JPH0590003A - Chip resistor - Google Patents
Chip resistorInfo
- Publication number
- JPH0590003A JPH0590003A JP3278433A JP27843391A JPH0590003A JP H0590003 A JPH0590003 A JP H0590003A JP 3278433 A JP3278433 A JP 3278433A JP 27843391 A JP27843391 A JP 27843391A JP H0590003 A JPH0590003 A JP H0590003A
- Authority
- JP
- Japan
- Prior art keywords
- chip resistor
- resistor
- resistance
- insulating member
- members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000002093 peripheral effect Effects 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 6
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
- Details Of Resistors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、チップ抵抗器に係り、
特に高密度実装回路に好適な角型チップ抵抗器に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip resistor,
Particularly, the present invention relates to a rectangular chip resistor suitable for a high-density mounting circuit.
【0002】[0002]
【従来の技術】近年、電子機器の小型化,高機能化に伴
い電子機器を構成する回路の実装密度も加速的に上昇
し、これに対応して、回路に使用される固定抵抗器も小
型のチップ抵抗器が数多く用いられている。2. Description of the Related Art In recent years, with the miniaturization and higher functionality of electronic equipment, the packaging density of the circuits that make up the electronic equipment has increased at an accelerating pace. Many chip resistors are used.
【0003】従来例の小型の角型チップ抵抗器の断面を
図3に示す。図3において、角チップ状のアルミナセラ
ミックス基板111の一方の上面の左右の両端部にスク
リーン印刷法等により、まず表面電極114,114A
が形成され、次に、アルミナセラミックス基板111の
上面中央に左右の表面電極114,114Aと接続する
酸化ルテニウム系抵抗体112が形成されている。さら
に、表面電極114,114Aの上部からアルミナセラ
ミックス基板111の両端部をコ字状の電極115,1
15Aが設けられ、この電極115,115Aの間に位
置する酸化ルテニウム系抵抗体112上部には、抵抗体
保護用の保護ガラス層113が配設された構成となって
いる。A cross section of a conventional small-sized rectangular chip resistor is shown in FIG. In FIG. 3, the surface electrodes 114, 114A are first formed on both left and right ends of one upper surface of the square chip-shaped alumina ceramic substrate 111 by a screen printing method or the like.
Then, a ruthenium oxide-based resistor 112 connected to the left and right surface electrodes 114 and 114A is formed in the center of the upper surface of the alumina ceramic substrate 111. Further, both ends of the alumina ceramic substrate 111 are connected to the U-shaped electrodes 115, 1 from the upper portions of the surface electrodes 114, 114A.
15A is provided, and a protective glass layer 113 for protecting the resistor is arranged above the ruthenium oxide-based resistor 112 located between the electrodes 115 and 115A.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、従来例
の従来例の角チップ抵抗器では、小型化が進むことによ
り抵抗体の形成面積も比例して減少するため、これに伴
って角チップ抵抗器の許容する電力容量も低下し、極小
サイズの1005チップ[外形寸法1.0mmX0.5mm]で
は、抵抗体の大きさが0.5X0.3[mm]程度であり、この
ため、1005チップでは、1/32[W]の容量が限界で
あった。また、抵抗体の小型化は、抵抗体も小型化する
ため、使用環境の変化(温度変化)が抵抗値の精度に大
きく影響するという不都合もあった。However, in the conventional square chip resistor of the conventional example, the area where the resistor is formed is reduced in proportion to the progress of miniaturization, and accordingly, the square chip resistor is also reduced. The power capacity tolerated by is also reduced, and the size of the resistor is about 0.5X0.3 [mm] in the ultra-small size 1005 chip [outside dimension 1.0mmX0.5mm]. The capacity of 32 [W] was the limit. Further, miniaturization of the resistor also causes miniaturization of the resistor, so that there is also a disadvantage that a change in operating environment (temperature change) greatly affects the accuracy of the resistance value.
【0005】[0005]
【発明の目的】本発明は、かかる従来例の有する不都合
を改善し、特に、電力容量を増加することが可能な角チ
ップ抵抗器を提供することを、その目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a square chip resistor capable of improving the disadvantages of the conventional example and, in particular, increasing the power capacity.
【0006】[0006]
【課題を解決するたるの手段】本発明では、絶縁部材の
両面部に抵抗部材を配設し、当該抵抗部材を並列に接続
すると共に,この抵抗部材の入力段と出力段とを構成す
る端子部材を絶縁部材の外周部に装備する、等の構成を
採っている。これによって前述した目的を達成しようと
するものである。According to the present invention, a resistance member is provided on both sides of an insulating member, the resistance members are connected in parallel, and terminals forming an input stage and an output stage of the resistance member are provided. The structure is such that the member is provided on the outer peripheral portion of the insulating member. This aims to achieve the above-mentioned object.
【0007】[0007]
【作用】絶縁部材の両面に配設された抵抗部材が、並列
回路に構成されている。Function: The resistance members arranged on both sides of the insulating member are formed in a parallel circuit.
【0008】[0008]
【第1実施例】以下、本発明の一実施例を図1に基づい
て説明する。図1には、本実施例に係る角チップ抵抗器
の断面が示されている。同図において、符号1には角チ
ップ抵抗器の母体となる長方形でチップ状のアルミナセ
ラミックス基板が示されている。このアルミナセラミッ
クス基板1の上下両面の両端部に、スクリーン印刷法等
によって、まず表面電極4A,4Bと4C,4Dとを形
成し、次に、この表面電極4A,4B,と4C,4Dと
に係合するように酸化ルテニウム系の厚膜抵抗体2,2
Aをアルミナセラミックス基板1の上下面中央部に形成
している。[First Embodiment] An embodiment of the present invention will be described below with reference to FIG. FIG. 1 shows a cross section of a square chip resistor according to this embodiment. In the figure, reference numeral 1 indicates a rectangular chip-shaped alumina ceramics substrate which is the base of a square chip resistor. Surface electrodes 4A, 4B and 4C, 4D are first formed on both ends of the upper and lower surfaces of the alumina ceramics substrate 1 by a screen printing method or the like, and then, the surface electrodes 4A, 4B, 4C, 4D are formed. Ruthenium oxide-based thick film resistors 2, 2 to engage
A is formed in the center of the upper and lower surfaces of the alumina ceramic substrate 1.
【0009】また、表面電極4A,4B,と4C,4D
の上部からアルミナセラミックス基板1の両端部を挾持
するコ字状の電極5,5Aが設けられている。このた
め、アルミナセラミックス基板1の上下両面に形成され
た厚膜抵抗体2,2Aは、電極5,5Aにより並列に接
続されたものとなっている。そして、この電極5,5A
の間に配設された酸化ルテニウム系抵抗体2,2Aに
は、抵抗体保護用の保護ガラス層3,3Aが配設された
構成となっている。Further, the surface electrodes 4A, 4B, and 4C, 4D
There are provided U-shaped electrodes 5 and 5A for holding both ends of the alumina ceramics substrate 1 from above. Therefore, the thick film resistors 2 and 2A formed on the upper and lower surfaces of the alumina ceramic substrate 1 are connected in parallel by the electrodes 5 and 5A. And this electrode 5, 5A
The ruthenium oxide type resistors 2 and 2A disposed between the two are provided with protective glass layers 3 and 3A for protecting the resistors.
【0010】[0010]
【第2実施例】ここで、第2実施例を図2に基づいて説
明する。また、同一構成部材については、同一符号を用
いることとする。図2には、本実施例に係る角チップ抵
抗器の断面が示されている。同図において、この実施例
に係る角チップ抵抗器は、前述した第1実施例のものと
同一の構成をとっているが、アルミナセラミックス基板
1の両面に形成する厚膜抵抗体10,11に、それぞれ
の温度特性が正,負逆特性の抵抗体を用いたことに特長
を持っている。これによると、厚膜抵抗体10,11と
が並列した抵抗値は、温度特性が正の抵抗体10と負逆
特性の抵抗体11とを用いたことから温度変化による抵
抗値の変化が互いに相殺されるため、温度変化に対して
狂いの少ない小型のチップ抵抗器を提供できる。[Second Embodiment] A second embodiment will now be described with reference to FIG. Further, the same reference numerals are used for the same constituent members. FIG. 2 shows a cross section of the square chip resistor according to the present embodiment. In the figure, the square chip resistor according to this embodiment has the same configuration as that of the first embodiment described above, except that the thick film resistors 10 and 11 formed on both surfaces of the alumina ceramic substrate 1 have the same structure. The characteristic is that it uses a resistor whose temperature characteristics are positive and negative. According to this, the resistance values in which the thick film resistors 10 and 11 are arranged in parallel are different from each other due to the temperature change because the resistor 10 having a positive temperature characteristic and the resistor 11 having a negative and negative characteristic are used. Since they cancel each other out, it is possible to provide a small chip resistor that is less prone to temperature changes.
【0011】尚、上記実施例において、アルミナセラミ
ックス基板の二つの面上に厚膜抵抗体を形成したものに
ついて説明したが、必ずしもこれに限定されるものでは
なく、他の面上にも厚膜抵抗体を形成しても良い。Although the thick film resistors are formed on the two surfaces of the alumina ceramic substrate in the above embodiment, the present invention is not limited to this, and the thick film resistors are also formed on the other surfaces. A resistor may be formed.
【0012】[0012]
【発明の効果】本発明は、以上のように構成され機能す
るので、これによると、絶縁部材の両面部に抵抗部材を
配設し、当該抵抗部材を並列に接続すると共に,この抵
抗部材の入力段と出力段とを構成する端子部材を絶縁部
材の外周部に装備する、等の構成を採ったことから、絶
縁部材としてのアルミナセラミックス基板に抵抗部材と
しての酸化ルテニウム系厚膜抵抗体を並列接続して構成
している。これにより、二つの抵抗材の抵抗値が等しい
場合、チップ抵抗器の電力容量が二倍となり、従来チッ
プ抵抗器を二個並列して使用していた回路部のチップ抵
抗器が一つで済むため、この回路部の一方のチップ抵抗
器並びに、この抵抗器の配線部分が不要となり、チップ
抵抗器の専有面積が従来の半分以下となる。従って、回
路基板の小型化が有効に図れるという従来例にない優れ
たチップ抵抗器を提供することができる。Since the present invention is constructed and functions as described above, according to this, a resistance member is provided on both surface portions of the insulating member, the resistance members are connected in parallel, and Since the terminal member constituting the input stage and the output stage is provided on the outer peripheral portion of the insulating member, the alumina ceramic substrate as the insulating member is provided with the ruthenium oxide-based thick film resistor as the resistive member. It is configured by connecting in parallel. As a result, when the resistance values of the two resistance materials are the same, the power capacity of the chip resistor is doubled, and only one chip resistor in the circuit section, which used two chip resistors in parallel, is sufficient. Therefore, one chip resistor of this circuit portion and the wiring portion of this resistor are unnecessary, and the area occupied by the chip resistor is less than half of the conventional area. Therefore, it is possible to provide an excellent chip resistor that does not exist in the prior art and that effectively downsizes the circuit board.
【図1】本発明の一実施例を示す断面図FIG. 1 is a sectional view showing an embodiment of the present invention.
【図2】他の実施例を示す断面図FIG. 2 is a cross-sectional view showing another embodiment.
【図3】従来例を示す説明図である。FIG. 3 is an explanatory diagram showing a conventional example.
1 絶縁部材としてのアルミナセラミックス基板 2,2A 抵抗部材としての酸化ルテニウム系厚膜抵抗
体 5,5A 端子部材としての端面電極1 Alumina ceramics substrate as an insulating member 2, 2A Ruthenium oxide-based thick film resistor as a resistive member 5, 5A End face electrode as a terminal member
Claims (2)
この当該抵抗部材を並列に接続すると共に,当該抵抗部
材の入力段と出力段とを構成する端子部材を前記絶縁部
材の外周部に装備したことを特徴とするチップ抵抗器。1. A resistance member is provided on both sides of the insulating member,
A chip resistor, characterized in that the resistance members are connected in parallel, and a terminal member constituting an input stage and an output stage of the resistance member is provided on an outer peripheral portion of the insulating member.
異なる部材を用いて構成したことを特徴とする請求項1
記載のチップ抵抗器。2. The resistance member is formed by using members having different resistance temperature characteristics from each other.
The listed chip resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3278433A JPH0590003A (en) | 1991-09-30 | 1991-09-30 | Chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3278433A JPH0590003A (en) | 1991-09-30 | 1991-09-30 | Chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0590003A true JPH0590003A (en) | 1993-04-09 |
Family
ID=17597281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3278433A Withdrawn JPH0590003A (en) | 1991-09-30 | 1991-09-30 | Chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0590003A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003044809A1 (en) * | 2001-11-15 | 2003-05-30 | Vishay Intertechnology, Inc. | Surge current chip resistor |
| EP1051713A4 (en) * | 1998-02-06 | 2006-05-24 | Caddock Electronics Inc | Low-resistance, high-power resistor having a tight resistance tolerance despite variations in the circuit connections to the contacts |
| JP2007194399A (en) * | 2006-01-19 | 2007-08-02 | Matsushita Electric Ind Co Ltd | Chip resistor and manufacturing method thereof |
| JP2015070166A (en) * | 2013-09-30 | 2015-04-13 | コーア株式会社 | Chip resistor and method for manufacturing the same |
-
1991
- 1991-09-30 JP JP3278433A patent/JPH0590003A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1051713A4 (en) * | 1998-02-06 | 2006-05-24 | Caddock Electronics Inc | Low-resistance, high-power resistor having a tight resistance tolerance despite variations in the circuit connections to the contacts |
| WO2003044809A1 (en) * | 2001-11-15 | 2003-05-30 | Vishay Intertechnology, Inc. | Surge current chip resistor |
| GB2396749A (en) * | 2001-11-15 | 2004-06-30 | Vishay Intertechnology Inc | Surge current chip resistor |
| US6873028B2 (en) | 2001-11-15 | 2005-03-29 | Vishay Intertechnology, Inc. | Surge current chip resistor |
| GB2396749B (en) * | 2001-11-15 | 2005-09-21 | Vishay Intertechnology Inc | Surge current chip resistor |
| JP2007194399A (en) * | 2006-01-19 | 2007-08-02 | Matsushita Electric Ind Co Ltd | Chip resistor and manufacturing method thereof |
| JP2015070166A (en) * | 2013-09-30 | 2015-04-13 | コーア株式会社 | Chip resistor and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981203 |