JPH06155063A - レーザー切断方法 - Google Patents

レーザー切断方法

Info

Publication number: JPH06155063A
Authority: JP; Japan
Prior art keywords: laser; cut; cutting; focus position; speed
Prior art date: 1992-11-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP4339784A

Other languages

English (en)

Japanese (ja)

Inventor

Yasuji Yoshizumi

安二吉住

Akihiko Inoue

昭彦井上

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Electric Corp

Original Assignee

Mitsubishi Electric Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1992-11-25

Filing date

1992-11-25

Publication date

1994-06-03

1992-11-25 Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp

1992-11-25 Priority to JP4339784A priority Critical patent/JPH06155063A/ja

1993-11-25 Priority to FR9314110A priority patent/FR2698302B1/fr

1993-11-25 Priority to PT101412A priority patent/PT101412B/pt

1994-06-03 Publication of JPH06155063A publication Critical patent/JPH06155063A/ja

Status Pending legal-status Critical Current

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Landscapes

Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Engineering & Computer Science (AREA)
Plasma & Fusion (AREA)
Mechanical Engineering (AREA)
Laser Beam Processing (AREA)

JP4339784A 1992-11-25 1992-11-25 レーザー切断方法 Pending JPH06155063A (ja)

Priority Applications (3)

Application Number	Priority Date	Filing Date	Title
JP4339784A JPH06155063A (ja)	1992-11-25	1992-11-25	レーザー切断方法
FR9314110A FR2698302B1 (fr)	1992-11-25	1993-11-25	Méthode de découpage par laser.
PT101412A PT101412B (pt)	1992-11-25	1993-11-25	Processo de corte por laser

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP4339784A JPH06155063A (ja)	1992-11-25	1992-11-25	レーザー切断方法

Publications (1)

Publication Number	Publication Date
JPH06155063A true JPH06155063A (ja)	1994-06-03

Family

ID=18330781

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP4339784A Pending JPH06155063A (ja)	1992-11-25	1992-11-25	レーザー切断方法

Country Status (3)

Country	Link
JP (1)	JPH06155063A (pt)
FR (1)	FR2698302B1 (pt)
PT (1)	PT101412B (pt)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6677553B2 (en) *	1999-08-06	2004-01-13	Hitachi, Ltd.	Laser processing apparatus
CN102205469A (zh) *	2010-03-31	2011-10-05	深圳市先阳软件技术有限公司	一种对电池极片进行激光切割的控制方法及系统
US20120031883A1 (en) *	2009-05-25	2012-02-09	Mitsubishi Electric Corporation	Laser machining device and laser machining method
JP2012192415A (ja) *	2011-03-15	2012-10-11	Disco Corp	レーザー加工装置
CN104148817A (zh) *	2014-07-30	2014-11-19	苏州市华宁机械制造有限公司	激光切割机
JP2017051965A (ja) *	2015-09-08	2017-03-16	株式会社アマダホールディングス	レーザ加工方法およびレーザ加工装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5990444A (en) *	1995-10-30	1999-11-23	Costin; Darryl J.	Laser method and system of scribing graphics
US6685868B2 (en)	1995-10-30	2004-02-03	Darryl Costin	Laser method of scribing graphics
US6252196B1 (en)	1996-10-11	2001-06-26	Technolines Llc	Laser method of scribing graphics
US6140602A (en) *	1997-04-29	2000-10-31	Technolines Llc	Marking of fabrics and other materials using a laser
US7424783B2 (en)	2003-06-30	2008-09-16	Nike, Inc.	Article of apparel incorporating a stratified material
US7065820B2 (en)	2003-06-30	2006-06-27	Nike, Inc.	Article and method for laser-etching stratified materials
US7238912B2 (en)	2003-10-07	2007-07-03	Midwest Research Institute	Wafer characteristics via reflectometry and wafer processing apparatus and method
DE102011100735B4 (de)	2011-05-06	2019-12-05	Faurecia Autositze Gmbh	Verfahren zum Herstellen eines Zahnrades und hierdurch hergestelltes Zahnrad
CN103962727B (zh) *	2013-01-28	2018-03-02	深圳市裕展精密科技有限公司	蓝宝石切割装置
CN106964907A (zh) *	2017-04-25	2017-07-21	重庆邮电大学	一种激光切割的方法和设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57181786A (en) *	1981-04-28	1982-11-09	Amada Eng & Service	Laser working method
JPS63108984A (ja) *	1986-10-24	1988-05-13	Mitsubishi Electric Corp	レ−ザ加工方法
JPH0199790A (ja) *	1987-10-12	1989-04-18	Mitsubishi Electric Corp	ドロスが付着しやすい材料のレーザ切断法
JPH04190987A (ja) *	1990-11-26	1992-07-09	Murata Mach Ltd	レーザ加工機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4078165A (en) *	1976-05-03	1978-03-07	Grumman Aerospace Corporation	Semi-automatic feed laser apparatus
JPS61123493A (ja) *	1984-11-20	1986-06-11	Mitsubishi Electric Corp	レ−ザ加工装置
JPS62240184A (ja) *	1986-04-14	1987-10-20	Mitsubishi Electric Corp	電気機器用絶縁物の切削方法
DE3733568A1 (de) *	1987-10-03	1989-04-20	Thyssen Industrie	Verfahren zur herstellung von schweissverbindungen an karosserieteilen und anderen blechteilen und robotersystem
JPH03258479A (ja) *	1990-03-06	1991-11-18	Mitsubishi Electric Corp	レーザ加工装置

1992
- 1992-11-25 JP JP4339784A patent/JPH06155063A/ja active Pending
1993
- 1993-11-25 FR FR9314110A patent/FR2698302B1/fr not_active Expired - Fee Related
- 1993-11-25 PT PT101412A patent/PT101412B/pt not_active IP Right Cessation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57181786A (en) *	1981-04-28	1982-11-09	Amada Eng & Service	Laser working method
JPS63108984A (ja) *	1986-10-24	1988-05-13	Mitsubishi Electric Corp	レ−ザ加工方法
JPH0199790A (ja) *	1987-10-12	1989-04-18	Mitsubishi Electric Corp	ドロスが付着しやすい材料のレーザ切断法
JPH04190987A (ja) *	1990-11-26	1992-07-09	Murata Mach Ltd	レーザ加工機

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6677553B2 (en) *	1999-08-06	2004-01-13	Hitachi, Ltd.	Laser processing apparatus
US20120031883A1 (en) *	2009-05-25	2012-02-09	Mitsubishi Electric Corporation	Laser machining device and laser machining method
CN102205469A (zh) *	2010-03-31	2011-10-05	深圳市先阳软件技术有限公司	一种对电池极片进行激光切割的控制方法及系统
JP2012192415A (ja) *	2011-03-15	2012-10-11	Disco Corp	レーザー加工装置
CN104148817A (zh) *	2014-07-30	2014-11-19	苏州市华宁机械制造有限公司	激光切割机
JP2017051965A (ja) *	2015-09-08	2017-03-16	株式会社アマダホールディングス	レーザ加工方法およびレーザ加工装置

Also Published As

Publication number	Publication date
FR2698302B1 (fr)	1995-04-14
PT101412B (pt)	2000-02-29
PT101412A (pt)	1994-09-30
FR2698302A1 (fr)	1994-05-27

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