JPH058580B2 - - Google Patents
Info
- Publication number
- JPH058580B2 JPH058580B2 JP59252667A JP25266784A JPH058580B2 JP H058580 B2 JPH058580 B2 JP H058580B2 JP 59252667 A JP59252667 A JP 59252667A JP 25266784 A JP25266784 A JP 25266784A JP H058580 B2 JPH058580 B2 JP H058580B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- cut pieces
- resist ink
- boundary
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/04—Manufacture or treatment of leadframes
- H10W70/042—Etching
Landscapes
- ing And Chemical Polishing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59252667A JPS61131473A (ja) | 1984-11-29 | 1984-11-29 | エツチングによるリ−ドフレ−ムパタ−ンの形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59252667A JPS61131473A (ja) | 1984-11-29 | 1984-11-29 | エツチングによるリ−ドフレ−ムパタ−ンの形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61131473A JPS61131473A (ja) | 1986-06-19 |
| JPH058580B2 true JPH058580B2 (2) | 1993-02-02 |
Family
ID=17240552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59252667A Granted JPS61131473A (ja) | 1984-11-29 | 1984-11-29 | エツチングによるリ−ドフレ−ムパタ−ンの形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61131473A (2) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6217187A (ja) * | 1985-07-17 | 1987-01-26 | Hitachi Cable Ltd | リ−ドフレ−ムの製造方法 |
-
1984
- 1984-11-29 JP JP59252667A patent/JPS61131473A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61131473A (ja) | 1986-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4371422A (en) | Continuous processing of printed circuit boards | |
| JPH07180089A (ja) | 電気鍍金方法及び構成 | |
| US4427019A (en) | Chemical process apparatus | |
| US4155775A (en) | Cleaning of high aspect ratio through holes in multilayer printed circuit boards | |
| JPH058580B2 (2) | ||
| US5904863A (en) | Process for etching trace side walls | |
| US8062580B2 (en) | Apparatus for recycling metal from metal ions containing waste solution | |
| US5554412A (en) | Solder spray leveller | |
| JPS61166134A (ja) | 処理装置 | |
| CA1231595A (en) | Apparatus and process for treating printed circuit boards | |
| JPH0533819B2 (2) | ||
| CN114686884B (zh) | 一种精密防侧蚀的蚀刻区域控制方法 | |
| JPH1012529A (ja) | レジスト現像方法およびレジスト現像装置 | |
| JPH0545676B2 (2) | ||
| JPS5610368A (en) | Method and device for immersion coating | |
| JP5087786B2 (ja) | フォトエッチングにおけるフォトレジストの除去方法及び装置 | |
| JP4626062B2 (ja) | 基板処理装置及び基板処理方法 | |
| JP2006239501A (ja) | 薬液処理装置 | |
| JPH0530849Y2 (2) | ||
| JPS6338954Y2 (2) | ||
| JP4877498B2 (ja) | 配線基板の製造方法及び製造装置 | |
| JPH0444321A (ja) | 基板運搬用キャリヤ | |
| KR20230132409A (ko) | 도금 장치 | |
| JPH01207181A (ja) | 印刷回路板の洗浄方法 | |
| JP4027007B2 (ja) | 電子部品実装用フィルムキャリアテープの液処理装置および電子部品実装用フィルムキャリアテープ液処理方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |