JPH06390B2 - Metal base laminated board - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a metal base laminate having excellent moisture resistance and heat resistance.

BACKGROUND ART Conventionally, a metal base laminate is formed by attaching a metal foil to a metal plate via an insulating layer such as an epoxy resin, but due to the difference in thermal expansion between the metal plate and the insulating layer, In particular, the heat resistance after moisture absorption is poor, and the insulation deterioration in the electrical contact test is remarkable,
Moreover, voids were generated in the insulating layer, and variations in the thickness of the insulating layer were also large. In order to prevent the occurrence of voids and variations in thickness of the insulating layer, a base material such as a glass base material is interposed in the insulating layer. In this case, the insulating layer and the metal plate, Poor adhesion after absorbing moisture,
Moreover, the heat resistance after moisture absorption is also inferior.

[Object of the Invention] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide excellent moisture resistance and heat resistance, a high adhesion between an insulating layer and a metal plate, and an insulating layer. It is an object to provide a metal base laminated plate which does not generate voids and has a small variation in thickness.

DISCLOSURE OF THE INVENTION The metal base laminated plate of the present invention is a metal base laminated plate obtained by adhering a metal foil 3 to a metal plate 1 with an insulating layer 2 interposed therebetween. It is formed of the resin-impregnated base material 4 and the metal plate 1 side is formed of the inorganic filler-containing resin layer 5, and the above-mentioned object can be achieved by this configuration. That is, moisture absorbed by the inorganic filler-containing resin layer 5 is less likely to diffuse into the insulating layer 2, moisture resistance and deterioration characteristics after contact with electricity are improved, and the thermal expansion coefficient of the inorganic filler-containing resin layer 5 is improved. Adhesion failure due to the difference in thermal expansion is mitigated by approaching the metal plate 1, heat resistance is improved, and thermal adhesion failure due to the difference in thermal expansion between the resin-impregnated base material 4 and the metal plate 1 due to the inorganic filler-containing resin layer 5. And the heat resistance can be further improved, and the melt viscosity of the insulating layer 2 can be increased to obtain a uniform thickness.
Further, since the base material 6 is interposed, no void is generated.

Hereinafter, the present invention will be described with reference to the accompanying drawings. The metal plate 1 may be a copper plate, an aluminum plate, an iron plate, a nickel plate or a stainless steel plate, a brass plate, a silicon steel plate, an alloy such as duralumin, or the like, and usually has a thickness of 0.
Use one with a range of 1 to 2.0 mm. These metal plates 1 may be plated with zinc, aluminum or zinc-aluminum. Further, the metal plate 1 may be preliminarily formed with punch holes for guide holes or pilot holes, and through holes for other through holes. In the metal base laminated plate A of the present invention, the inorganic filler-containing resin layer 5, the resin-impregnated base material 4 and the metal foil 3 are arranged on the base metal plate 1, and a plurality of sets are formed by using these as one set and forming plates. Placed between hot plates, for example, 150-170 ℃, 20-150kg /
It can be obtained by heating and pressurizing at cm ² for 40 to 100 minutes to laminate and integrate. The resin-impregnated base material 4 is obtained by impregnating an organic or inorganic base material 6 such as paper, glass cloth, synthetic woven fabric, asbestos or the like with a thermosetting resin or a thermoplastic resin varnish such as an epoxy resin, a polyimide resin or a polyimide amide resin and drying it. It is formed and has a thickness of 5 to 100 μ. The inorganic filler-containing resin layer 5 has a thickness
0.05 ~ 1mm, phenol resin, epoxy resin, unsaturated polyester resin, trifluorochloroethylene resin, tetrafluoroethylene resin, tetrafluoroethylene-hexafluoropropylene copolymer resin, tetrafluoroethylene-perfluoro A thermosetting resin such as a fluororesin such as a vinyl ether copolymer resin, a resin such as a polyimide resin, a polyphenylene polysulfide resin, or a polyamide resin is made to contain an inorganic filler. As the inorganic filler, those having good thermal conductivity such as alumina, magnesium oxide, and boron nitride are preferable. The blending ratio of this inorganic filler is 7 to 60% by volume, preferably 10 to 55% by volume, based on the resin solid content. Less than 7% by volume is not effective, conversely 60
If it exceeds the capacity%, the adhesion to the metal plate 1 will be reduced, and the uniformity of the impregnated amount will be reduced. As the metal foil 3, the same material as the metal plate 1 can be used, and any of copper foil, aluminum foil, brass foil, iron foil, stainless steel foil, nickel foil, silicon steel foil and the like can be adopted, and the thickness is 18 to 70 μm.
Used in the range of. A well-known process is adopted for manufacturing the metal-based printed wiring board from the metal-based laminated board A. For example, metal base copper clad laminates are sequentially drilled, electroless plated, patterned, patterned, resist plated,
Through-hole plated metal-based printed wiring boards are manufactured by processes such as resist removal, etching, external finishing, and symbol mark printing.

Next, examples of the present invention will be described.

(Examples 1 to 7) An aluminum plate having a thickness of 1.0 mm, a resin-impregnated base material having a thickness of 100 μ in which a glass base material is impregnated with an epoxy resin, and various inorganic fillers are added to the epoxy resin as shown in Table 1. With an insulating layer consisting of an inorganic filler-containing resin layer blended in the ratio of, a metal base laminate is formed, and the adhesion between the insulating layer and the metal plate after moisture absorption (C-10 / 85/85), after moisture absorption Solder heat resistance
(C-10 / 85/85), and a metal base printed wiring board was formed from this metal base laminate, and the electrolytic test insulation property (C-500 / 85/85) between the circuit and the metal plate was measured. The results are shown in Table 2. The thickness unevenness of the insulating layer was as small as ± 10 or less, and no void was generated.

(Comparative Example) For comparison, a metal-based laminate having an insulating layer made of a resin-impregnated base material having a thickness of 100 μ, which was obtained by impregnating a glass base material with an epoxy resin, was formed, and the same measurement as that of the example was performed. The results are shown in Table 2. The thickness unevenness of the insulating layer was as large as ± 20 or more, and voids were observed.

In the examples of the present invention, it can be seen that the adhesion between the metal plate and the insulating layer after moisture absorption is good, and the solder heat resistance and the electric contact test insulation are also good. It is considered that these are due to the inorganic filler-impregnated resin layer interposed in the insulating layer.

[Effect of the Invention] In the present invention, the metal foil side of the insulating layer is formed of the resin-impregnated base material and the metal plate side is formed of the inorganic filler-containing resin layer. Water absorbed by the inorganic filler becomes difficult to diffuse to the insulating layer,
Moisture resistance, deterioration characteristics after contacting with electricity become good, and because the coefficient of thermal expansion of the resin layer containing the inorganic filler approaches that of a metal plate, adhesive failure due to the difference in thermal expansion is mitigated, and heat resistance is improved. The resin layer can relieve thermal adhesive failure due to the difference in thermal expansion between the resin-impregnated base material and the metal plate by its elasticity, and further improve heat resistance. Furthermore, the resin-impregnated base material of the insulating layer can improve the melt viscosity. By increasing the thickness, a uniform thickness can be obtained, and generation of voids can be suppressed by the base material of the resin-impregnated base material.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of the present invention.
Is a metal base laminated plate, 1 is a metal plate, 2 is an insulating layer, 3 is a metal foil, 4 is a resin-impregnated base material, and 5 is an inorganic filler-containing resin layer.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Tashiro 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd. (72) Daizo Baba, 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd. (56) ) Reference JP-A-61-69450 (JP, A) JP-A-58-165391 (JP, A) Actually developed JP-A-61-33466 (JP, U)

Claims (1)

[Claims] 1. A metal base laminate comprising a metal plate and a metal foil bonded to the metal plate via an insulating layer, wherein the metal foil side of the insulating layer is formed of a resin-impregnated base material and the metal plate side is an inorganic filler. A metal-based laminate, comprising a resin layer containing a metal.