JPH064591Y2 - Heat sink device for device mounting - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a heat sink device for device mounting, and more particularly to a heat sink device for device mounting which functions suitably when fixing a heat sink equipped with a device to a substrate.

[Conventional technology]

When soldering a plurality of devices to the substrate 13, as shown in FIG.
It is generally fixed to the substrate 13 while being supported by 1. In this case, when soldering the device 10 to the substrate 13, it is desirable that there is no protrusion on the solder surface (the back surface side of the substrate 13) due to the nature of the automatic soldering process. For this reason, the heat sink 11 is set to a predetermined position while the device is temporarily fixed to the substrate 13.

[Problems to be solved by the device]

However, in such a conventional example, the heat sink 11 is tilted by α as shown in FIG. 2 due to the vibration or the buoyancy of the solder generated when passing through the solder bath, or the device 10 of the device 10 is misaligned. Lead is substrate 13
Often soldered to.

If the legs of the heat sink 11 are tightened to the case in this state, an excessive internal stress is applied to the device 10 and the life of the device 10 is significantly shortened.

[Purpose of device]

The object of the present invention is to improve the inconvenience of the conventional example and eliminate the inconvenience that the heat sink and the device are soldered to the substrate in an inclined state during the soldering process, thereby increasing the durability of the device. An object of the present invention is to provide a device mounting heat sink device.

[Means for Solving the Problems]

Therefore, in the present invention, a heat sink for fixing and supporting one or more devices at a predetermined position on the substrate and a first attaching means for fixing the heat sink to the substrate are provided. The heat sink is equipped with a second attachment means for fixing the heat sink to the substrate, and the second attachment means is formed by a U-shaped thin plate and a locking member for locking the thin plate to the heat sink. , Is adopted. This aims to achieve the above-mentioned object.

[Effect of device]

 An embodiment of the present invention will be described below with reference to FIG.

In the embodiment shown in FIG. 1, a plurality of devices 10 are mounted on a substrate 13
It is provided with a heat sink 11 which is fixedly supported at a predetermined position above and a pair of first mounting means 20 and 21 which fixes the heat sink 11 to the substrate 13.

Of these, the heat sink 11 is formed of a plate member having mounting legs 11A and 11B at both ends in the present embodiment. This set of first mounting means 20, 21
Are each composed of a mounting leg 11A or 11B and a mounting screw 20A or 21A. The heat sink 11 is arranged on the substrate 13 so as to rise along the substrate 13.

The device 10 is fixed on the heat sink 11. The leg portion of the device 10 is fixed to a predetermined place on the substrate 13 by soldering.

A second mounting means 1 is provided at the center of the heat sink 11. This second mounting means 1 is composed of a U-shaped thin plate 2 whose one piece is formed to be somewhat long, and a fixing screw 3 for fixing the long side portion 2A of this U-shaped thin plate 2 to the heat sink 11. There is.

Then, in actual use, after mounting the heat sink 11 on the substrate 13, the leg portion of the device 10 is mounted on the substrate 13.
Of the U-shaped thin plate 2 and then the engaging slit holes 13A and 13B on the substrate 13 are engaged at the bent portion 2C of the U-shaped thin plate 2, and then the long side portion 2 described above is engaged.
The portion A is fixed to the heat sink 11 by the fixing screw 3.

Therefore, the heat sink 11 is attached by the second attaching means 1.
If the board is attached to the board 13, then the board 1
Even if the whole 3 is placed on the line of the automatic solder intended for the lower surface side of the substrate 13 in FIG. 1, it is possible to completely eliminate the inconvenience that the heat sink 11 falls due to vibration or other reasons. Therefore, it becomes possible to effectively solder the legs of the device 10, and even if the heat sink 11 is screwed to the substrate 13 by using the first attaching means 20 and 21 after the soldering process, the heat sink 11 is not Since the device 10 is fixed to the substrate 13 by the action of the mounting means 1, the device 10 is in a state in which no internal stress is generated or accumulated.
There is an advantage that the durability of the device 10 can be remarkably increased, and at the same time, the fixing work of the heat sink 11 after the soldering process can be performed smoothly.

[Effect of device]

Since the present invention is constructed and functions as described above, according to this, when the device is soldered to the substrate, the automation can be smoothly performed, and at the same time, the internal stress is applied to the device by the action of the second attaching means. A heat sink device for device attachment, which has never been used, can smoothly fix the heat sink that holds the device to the substrate without causing the problem, and can significantly increase the durability of the device. Can be provided.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional example. 1 ... second mounting means, 2 ... U-shaped thin plate, 10 ... device, 11 ... heat sink, 13 ... substrate, 20,
21 ... First mounting means.

Claims (1)

[Scope of utility model registration request] 1. A heat sink mounting apparatus comprising: a heat sink for fixing and supporting one or more devices at a predetermined position on a substrate; and a first mounting means for fixing the heat sink to the substrate. Second mounting means for fixing the heat sink to the substrate is provided, and the second mounting means is formed by a U-shaped thin plate and a locking member for locking the thin plate to the heat sink. Heat sink device for device mounting.