JPH058867B2 - - Google Patents

Info

Publication number
JPH058867B2
JPH058867B2 JP62011207A JP1120787A JPH058867B2 JP H058867 B2 JPH058867 B2 JP H058867B2 JP 62011207 A JP62011207 A JP 62011207A JP 1120787 A JP1120787 A JP 1120787A JP H058867 B2 JPH058867 B2 JP H058867B2
Authority
JP
Japan
Prior art keywords
transistor
output power
current
chip
transistors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62011207A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62179140A (ja
Inventor
Raian Deshazo Junia Toomasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS62179140A publication Critical patent/JPS62179140A/ja
Publication of JPH058867B2 publication Critical patent/JPH058867B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H5/00Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
    • H02H5/04Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
    • H02H5/044Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature using a semiconductor device to sense the temperature
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08Modifications for protecting switching circuit against overcurrent or overvoltage
    • H03K17/082Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
    • H03K17/0826Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in bipolar transistor switches
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10Integrated device layouts
    • H10D89/105Integrated device layouts adapted for thermal considerations
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08Modifications for protecting switching circuit against overcurrent or overvoltage
    • H03K2017/0806Modifications for protecting switching circuit against overcurrent or overvoltage against excessive temperature

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
JP62011207A 1986-01-22 1987-01-20 モノリシツク集積回路 Granted JPS62179140A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US820808 1986-01-22
US06/820,808 US4779161A (en) 1986-01-22 1986-01-22 Multi-driver integrated circuit

Publications (2)

Publication Number Publication Date
JPS62179140A JPS62179140A (ja) 1987-08-06
JPH058867B2 true JPH058867B2 (2) 1993-02-03

Family

ID=25231769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62011207A Granted JPS62179140A (ja) 1986-01-22 1987-01-20 モノリシツク集積回路

Country Status (2)

Country Link
US (1) US4779161A (2)
JP (1) JPS62179140A (2)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5140394A (en) * 1988-07-26 1992-08-18 Texas Instruments Incorporated Electrothermal sensor apparatus
DE58907001D1 (de) * 1989-04-20 1994-03-24 Siemens Ag Schaltungsanordnung zur Temperaturüberwachung von in einem Halbleiterschaltkreis integrierten Leistungsschalttransistoren.
US5099381A (en) * 1989-11-08 1992-03-24 National Semiconductor Corporation Enable circuit with embedded thermal turn-off
US4970497A (en) * 1989-11-22 1990-11-13 Westinghouse Electric Corp. Method and apparatus for sensing thermal stress in integrated circuits
US5073838A (en) * 1989-12-04 1991-12-17 Ncr Corporation Method and apparatus for preventing damage to a temperature-sensitive semiconductor device
US5249141A (en) * 1990-10-24 1993-09-28 Astec America, Inc. Method and apparatus for maintaining an active device below a maximum safe operating temperature
US5546041A (en) * 1993-08-05 1996-08-13 Massachusetts Institute Of Technology Feedback sensor circuit
US7216064B1 (en) * 1993-09-21 2007-05-08 Intel Corporation Method and apparatus for programmable thermal sensor for an integrated circuit
US5422832A (en) * 1993-12-22 1995-06-06 Advanced Micro Devices Variable thermal sensor
US5959464A (en) * 1996-09-03 1999-09-28 Motorola Inc. Loss-less load current sensing driver and method therefor
SE511337C2 (sv) * 1996-11-08 1999-09-13 Ericsson Telefon Ab L M Anordning för att skydda sluttransistorerna i en effektförstärkare
US6055489A (en) * 1997-04-15 2000-04-25 Intel Corporation Temperature measurement and compensation scheme
US5902044A (en) * 1997-06-27 1999-05-11 International Business Machines Corporation Integrated hot spot detector for design, analysis, and control
US6363490B1 (en) 1999-03-30 2002-03-26 Intel Corporation Method and apparatus for monitoring the temperature of a processor
US6789037B2 (en) * 1999-03-30 2004-09-07 Intel Corporation Methods and apparatus for thermal management of an integrated circuit die
US6393374B1 (en) 1999-03-30 2002-05-21 Intel Corporation Programmable thermal management of an integrated circuit die
US6137165A (en) * 1999-06-25 2000-10-24 International Rectifier Corp. Hybrid package including a power MOSFET die and a control and protection circuit die with a smaller sense MOSFET
US7263567B1 (en) 2000-09-25 2007-08-28 Intel Corporation Method and apparatus for lowering the die temperature of a microprocessor and maintaining the temperature below the die burn out
US6861739B1 (en) * 2001-05-15 2005-03-01 Lsi Logic Corporation Minimum metal consumption power distribution network on a bonded die
US6786639B2 (en) * 2002-08-30 2004-09-07 International Business Machines Corporation Device for sensing temperature of an electronic chip
DE10332513A1 (de) * 2003-07-17 2005-02-03 Robert Bosch Gmbh Halbleiterbauelement mit integriertem Übertemperaturschutz
JP4044027B2 (ja) * 2003-10-27 2008-02-06 松下電器産業株式会社 関数発生回路および関数発生回路の温度特性調整方法
US7406397B2 (en) * 2004-09-02 2008-07-29 International Business Machines Corporation Self heating monitor for SiGe and SOI CMOS devices
US7135748B2 (en) * 2004-10-26 2006-11-14 Power Integrations, Inc. Integrated circuit with multi-length output transistor segment
US7800879B2 (en) * 2006-07-27 2010-09-21 Agere Systems Inc. On-chip sensor array for temperature management in integrated circuits
US8169764B2 (en) * 2009-02-20 2012-05-01 Apple Inc. Temperature compensation in integrated circuit
US8064197B2 (en) * 2009-05-22 2011-11-22 Advanced Micro Devices, Inc. Heat management using power management information
JP5921055B2 (ja) * 2010-03-08 2016-05-24 ルネサスエレクトロニクス株式会社 半導体装置
US9006000B2 (en) * 2012-05-03 2015-04-14 Sandisk Technologies Inc. Tj temperature calibration, measurement and control of semiconductor devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5236484A (en) * 1975-09-17 1977-03-19 Matsushita Electronics Corp Semiconductor integrated circuit
US4553048A (en) * 1984-02-22 1985-11-12 Motorola, Inc. Monolithically integrated thermal shut-down circuit including a well regulated current source
US4667265A (en) * 1985-12-20 1987-05-19 National Semiconductor Corporation Adaptive thermal shutdown circuit

Also Published As

Publication number Publication date
US4779161A (en) 1988-10-18
JPS62179140A (ja) 1987-08-06

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