JPH0644099Y2 - 半導体素子用樹脂封止装置 - Google Patents

半導体素子用樹脂封止装置

Info

Publication number
JPH0644099Y2
JPH0644099Y2 JP8322988U JP8322988U JPH0644099Y2 JP H0644099 Y2 JPH0644099 Y2 JP H0644099Y2 JP 8322988 U JP8322988 U JP 8322988U JP 8322988 U JP8322988 U JP 8322988U JP H0644099 Y2 JPH0644099 Y2 JP H0644099Y2
Authority
JP
Japan
Prior art keywords
temperature
mold
target temperature
pid control
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8322988U
Other languages
English (en)
Japanese (ja)
Other versions
JPH024242U (fr
Inventor
至 松尾
潔 武末
勝徳 甲斐
光高 松尾
伸貴 入口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8322988U priority Critical patent/JPH0644099Y2/ja
Publication of JPH024242U publication Critical patent/JPH024242U/ja
Application granted granted Critical
Publication of JPH0644099Y2 publication Critical patent/JPH0644099Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Control Of Temperature (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP8322988U 1988-06-22 1988-06-22 半導体素子用樹脂封止装置 Expired - Lifetime JPH0644099Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8322988U JPH0644099Y2 (ja) 1988-06-22 1988-06-22 半導体素子用樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8322988U JPH0644099Y2 (ja) 1988-06-22 1988-06-22 半導体素子用樹脂封止装置

Publications (2)

Publication Number Publication Date
JPH024242U JPH024242U (fr) 1990-01-11
JPH0644099Y2 true JPH0644099Y2 (ja) 1994-11-14

Family

ID=31307955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8322988U Expired - Lifetime JPH0644099Y2 (ja) 1988-06-22 1988-06-22 半導体素子用樹脂封止装置

Country Status (1)

Country Link
JP (1) JPH0644099Y2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2537200Y2 (ja) * 1990-11-28 1997-05-28 エスエムシー 株式会社 ラックピニオン形揺動アクチュエータ

Also Published As

Publication number Publication date
JPH024242U (fr) 1990-01-11

Similar Documents

Publication Publication Date Title
US7183739B2 (en) Synchronous control device
JP5712483B2 (ja) 過電流検出装置
KR960002807B1 (ko) 습도 검출 회로
KR100318039B1 (ko) 발열저항식공기유량계
JPH0644099Y2 (ja) 半導体素子用樹脂封止装置
US20260029283A1 (en) Circuit Optimization Method and System for Digital Domain Correction of Temperature Sensor
JPH03213323A (ja) 射出成形機の圧力制御方法
US4891603A (en) Logarithmic amplifier
JPS58132441A (ja) 自動熱変位補正装置
JP6865911B1 (ja) アナログデジタル変換装置およびアナログデジタル変換装置の制御プログラム
JPH06310554A (ja) 半導体樹脂封止装置
JP3661202B2 (ja) 鍛造成形装置
JPS6197543A (ja) 半導体圧力センサの補償回路
CN114184306B (zh) 一种带有环境温度补偿的差示扫描量热仪基线校正装置及方法
JP2532715Y2 (ja) デジタル演算回路
JPH0431721A (ja) Ｉｃ式温度検出装置
JPH07139985A (ja) 熱式空気流量測定装置
JPH0756941B2 (ja) Ａｄ変換装置における自動補正方式
JPS61258691A (ja) サ−ボモ−タ制御装置
JPH01243101A (ja) デジタル制御装置
JPH02285803A (ja) 自動レベル制御回路
JPS6331876Y2 (fr)
JPS6349909A (ja) 位置決め制御装置
SU781783A1 (ru) Устройство дл термостабилизации
JPH0455528B2 (fr)