JPH06260732A - Electrical copper clad board - Google Patents
Electrical copper clad boardInfo
- Publication number
- JPH06260732A JPH06260732A JP4114593A JP4114593A JPH06260732A JP H06260732 A JPH06260732 A JP H06260732A JP 4114593 A JP4114593 A JP 4114593A JP 4114593 A JP4114593 A JP 4114593A JP H06260732 A JPH06260732 A JP H06260732A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- dried
- impregnated
- weight
- kraft paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract description 7
- 229910052802 copper Inorganic materials 0.000 title abstract description 4
- 239000010949 copper Substances 0.000 title abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 28
- -1 cresyl phenyl phosphate Chemical compound 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 7
- 239000011574 phosphorus Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002655 kraft paper Substances 0.000 abstract description 9
- 239000005011 phenolic resin Substances 0.000 abstract description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 6
- 239000003063 flame retardant Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 4
- 229920001568 phenolic resin Polymers 0.000 abstract description 4
- 239000012790 adhesive layer Substances 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract description 3
- 235000010678 Paulownia tomentosa Nutrition 0.000 abstract description 2
- 240000002834 Paulownia tomentosa Species 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000001035 drying Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 5
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- YAOMHRRYSRRRKP-UHFFFAOYSA-N 1,2-dichloropropyl 2,3-dichloropropyl 3,3-dichloropropyl phosphate Chemical compound ClC(Cl)CCOP(=O)(OC(Cl)C(Cl)C)OCC(Cl)CCl YAOMHRRYSRRRKP-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- YAFOVCNAQTZDQB-UHFFFAOYSA-N octyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCC)OC1=CC=CC=C1 YAFOVCNAQTZDQB-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- XHGIFBQQEGRTPB-UHFFFAOYSA-N tris(prop-2-enyl) phosphate Chemical compound C=CCOP(=O)(OCC=C)OCC=C XHGIFBQQEGRTPB-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電気機器、電子機器、計
算機、通信機器等に用いられる電気用積層板に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric laminate used in electric equipment, electronic equipment, computers, communication equipment and the like.
【０００２】[0002]
【従来の技術】近年、電気機器等に用いられる電気用積
層板には安全面で難燃性が強く要望されている。従来は
この対策として臭素等のハロゲン含有化合物が添加され
ていたが衛生面でハロゲン含有化合物の添加が規制され
はじめた。このため燐化合物含有樹脂を基材に含浸して
いるが含浸性が悪く、先ず１次含浸樹脂は難燃剤を含ま
ない低粘度樹脂を含浸させ、次いで難燃剤を含有する高
粘度樹脂を含浸しているのが現状である。しかし難燃性
は基材に近い位置に難燃剤が存在してこそ効果が大きく
なるもので、基材表面が樹脂で被覆されている現状では
難燃性が充分発揮されていない。2. Description of the Related Art In recent years, flame retardancy has been strongly demanded from the viewpoint of safety for electric laminates used in electric equipment and the like. Conventionally, a halogen-containing compound such as bromine was added as a countermeasure against this, but the addition of the halogen-containing compound has begun to be regulated in terms of hygiene. For this reason, the base material is impregnated with the phosphorus compound-containing resin, but the impregnating property is poor. First, the primary impregnation resin is impregnated with a low-viscosity resin containing no flame retardant, and then with a high-viscosity resin containing a flame retardant. Is the current situation. However, the flame retardancy becomes great only when the flame retardant is present in a position close to the base material, and the flame retardancy is not sufficiently exhibited under the present circumstances where the surface of the base material is coated with a resin.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに従来の難燃性電気用積層板はその効果を充分に発揮
していない。本発明は従来の技術における上述の問題点
に鑑みてなされたもので、その目的とするところは難燃
性に優れた電気用積層板を提供することにある。As described in the prior art, the conventional flame-retardant electrical laminate has not been sufficiently effective. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide an electrical laminate having excellent flame retardancy.
【０００４】[0004]
【課題を解決するための手段】本発明は基材に燐化合物
含有樹脂溶液を含浸、乾燥後、所要回数樹脂を含浸、乾
燥した所要枚数の樹脂含浸基材の上面及び又は下面に金
属箔を配設ー体化したことを特徴とする電気用積層板の
ため、基材表面を難燃剤で被覆でき上記目的を達成する
ことができたもので以下本発明を詳細に説明する。According to the present invention, a substrate is impregnated with a phosphorus compound-containing resin solution, dried, and then impregnated with resin a required number of times, and a metal foil is provided on the upper surface and / or the lower surface of a required number of dried resin-impregnated substrates. The present invention will be described in detail below, because it is a laminated board for electric use characterized by being arranged and formed, and the surface of the base material can be coated with a flame retardant and the above object can be achieved.
【０００５】本発明に用いる基材としてはガラス、アス
ベスト等の無機質繊維、ポリエステル、ポリアミド、ポ
リアクリル、ポリビニルアルコール、ポリイミド、フッ
素樹脂等の有機質繊維、木綿等の天然繊維の織布、不織
布、紙を用いることができるが、好ましくはクラフト
紙、リンター紙のような紙を用いることがセルロースと
燐化合物との脱水反応による吸熱効果を期待することが
でき望ましいことである。燐化合物としてはアルキルジ
アリルホスフェート、クレジルジフェニルホスフェー
ト、オクチルジフェニルホスフェート、トリアリルホス
フェート、トリブチルホスフェート、トリフェニルホス
フェート、トリス（βクロロエチル）ホスフェート、ト
リス（ジクロルプロピル）ホスフェート、トリス（２・
３ジブロムプロピル）ホスフェート、トリス（ブロム・
クロルプロピル）ホスフェート、トリオクチルホスフェ
ート、トリブトキシエチルホスフェート等の燐化合物全
般を用いることができる。燐化合物含有溶液は水を成分
の一部とする溶液であることが含浸性の点で好ましい。
燐化合物の量は基材に対し０．１〜２５重量％（以下単
に％と記す）であることが好ましい。即ち０．１％未満
では難燃性が向上し難く、２５％をこえると耐水性が低
下する傾向にあるからである。含浸樹脂としてはフェノ
−ル樹脂、不飽和ポリエステル樹脂、エポキシ樹脂、ポ
リイミド樹脂、ポリブタジエン樹脂、ポリフェニレンオ
キサイド樹脂、弗素樹脂等の単独、変性物、混合物の熱
硬化性樹脂、熱可塑性樹脂全般を用いることができ、必
要に応じてタルク、クレー、シリカ、炭酸カルシュウ
ム、水酸化アルミニゥム等の無機質粉末充填剤、ガラス
繊維、アスベスト繊維、パルプ繊維、合成繊維、セラミ
ック繊維等の繊維質充填剤を含有させることができる。
含浸樹脂は必要に応じて１次、２次というように同種、
異種の樹脂を複数回に分けて行うこともできる。金属箔
としては銅、アルミニュウム、真鍮、ニッケル、鉄等の
単独、合金、複合箔が用いられ必要に応じて金属箔の片
面に接着剤層を設けておくことができる。一体化の条件
は樹脂、基材、厚み等で硬化温度、硬化時間、成形圧力
を選択することができ、プレス工法、ダブルベルト成形
工法、マルチロール工法等の製造方法を用いることがで
きる。As the substrate used in the present invention, inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide and fluororesin, and natural fibers such as cotton, woven cloth, non-woven cloth and paper. However, it is desirable to use paper such as kraft paper and linter paper, because an endothermic effect due to a dehydration reaction between cellulose and a phosphorus compound can be expected. Examples of the phosphorus compound include alkyl diallyl phosphate, cresyl diphenyl phosphate, octyl diphenyl phosphate, triallyl phosphate, tributyl phosphate, triphenyl phosphate, tris (βchloroethyl) phosphate, tris (dichloropropyl) phosphate, tris (2.
3 dibromopropyl) phosphate, tris (bromo
All phosphorus compounds such as chloropropyl) phosphate, trioctylphosphate and tributoxyethylphosphate can be used. The phosphorus compound-containing solution is preferably a solution containing water as a part of the components from the viewpoint of impregnation property.
The amount of the phosphorus compound is preferably 0.1 to 25% by weight (hereinafter simply referred to as%) with respect to the base material. That is, if it is less than 0.1%, it is difficult to improve the flame retardancy, and if it exceeds 25%, the water resistance tends to decrease. As the impregnating resin, a phenol resin, an unsaturated polyester resin, an epoxy resin, a polyimide resin, a polybutadiene resin, a polyphenylene oxide resin, a fluororesin, etc. alone, a modified product, a thermosetting resin of a mixture, or a thermoplastic resin is generally used. Inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, etc., and fiber fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers, ceramic fibers, etc. may be added if necessary. You can
The impregnating resin is of the same type, such as primary and secondary, if necessary,
Different kinds of resins can be divided into a plurality of times. As the metal foil, copper, aluminum, brass, nickel, iron or the like alone, an alloy or a composite foil is used, and an adhesive layer can be provided on one side of the metal foil if necessary. As for the integration condition, the curing temperature, the curing time and the molding pressure can be selected depending on the resin, the base material, the thickness and the like, and the manufacturing method such as the press method, the double belt molding method and the multi-roll method can be used.
【０００６】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【０００７】[0007]
【実施例１】重量１２６ｇ／ｍ2 のクラフト紙に、クレ
ジルジフェニルホスフェートの５％水溶液を乾燥後付着
量が０．５％になるように含浸し、水分が８％になる迄
８５℃で乾燥後、樹脂量３５％の水溶性フェノ−ル樹脂
を乾燥後の樹脂量が１２％になるように含浸し、水分が
８％になる迄８５℃で乾燥後、樹脂量４５％の桐油変性
フェノ−ル樹脂を乾燥後全体樹脂量が５０％になるよう
に含浸し、１５５℃で乾燥して樹脂含浸基材を得た。次
に該樹脂含浸基材８枚を重ねた上下面に厚み０．０３５
ｍｍの接着剤層付銅箔を配した積層体を成形圧力１００
Ｋｇ／ｃｍ2 、１６０℃で６０分間加熱加圧成形して厚
み１．６ｍｍの両面銅張積層板を得た。Example 1 Kraft paper having a weight of 126 g / m 2 was impregnated with a 5% aqueous solution of cresyl diphenyl phosphate so as to have a deposition amount of 0.5% after drying, and the moisture content was adjusted to 85% at 85 ° C. After drying, a water-soluble phenolic resin having a resin content of 35% was impregnated so that the resin content after drying became 12%, and dried at 85 ° C until the water content became 8%, and then modified with tung oil having a resin content of 45%. After the phenol resin was dried, it was impregnated so that the total amount of the resin was 50%, and dried at 155 ° C. to obtain a resin-impregnated base material. Next, a thickness of 0.035 is applied to the upper and lower surfaces on which the eight resin-impregnated base materials are stacked.
mm pressure is applied to the laminated body in which the copper foil with the adhesive layer is arranged.
A double-sided copper-clad laminate having a thickness of 1.6 mm was obtained by heat and pressure molding at 160 ° C. for 60 minutes at Kg / cm 2 .
【０００８】[0008]
【実施例２】重量１２６ｇ／ｍ2 のクラフト紙に、クレ
ジルジフェニルホスフェートの２０％水溶液を乾燥後付
着量が２０％になるように含浸した以外は実施例１と同
様に処理して厚み１．６ｍｍの両面銅張積層板を得た。Example 2 A kraft paper having a weight of 126 g / m 2 was treated in the same manner as in Example 1 except that a 20% aqueous solution of cresyl diphenyl phosphate was impregnated so that the adhesion amount after drying was 20%. A 0.6 mm double-sided copper clad laminate was obtained.
【０００９】[0009]
【比施例】重量１２６ｇ／ｍ2 のクラフト紙に、樹脂量
３５％の水溶性フェノ−ル樹脂を乾燥後樹脂量が１５％
になるように含浸し、水分が２％になる迄１３５℃で乾
燥後、クレジルジフェニルホスフェートを３５％含有す
る桐油変性フェノ−ル樹脂をクレジルジフェニルホスフ
ェート付着量が２０％に、乾燥後樹脂量が５０％になる
ように含浸、乾燥した以外は実施例１と同様に処理して
厚み１．６ｍｍの両面銅張積層板を得た。[Comparative Example] A kraft paper having a weight of 126 g / m 2 was coated with a water-soluble phenolic resin having a resin content of 35% and the resin content was 15% after drying.
And then dried at 135 ° C until the water content becomes 2%, and then tung oil-modified phenol resin containing 35% cresyl diphenyl phosphate to 20% cresyl diphenyl phosphate adhesion and dried resin A double-sided copper-clad laminate having a thickness of 1.6 mm was obtained by the same treatment as in Example 1 except that the amount was 50% and the drying was performed.
【００１０】実施例１と２及び比較例の積層板の性能は
表１のようである。難燃性評価はＵＬ法に基づき単位は
秒である。Table 1 shows the performance of the laminated plates of Examples 1 and 2 and Comparative Example. The flame retardancy evaluation is based on the UL method and the unit is second.
【００１１】[0011]
【表１】 [Table 1]
【００１２】[0012]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する電気用積層板に
おいては、難燃性に優れ本発明の優れていることを確認
した。The present invention is constructed as described above.
It has been confirmed that the electrical laminate having the structure described in the claims has excellent flame retardancy and is excellent in the present invention.
Claims (2)
後、所要回数樹脂を含浸、乾燥した所要枚数の樹脂含浸
基材の上面及び又は下面に金属箔を配設ー体化したこと
を特徴とする電気用積層板。1. A substrate is impregnated with a phosphorus compound-containing resin solution, dried, then impregnated with resin a required number of times, and a metal foil is disposed on the upper surface and / or the lower surface of a required number of resin-impregnated substrates dried. A laminated board for electrical use characterized by.
に記載の電気用積層板。2. The base material is paper.
The electrical laminate as described in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4114593A JPH06260732A (en) | 1993-03-02 | 1993-03-02 | Electrical copper clad board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4114593A JPH06260732A (en) | 1993-03-02 | 1993-03-02 | Electrical copper clad board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06260732A true JPH06260732A (en) | 1994-09-16 |
Family
ID=12600255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4114593A Pending JPH06260732A (en) | 1993-03-02 | 1993-03-02 | Electrical copper clad board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06260732A (en) |
-
1993
- 1993-03-02 JP JP4114593A patent/JPH06260732A/en active Pending
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