JPH06318534A - Chip type composite electronic component and manufacture of the same - Google Patents

Abstract

PURPOSE:To provide a chip type electronic component which is hard to fall off when attracted by a collet with easy marking on the surface thereof. CONSTITUTION:A main body of a chip type composite electronic component is composed of a plate type basic material, a plurality of electronic components in different thickness provided on the upper surface of the base material, a first protection film 15 covering the surfaces of a plurality of electronic components and the surface of the basic material. A second protection film 18 is formed in the recessed area 17 of the upper part 17 of at least thinner electronic components among the upper surfaces of the first protection film 15 in order to make the surface of the main body almost flat.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type composite electronic component and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as this type of chip-type composite electronic component, one shown in FIG. 4 has been known.

This composite electronic component is composed of a main body A, a plate-shaped base body B, one side of which extends to an edge of the base body B, and the other side of which is formed by printing on the upper surface of the base body B. A pair of first electrodes E, E respectively connected to C and the resistor R, a second electrode F connecting the capacitor C and the resistor R, the first and second electrodes E, F and the capacitor C, Protective film G including resistance R and covering the surface of substrate B
And a side surface electrode H connected to the first electrode E and formed from the side surface of the substrate B to the back surface.

In such a composite electronic component, the capacitor C has a laminated structure in which a dielectric is sandwiched between the first and second electrodes E and F, while the first electrode E and another second electrode F are formed.
A resistance paste is printed directly on the surface of the substrate B so as to bridge the gap between and, and a resistance R is formed by firing, and then a protective film G is printed on the upper surfaces of the capacitors C and R. Since the protective film G is formed by printing and baking, the film thickness becomes uniform at any position of the film thickness, and as a result, the surface (first protective film) of the main body A is formed in an uneven shape. H is a side surface electrode that is connected to the first electrode and is mounted on a circuit board or the like with solder or the like.

[0005]

Generally, in the above-mentioned conventional chip-type composite electronic component, it is adsorbed by the collet I shown in FIG. 5 and mounted on a predetermined circuit board or the like. When mounted in this manner, the chip-type composite electronic component is extremely small, so that it is difficult to align it with the collet I, and if the surface of the main body A is formed in a concavo-convex shape, an extremely fine positional deviation occurs. However, as shown in FIG. 5, there is a problem that the collet I is attracted by the collet I as it is tilted, and falls off during transportation, or it cannot be properly mounted on a target circuit board or the like, resulting in mounting failure.

Due to such a problem, conventionally, the attraction force of the collet I is increased more than necessary, and the boundary between the upper portion of the capacitor C and the upper portion of the resistor R, which causes a step, is avoided to avoid the upper portion of the capacitor C or the resistor R. A collet with an extremely small diameter was used so that it could be adsorbed only at the top, and it was handled with high precision control.

However, according to the above-mentioned method, a problem such as a positioning error at the time of suctioning, which causes a suction failure, is not sufficient as a means for solving the lump. Further, in recent years, in the miniaturization of composite electronic parts, the above-mentioned problems are more remarkable.

A mark is always provided on the surface of such a composite electronic component, and as a method of this mark, there are generally two methods, a print mark and a laser mark. Two
In the case of the marking method as described above, if the surface of the main body A is uneven, there is a problem in that marking unevenness occurs due to uneven printing or the focal length of the laser due to the effects of unevenness.

The present invention aims to solve the above problems.

[0010]

A chip-type composite electronic component according to claim 1 is a plate-shaped base, a plurality of electronic components having different thicknesses provided on the upper surface of the base, and the plurality of electronic components. A chip-type composite electronic component having a first protective film covering the surface of the second protective film, wherein a second protective film is formed on at least an upper part of the electronic component having a thin thickness on the upper surface of the first protective film, It is characterized in that the surface of the main body is configured to be substantially flat.

A chip-type composite electronic component according to a second aspect of the invention is connected to a plate-shaped substrate, one side extending to an edge of the substrate, and the other side connected to a capacitor and a resistor formed by printing on the upper surface of the substrate. A first protective film for covering the surface of the base including the first and second electrodes, the capacitor, and the resistor, and a pair of first electrodes for connecting the capacitor and the resistor. In the chip-type composite electronic component, the second protective film is formed by printing on at least the upper surface of the first protective film, which covers the resistance, of the upper surface of the first protective film, and the surface of the main body is flattened. It is characterized in that it is configured into a shape.

According to a third aspect of the present invention, there is provided a chip-type composite electronic component manufacturing method, wherein a plate-shaped substrate, a pair of electronic components having different thicknesses provided on the upper surface of the substrate, surfaces of the pair of electronic components, and A chip-type composite electronic component, comprising: a first protective film covering a surface of a substrate, wherein a paste shape is provided in a recess at least on an upper surface of the electronic component having a thin thickness on the upper surface of the first protective film. The second protective film is moved from the upper part of the thin electronic component to the upper part of the electronic component having a large thickness by printing on the first protective film and then baked to flatten the surface of the main body. It is characterized in that it is formed into a shape.

[0013]

In the chip-type composite electronic component according to the first and second aspects, since the surface of the main body of the chip-type electronic component is made flat, for example, a predetermined circuit board or the like is attracted by the collet. Even if it is mounted on the board, it is not only possible to pick it up due to the unevenness of the surface of the body as in the past, but it is not necessary to perform troublesome work such as accurately aligning the place where there is no unevenness, and it is also possible to reduce the size. This has the effect of easily supporting advanced composite electronic components.

Further, in the method of manufacturing the chip-type composite electronic component according to the third aspect, the second protective film having a paste shape is skipped from the upper portion of the thin electronic component to the upper portion of the thick electronic component. Is moved to print on the first protective film and then fired to form a second protective film, and the surface of the main body is formed to be flat. Due to the step at the boundary with the electronic component, the squeegee jumps to cause printing omission, and this printing omission causes a step or a dent on the surface of the main body, which makes it difficult to pick up by collet or the like. You can eliminate the risk of falling out.

[0015]

Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to these embodiments and can be widely applied to various chip-type composite electronic components.

FIG. 1 is a side sectional view of a chip-type composite electronic component according to an embodiment of the present invention, and FIG. 2 is a plan view of the chip-type composite electronic component.

In the figure, reference numeral 1 denotes a chip-type composite electronic component. The chip-type composite electronic component 1 is mounted on a main body 10 and a wiring pattern of a circuit board (not shown) provided on a side edge of the main body 10. It is composed of side electrodes 20.

The main body 10 has a capacitor C and a resistor R as electronic parts, and an electrode 12 for electrically connecting the electronic part and the side electrode 20 on a plate-shaped base 11 made of ceramics. The electronic component and the electrode 12 are provided with a first protective film 15 and are insulation-coated in a predetermined range.

The electrode 12 is composed of a first electrode 13 and a second electrode 14, and the first electrode 13 and the second electrode 14 are formed from the one end edge 11A of the base 11 to the other end edge 11B thereof. An electrode 13, a second electrode 14, and a first electrode 13 are formed in this order, and a capacitor C and a resistor R are sequentially formed between the first electrode 13 and the second electrode 13, 14.

The capacitor C is formed by printing the dielectric layer 16 on the tip portion 13A of the first electrode 13 and laminating the one end portion 14A of the second electrode 14 on the upper surface of the dielectric layer 16.

The resistance R is from the other end 14B of the second electrode 14 and the other end 11B of the base 11 to one end edge 1
It is formed by printing and baking a paste of ruthenium oxide or the like between the end portion 13B of another first electrode 13 provided toward 1A.

In the present embodiment, a chip-type CR composite electronic component including a capacitor C and a resistor R is shown, but the present invention is not limited to this, and it can be applied to other composite electronic components such as a chip-type CL composite electronic component. Of course.

The first protective film 15 is formed by printing an insulating paste such as glass or resin, and the forming range is such that the first electrode 13 and the side surface electrode 20 are in contact with each other. First first electrode 13 and second electrode 14 excluding parts
And the capacitor C and the resistor R are formed on the base 11. The first protective film 15 may be made of any of glass-based resins as long as it has an insulating property.
It is preferable to use a material that does not affect the firing temperature when forming the protective film 15, such as changing the characteristics of the other electrode 12, the dielectric 16, the resistor R, and the capacitor C.

Next, when the first protective film 15 is formed, since the electrode 12 has a thickness of about 60 μm, the composite electronic component 1 has a high thickness in the portion of the capacitor C having a laminated structure and a resistance R. The concave portion 17 is formed on the first protective film 15 above the portion of the resistance R.

In the recess 17, the first protective film 1 is formed.
A paste of the same material as that of No. 5 is printed by a squeegee 30 shown in phantom in FIG. 1 through a screen (not shown) so as to make the surface of the main body 10 flat, and then baked. 2 The protective film 18 is formed. The surface of the second protective film 18,
With the surface of the first protective film 15 above the capacitor C, the surface 10A of the main body 10 is formed flat.

The method for forming the second protective film 18 is not limited to the screen printing described above, and it is also possible to form it by other coating means such as potting a resin paste in the recess 17. However, according to the screen printing of the present invention, if the squeegee 30 is moved from the upper part of the resistor R to the upper part of the capacitor C for printing as shown by the arrow in FIG. The first part above the boundary with C
Even if the step portion 15A is formed on the protective film 15, this step portion 15A
With A, the fear that the squeegee 30 will fly and print omissions can be eliminated.

Further, in this embodiment, the second protective film 18 is used.
The insulating material made of the same material as that of the first protective film 15 is used for the above, but the material is not limited to this, and since the first protective film has an insulating property, a conductive material can also be applied.

Further, in this embodiment, the portion of the recess 17 is filled with the second protective film 18, and the surface of the second protective film 18 and the surface of the first protective film 15 above the capacitor C are used to form the main body 10.
However, the present invention is not limited to this, and the recess 17 is filled with the second protective film 18 and then the second protective film 18 and the first protective film 15 are formed from the top. It is also possible to form the protective film of No. 3. In this case, the first protective film 15
However, there is an advantage that the step difference at the boundary between the second protective film 18 and the second protective film 18 can be completely eliminated, but there is a problem that one manufacturing process increases.

Next, a mark 31 is printed or laser-marked on the surface 10A of the main body 10. In the present invention, as described above, since the front surface 10A is formed in a flat shape, when the mark 31 is printed, a print omission occurs, or when the laser mark is used, the focus position shifts and the mark is displaced. It is possible to eliminate the risk of fading.

FIG. 3 shows a state in which the chip-type composite electronic component 1 constructed as described above is sucked by the collet.

In the figure, reference numeral 32 denotes a collet. This collet 32 has a pyramid-shaped recess suction portion 33 having the same shape as the surface 10A of the main body 10 formed at the tip of the collet 32. Adsorb the composite electronic component 1. In the adsorption state, the corner portion 1 of the surface 10A
Since 0B contacts the inclined portion 33A of the concave portion suction portion 33,
Even when the chip-type composite electronic component 1 and the collet 32 are slightly displaced from each other, the inclined portion 33A can correct the suction when the suction is performed.

[Brief description of drawings]

FIG. 1 is a side sectional view of a chip-type composite electronic component according to an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a reference view showing a state in which the chip-type electronic component of the present invention is sucked by a collet.

FIG. 4 is a side sectional view showing a conventional chip-type composite electronic component.

FIG. 5 is a state diagram showing a state in which a conventional chip-type composite electronic component is sucked by a collet.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip type composite electronic component 10 Main body 11 Base body 13 First electrode 14 Second electrode 15 First protective film 17 Recess 18 Second protective film 30 Squeegee C Capacitor R Resistance

Claims (3)

[Claims] 1. A plate-shaped substrate, a plurality of electronic components having different thicknesses provided on the upper surface of the substrate, and a first protective film covering the surfaces of the plurality of electronic components and the surface of the substrate. In the chip-type composite electronic component, a second protective film is formed in a recess at least on the upper surface of the electronic component having a small thickness on the upper surface of the first protective film, and the surface of the main body is configured to be substantially flat. A chip-type electronic component characterized by: 2. A plate-shaped substrate, a pair of first electrodes extending on one side to an edge of the substrate and connected on the other side to a capacitor and a resistor printed on the upper surface of the substrate, respectively. A chip-type composite electronic component having a capacitor and a second electrode for connecting a resistor, the first and second electrodes, the capacitor, and a first protective film including a resistor and covering a surface of a substrate. Of the upper surface of the first protective film,
A chip-type composite electronic component, characterized in that a second protective film is formed by printing on a recess in the upper part of the first protective film that covers at least the resistor so that the surface of the main body is flat. 3. A plate-shaped base, a pair of electronic components having different thicknesses provided on the upper surface of the base, and a first protective film that covers the surfaces of the pair of electronic components and the surface of the base. In the chip-type composite electronic component, the second protective film in the form of a paste is thinly formed on the upper surface of the first protective film at least in the recess of the upper part of the electronic component having the thin thickness. A squeegee is moved from the upper part of the component to the upper part of the thick electronic component, printed on the first protective film, and fired,
A method of manufacturing a chip-type electronic component, wherein the surface of the main body is formed flat.