JPH0629108A - Insolatins substrate for microminiaturized chip part - Google Patents

Abstract

(57) [Summary] [Object] The present invention solves the problems related to the conventional insulating substrate for microminiature chip components and the manufacturing method thereof, and makes the miniaturization of microminiature chip components significantly smaller, lighter, and lower in cost. The purpose is to achieve. [Structure] An individual substrate piece obtained by cutting a ceramic substrate on which break lines have been formed and fired along the break lines, or a break line is formed on the ceramic substrate and cut along the break lines. Individual board pieces,
Alternatively, an insulating substrate obtained by rearranging and joining individual substrate pieces obtained by cutting a ceramic substrate, having a small substrate thickness, good pitch accuracy, and little deformation, can be obtained with high yield. As a result, it is possible to significantly reduce the size, weight and cost of ultra-small chip parts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating substrate for use in electronic equipment, and more particularly to an insulating substrate for ultra-small chip parts which is compact, lightweight and low cost.

[0002]

2. Description of the Related Art In recent years, with the trend toward smaller and lighter electronic devices, higher density of electronic circuits due to the adoption of highly integrated circuits, and the widespread use of automatic insertion machines, there is an increasing demand for smaller electronic components. It has become to. In that,
As with other parts, various research and development efforts have been made to reduce the size of capacitors and fixed resistors.

A chip fixed resistor or the like uses a ceramic insulating substrate formed by firing a ceramic green sheet in which break grooves for chip breaking are previously formed in a grid pattern.

Further, in a laminated thin film capacitor or the like in which a dielectric layer and an internal electrode layer are laminated on an insulating substrate, a break for chip breaking after laminating a plurality of capacitor elements on the substrate by a thin film forming method. There is used a method of forming a groove for use by irradiating a laser beam.

[0005]

With the miniaturization of chip components, it is necessary to reduce the thickness of the insulating substrate used for the chip component. However, thinning of the ceramic insulating substrate reduces the mechanical strength of the substrate and thus cracks the substrate. However, due to the increase in substrate deformation and the increase in deformation such as warp of the substrate, it is inevitable to downsize the substrate shape, which hinders the productivity of the process of forming elements and the like on these substrates and reduces the cost of the substrate. The current situation is that it has caused a sharp rise in prices.

Further, in a ceramic insulating substrate made by firing a ceramic green sheet in which grooves for breaking for chip breaking are previously formed in a grid pattern, there is a large variation in shrinkage during firing, so firing is performed in a chip fixed resistor or the like. It is the current situation that ranks are used according to the size of the already used substrate.

The present invention solves the problems associated with the conventional insulating substrate for a microminiature chip component. The miniaturization of the microminiature chip component is intended to be greatly reduced in size, weight and cost. An object is to provide an insulating substrate for chip parts.

[0008]

In order to solve this problem, the insulating substrate for microminiature chip parts of the present invention is obtained by cutting a ceramic substrate which has been previously formed with break lines and fired along the break lines. The individual board pieces formed by breaking lines formed on the individual board pieces or the ceramic board and cut along the break lines, or the individual board pieces obtained by cutting the ceramic board are rearranged and joined. Is.

As a method for rearranging and joining the individual board pieces, a mounting device for surface-mounting chip parts is applied to form a prescribed gap on the adhesive sheet surface within required accuracy. A method of arranging and applying an adhesive such as an epoxy resin to all or part of the gap portion by a screen printing method or a printing method using a metal mask, and bonding by curing by ultraviolet irradiation or heat treatment, etc. Is possible.

As a method of temporarily fixing the individual substrate pieces to be arranged, the air chuck method can be applied, and the method is not limited to the method using the adhesive sheet.

Also, as an arrangement method, it is possible to arrange the individual board pieces with a predetermined gap within the required accuracy by using a grid-like frame and arranging the individual substrate pieces in the frame. It is not limited to the application of the mounting device for surface mounting chip parts.

The adhesive to be used and the method of applying and curing the same are not limited to the above methods.

It goes without saying that the above-mentioned ceramic substrate includes not only a general ceramic substrate such as an alumina substrate but also a glass substrate.

[0014]

With the above structure, it is possible to reduce the thickness of the substrate required for downsizing of parts, and to reduce the yield, which is a major impediment factor for cost reduction. It is possible to obtain a substrate having the size and shape required when forming the element portion without causing an increase in deformation such as warpage. As a result, it is possible to reduce the size, weight, and cost of the chip component.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An insulating substrate for a microminiature chip component according to an embodiment of the present invention will be specifically described below with reference to the drawings. 1 and 2 show the appearance of an insulating substrate for a microminiature chip component according to an embodiment of the present invention. As shown in the figure,
It is formed by arranging the cut individual substrate pieces with a prescribed gap within the required accuracy and then applying an adhesive to all or part of the gap and curing it to join them. .

Specific examples of the present invention will be described below. A break line was previously formed and baked,
A zirconia substrate (product name: Seraflex-A, manufactured by Nippon Fine Ceramics Co., Ltd.) having a thickness of 0.2 mm was cut along the break line to obtain an individual substrate piece of 1.0 mm × 0.5 mm. These individual substrate pieces are 1.
A pitch of 5 mm and a pitch of 1.0 mm in the direction perpendicular to the base are provided on the base having air chuck holes so that the air chuck holes are located at the centers of the individual substrate pieces, and the gap between the respective substrate pieces is 0. The devices were arranged so as to have a size of 5 mm by a device to which a mounting device for surface-mounted chip components was applied, and temporarily fixed. In addition to this,
The metal mask having the pattern shown in Fig. 1 is aligned, and the ultraviolet curable epoxy resin adhesive is applied to the central portions of the long sides and the single sides of the gap between the elements to bond the ultraviolet curable epoxy resin adhesive to a thickness of After applying 0.2 mm, it was irradiated with ultraviolet rays and cured in a nitrogen atmosphere to obtain a 100 mm × 100 mm insulating substrate. As a result of measuring the warp of this insulating substrate, it was 0.1 mm or less per 100 mm in the diagonal direction. On the other hand, in the current ceramic substrate, since shrinkage and deformation during firing are large, a substrate having a size of 0.2 mm and a size of 100 mm square has not been put into practical use. Further, in this insulating substrate, the variation in pitch between the arrayed individual substrate pieces is ± 50 μm (9
(Per 0 mm). On the other hand, the current ceramic substrate has a large shrinkage and deformation during firing, so 96%
Alumina substrate (0.4mm thickness) ± 500μm (90
(per mm). Therefore, at the time of practical use, the pitch is measured and divided into about 10 ranks for use at present.

[0017]

As is apparent from the above description of the embodiments, according to the present invention, it is possible to obtain an insulating substrate having a small substrate thickness, good pitch accuracy, and little deformation with a good yield. It was As a result, it is possible to significantly reduce the size, weight and cost of the ultra-small chip component.

[Brief description of drawings]

FIG. 1 is an external view of an insulating substrate for a micro chip component according to an embodiment of the present invention.

FIG. 2 is an external view of an insulating substrate for microminiature chip components according to an embodiment of the present invention.

FIG. 3 is a pattern diagram of a metal mask for applying an adhesive for joining the individual substrate pieces used in Example 1.

[Explanation of symbols]

 1 Individual board piece 2 Adhesive part 3 Mask hole (0.25 x 0.5 mm) 4 Mask hole (0.5 x 0.5 mm) 5 Position of individual board piece when aligning mask

Claims (1)

[Claims] 1. An individual substrate piece obtained by cutting a ceramic substrate on which a break line is formed and fired in advance, or a break line is formed on the ceramic substrate, and the ceramic substrate is cut along the break line. An insulating substrate for microminiature chip parts, which is obtained by rearranging and joining the obtained individual substrate pieces or the individual substrate pieces obtained by cutting the ceramic substrate.