミド繊維等を細かく切断してすりつぶ
した針状粉末を例示することができる。樹脂粉粒
体４への充填剤の配合量は、樹脂分100重量部に
対して50〜1000重量部程度、好ましくは、400重
量部とされる。プリプレグ３ａを仮接着した金属
板２の通孔１内に充填剤配合樹脂粉粒体４が入れ
られた複合体を、たとえば、同図示のように、上
下に繰り返し振動させるようにする。この振動
は、水平軸回りに偏心回転する軸を駆動部として
衝撃を伴うものになつている。これにより、充填
剤配合樹脂粉粒体４は、同図ｂにみるように、通
孔１内に詰め込まれるようになり、詰め込み度が
一定の限度に達した時点で、通孔１外に残る余分
な充填剤配合樹脂粉粒体４のみを除去手段１０で
取り除くようにする。この取り除きは、通孔１外
の少量の充填剤配合樹脂粉粒体４を残するように
して、積層成形時の加熱加圧でさらに通孔１内に
充填させるようにすることもできる。なお、プリ
プレグ３ａ，３ｂには充填剤は配合されていな
い。 FIG. 1 shows an embodiment of the method for manufacturing an electrical laminate according to the present invention. The figure shows the second
The filling process corresponding to FIG. As shown in figure a, metal plate 2
The filler-containing resin powder 4 is put into the through hole 1 in a manner that it bulges out in many places. As the filler-containing resin powder 4, a powder similar to that which is impregnated into the prepreg 3a is used. Any filler can be used, but Al 2 O 3 , Al 2 O 3・H 2 O, Al 2 O 3・
3H2O , talc , MgO, CaCO3 , Sb2O3 , Ab2O5
Spherical powder such as E glass, glass fiber such as D glass, T glass, R glass, Q glass, Kevlar (manufactured by DuPont), Technora (manufactured by Teijin)
An example is needle-shaped powder obtained by finely cutting and grinding aramid fibers such as . The amount of filler added to the resin powder 4 is about 50 to 1000 parts by weight, preferably 400 parts by weight, based on 100 parts by weight of the resin. A composite body in which filler-containing resin powder 4 is placed in through hole 1 of metal plate 2 to which prepreg 3a is temporarily bonded is repeatedly vibrated up and down, for example, as shown in the figure. This vibration is accompanied by an impact using a shaft that rotates eccentrically around a horizontal axis as a driving portion. As a result, the filler-containing resin powder 4 comes to be packed into the through hole 1, as shown in Figure b, and remains outside the through hole 1 when the degree of packing reaches a certain limit. Only the excess filler-containing resin powder 4 is removed by a removing means 10. This removal can also be done by leaving a small amount of the filler-containing resin powder 4 outside the through holes 1, and then filling the through holes 1 with heat and pressure during lamination molding. Note that no filler is mixed in the prepregs 3a and 3b.
前記のように、この発明にかかる電気積層板の
製造方法は、前記通孔内への充填剤配合樹脂粉粒
体の充填を、振動付与により行なうようにするの
で、振動により充填率が上がり、成形時にプリプ
レグからの樹脂の流れ込みが少なくなつて、通孔
内での充填剤の偏りがなくなる。これにより、通
孔内に充填される樹脂として粉粒体を用いても、
スルーホール形成時に充填剤による凹凸面が充分
に得られるとともに、充填剤と樹脂間の界面に剥
離が生じたり、層間クラツクが発生したりするこ
とがなくなる。 As described above, in the method for manufacturing an electrical laminate according to the present invention, the filler-containing resin powder is filled into the through holes by applying vibration, so that the filling rate increases due to the vibration. The flow of resin from the prepreg during molding is reduced, eliminating unevenness of the filler within the through holes. As a result, even if powder or granular material is used as the resin filled in the through hole,
When forming through-holes, a sufficiently uneven surface due to the filler can be obtained, and peeling and interlayer cracks do not occur at the interface between the filler and the resin.
なお、前記振動付与時には、充填剤配合樹脂粉
粒体上にあるように押えを載せるようにしてもよ
い。この押えは、ピン型であつたり、平板型であ
つたりすることもある。前記充填は、プリプレグ
を仮接着しない状態で行ない、この金属板を直接
積層形成するようにしてもよい。 In addition, when applying the vibration, a presser foot may be placed on top of the filler-containing resin powder. This presser foot may be pin-shaped or flat plate-shaped. The filling may be performed without temporarily adhering the prepreg, and the metal plates may be directly laminated.
この発明にかかる電気積層板の製造方法は、以
上のようにするため、スルーホール信頼性に優れ
るようになる。
The method for manufacturing an electrical laminate according to the present invention, as described above, has excellent through-hole reliability.
第１図はこの発明にかかる電気積層板の製造方
法の一実施例をあらわし、同図ａは充填剤配合樹
脂粉粒体が充填のため通孔に入れられて振動を与
えられる様子をあらわす断面図、同図ｂはその充
填後の様子をあらわす断面図、第２図は従来の方
法を工程順にあらわす断面図、第３図は層間クラ
ツクの発生状況をあらわす断面図である。
１…通孔、２…金属板、３ａ，３ｂ…プリプレ
グ、４…充填剤配合樹脂粉粒体。
Fig. 1 shows an embodiment of the method for producing an electrical laminate according to the present invention, and Fig. 1a shows a cross section showing how filler-containing resin powder is put into a through hole for filling and is subjected to vibration. FIG. 2 is a cross-sectional view showing the state after filling, FIG. 2 is a cross-sectional view showing the conventional method in the order of steps, and FIG. 3 is a cross-sectional view showing the occurrence of interlayer cracks. 1... Through hole, 2... Metal plate, 3a, 3b... Prepreg, 4... Filler-containing resin powder.
Claims (1)
樹脂粉粒体を振動付与により充填した後、この金
属板をプリプレグを介して複数枚重ね、これを加
熱加圧して積層成形し、その後に前記通孔内の樹
脂の部分でスルーホールを穿孔加工するようにす
る電気積層板の製造方法。1. After filling the holes of a metal plate with a through hole with filler-containing resin powder by applying vibration, a plurality of these metal plates are stacked with prepreg interposed therebetween, and this is laminated by heating and pressurizing. A method for manufacturing an electrical laminate, in which a through hole is then punched using a resin portion within the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133987A JPH03245A (en) | 1989-05-26 | 1989-05-26 | Preparation of electric laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133987A JPH03245A (en) | 1989-05-26 | 1989-05-26 | Preparation of electric laminated sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03245A JPH03245A (en) | 1991-01-07 |
| JPH0569703B2 true JPH0569703B2 (en) | 1993-10-01 |
Family
ID=15117735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1133987A Granted JPH03245A (en) | 1989-05-26 | 1989-05-26 | Preparation of electric laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03245A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100494A (en) * | 1980-01-16 | 1981-08-12 | Fujitsu Ltd | Method of manufacturing printed circuit board |
| JPS60236294A (en) * | 1984-05-10 | 1985-11-25 | 松下電工株式会社 | Metal base circuit board |
-
1989
- 1989-05-26 JP JP1133987A patent/JPH03245A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03245A (en) | 1991-01-07 |
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