JPH0583181B2 - - Google Patents

Info

Publication number: JPH0583181B2
Authority: JP; Japan
Prior art keywords: probe; probes; tip; center; support ring
Prior art date: 1987-02-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP2322687A

Other languages

English (en)

Japanese (ja)

Other versions

JPS63192246A (ja

Inventor

Kazunari Imahashi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokyo Electron Ltd

Original Assignee

Tokyo Electron Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-02-03

Filing date

1987-02-03

Publication date

1993-11-25

1987-02-03 Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd

1987-02-03 Priority to JP2322687A priority Critical patent/JPS63192246A/ja

1988-08-09 Publication of JPS63192246A publication Critical patent/JPS63192246A/ja

1993-11-25 Publication of JPH0583181B2 publication Critical patent/JPH0583181B2/ja

Status Granted legal-status Critical Current

Links

239000000523 sample Substances 0.000 claims description 126
238000000034 method Methods 0.000 claims description 18
230000005484 gravity Effects 0.000 claims description 7
238000005259 measurement Methods 0.000 claims description 2
238000005452 bending Methods 0.000 claims 1
235000012431 wafers Nutrition 0.000 description 9
239000000853 adhesive Substances 0.000 description 7
230000001070 adhesive effect Effects 0.000 description 7
238000010586 diagram Methods 0.000 description 6
238000000465 moulding Methods 0.000 description 6
230000000694 effects Effects 0.000 description 5
239000004065 semiconductor Substances 0.000 description 4
238000011990 functional testing Methods 0.000 description 3
238000004519 manufacturing process Methods 0.000 description 3
238000005516 engineering process Methods 0.000 description 2
238000007689 inspection Methods 0.000 description 2
239000004593 Epoxy Substances 0.000 description 1
238000005266 casting Methods 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
230000007547 defect Effects 0.000 description 1
230000002950 deficient Effects 0.000 description 1
239000011521 glass Substances 0.000 description 1
WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
230000002093 peripheral effect Effects 0.000 description 1
238000000206 photolithography Methods 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1

Landscapes

Testing Of Individual Semiconductor Devices (AREA)
Measuring Leads Or Probes (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)

JP2322687A 1987-02-03 1987-02-03 プロ−ブ針の組立て方法 Granted JPS63192246A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP2322687A JPS63192246A (ja)	1987-02-03	1987-02-03	プロ−ブ針の組立て方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2322687A JPS63192246A (ja)	1987-02-03	1987-02-03	プロ−ブ針の組立て方法

Publications (2)

Publication Number	Publication Date
JPS63192246A JPS63192246A (ja)	1988-08-09
JPH0583181B2 true JPH0583181B2 ( )	1993-11-25

Family

ID=12104717

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2322687A Granted JPS63192246A (ja)	1987-02-03	1987-02-03	プロ−ブ針の組立て方法

Country Status (1)

Country	Link
JP (1)	JPS63192246A ( )

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10143173A1 (de) *	2000-12-04	2002-06-06	Cascade Microtech Inc	Wafersonde

1987
- 1987-02-03 JP JP2322687A patent/JPS63192246A/ja active Granted

Also Published As

Publication number	Publication date
JPS63192246A (ja)	1988-08-09

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