JPH0680802A - Resin-impregnated base material and electrical laminate - Google Patents
Resin-impregnated base material and electrical laminateInfo
- Publication number
- JPH0680802A JPH0680802A JP23619292A JP23619292A JPH0680802A JP H0680802 A JPH0680802 A JP H0680802A JP 23619292 A JP23619292 A JP 23619292A JP 23619292 A JP23619292 A JP 23619292A JP H0680802 A JPH0680802 A JP H0680802A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- base material
- resin
- solvent
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 36
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000002966 varnish Substances 0.000 claims abstract description 9
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 8
- 239000004305 biphenyl Substances 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract 2
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000835 fiber Substances 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 abstract 1
- 239000005453 ketone based solvent Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000001179 sorption measurement Methods 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000005470 impregnation Methods 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子機器、電気機器、計
算器、通信機器等に用いられる樹脂含浸基材、電気用積
層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.
【０００２】[0002]
【従来の技術】近年、電気、電子機器の高信頼化対策と
して吸湿後耐熱性の向上が試みられているが、一長一短
で目立った効果はない。2. Description of the Related Art In recent years, attempts have been made to improve the heat resistance after moisture absorption as a measure for increasing the reliability of electric and electronic devices, but there are advantages and disadvantages, and there is no noticeable effect.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、吸湿後耐熱性の向上は容易なことではない。本発
明は従来の技術における上述の問題点に鑑みてなされた
もので、その目的とするところは吸湿後耐熱性が向上す
る樹脂含浸基材、電気用積層板を提供し電気、電子機器
の高信頼化を向上させることにある。As described in the prior art, it is not easy to improve the heat resistance after absorbing moisture. The present invention has been made in view of the above problems in the prior art, and an object thereof is to provide a resin-impregnated base material having improved heat resistance after moisture absorption, a laminated board for electrical use, and high electrical and electronic equipment. It is to improve reliability.
【０００４】[0004]
【課題を解決するための手段】本発明はビフェニル骨格
エポキシ樹脂を含有するエポキシ樹脂に硬化剤を加え、
更に必要に応じて硬化促進剤、溶剤等を添加したエポキ
シ樹脂ワニスを基材に含浸、乾燥した樹脂含浸基材、及
び該樹脂含浸基材の所要枚数の上面及び又は下面に金属
箔を配設ー体化してなることを特徴とする電気用積層板
のため、上記目的を達成することができたもので、以下
本発明を詳細に説明する。According to the present invention, a curing agent is added to an epoxy resin containing a biphenyl skeleton epoxy resin,
Further, a base material is impregnated and dried with an epoxy resin varnish to which a curing accelerator, a solvent, etc. are added as required, and a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin impregnated base material. Since the electrical laminated board is characterized by being integrated, the above-mentioned object can be achieved, and the present invention will be described in detail below.
【０００５】本発明に用いるエポキシ樹脂としては、ビ
スフェノ−ルＡ型エポキシ樹脂、ビスフェノ−ルＦ型エ
ポキシ樹脂、フェノ−ルノボラック型エポキシ樹脂、ク
レゾールノボラック型エポキシ樹脂、グリシジルエーテ
ル型エポキシ樹脂、グリシジルエステル型エポキシ樹
脂、グリシジルアミン型エポキシ樹脂、線状脂肪族エポ
キシ樹脂、脂環式エポキシ樹脂、複素環型エポキシ樹
脂、ハロゲン化エポキシ樹脂等の単独、変性物、混合物
を用いることができる。ビフェニル骨格エポキシ樹脂と
しては１分子中に２個以上のエポキシ基を持つビフェニ
ル骨格を有するエポキシ樹脂全般を用いることができ
る。ビフェニル骨格エポキシ樹脂の量はエポキシ樹脂全
体の５０〜１００重量％（以下単に％と記す）であるこ
とが好ましい。即ち５０％未満では吸湿後耐熱性が向上
し難いからである。硬化剤としてはフェノ−ル樹脂、イ
ソシアネート、アミン系硬化剤、酸無水物、ルイス酸錯
化合物、イミダゾール系化合物等が用いられ特に限定し
ない。必要に応じて硬化促進剤としては、燐系、３級ア
ミン系硬化促進剤が用いられる。必要に応じて溶剤とし
てはケトン系、アルコール系等のように樹脂と相溶する
ものであればよく特に限定しない。更に必要に応じてタ
ルク、クレー、シリカ、炭酸カルシュウム、水酸化アル
ミニゥム、三酸化アンチモン、五酸化アンチモン等の無
機質粉末充填剤、ガラス繊維、アスベスト繊維、パルプ
繊維、合成繊維、セラミック繊維等の繊維質充填剤、着
色剤等を添加することができる。基材としてはガラス、
アスベスト等の無機質繊維、ポリエステル、ポリアミ
ド、ポリアクリル、ポリビニルアルコール、ポリイミ
ド、フッ素樹脂等の有機質繊維、木綿等の天然繊維を用
いることができる。基材に対する含浸は同一の樹脂のみ
による含浸でもよいが、同系樹脂又は異系樹脂による１
次含浸、２次含浸というように含浸を複数にし、より含
浸が均一になるようにすることもできる。かくして基材
に樹脂を含浸、乾燥して樹脂含浸基材を得るものであ
る。金属箔としては銅、アルミニュウム、真鍮、ニッケ
ル、鉄等の単独、合金、複合箔を用いることができる。
このようにして上記樹脂含浸基材の所要枚数の上面及び
又は下面に金属箔を配設ー体化して電気用積層板を得る
ものである。The epoxy resin used in the present invention includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin. Epoxy resin, glycidylamine type epoxy resin, linear aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, halogenated epoxy resin, etc. may be used alone, modified, or as a mixture. As the biphenyl skeleton epoxy resin, all epoxy resins having a biphenyl skeleton having two or more epoxy groups in one molecule can be used. The amount of the biphenyl skeleton epoxy resin is preferably 50 to 100% by weight (hereinafter simply referred to as "%") of the whole epoxy resin. That is, if it is less than 50%, it is difficult to improve the heat resistance after moisture absorption. As the curing agent, a phenol resin, an isocyanate, an amine type curing agent, an acid anhydride, a Lewis acid complex compound, an imidazole type compound or the like can be used without any particular limitation. If necessary, a phosphorus-based or tertiary amine-based curing accelerator is used as the curing accelerator. If necessary, the solvent is not particularly limited as long as it is compatible with the resin, such as a ketone solvent or an alcohol solvent. Further, if necessary, inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide and antimony pentoxide, glass fibers, asbestos fibers, pulp fibers, synthetic fibers, fibrous materials such as ceramic fibers. Fillers, colorants and the like can be added. Glass as the base material,
Inorganic fibers such as asbestos, polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide, organic fibers such as fluororesin, and natural fibers such as cotton can be used. The base material may be impregnated only with the same resin, but it may be impregnated with the same resin or different resin.
Multiple impregnations such as secondary impregnation and secondary impregnation can be performed to make the impregnation more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like can be used.
In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate.
【０００６】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【０００７】[0007]
【実施例】エポキシ樹脂（油化シエル製、エピコート１
００１）５部に対してビフェニル骨格エポキシ樹脂（油
化シエル製、ＹＸ４０００Ｈ）９５部、ジシアンジアミ
ド４部、ベンジルジメチルアミン０．２部、メチルオキ
シトール１００部を添加したエポキシ樹脂ワニスに、厚
み０．０１８ｍｍの平織ガラス布を樹脂付着量が４５％
になるように含浸、乾燥して樹脂含浸基材を得た。次に
該樹脂含浸基材８枚を重ねた上下面に厚み０．０３５ｍ
ｍの銅箔を各々配設した積層体を成形圧力４０Ｋｇ／ｃ
ｍ2 、１６０℃で９０分間加熱加圧成形して厚み１．６
ｍｍの両面銅張り積層板板を得た。[Embodiment] Epoxy resin (made by Yuka Shell, Epicoat 1
0.001) to 5 parts of a biphenyl skeleton epoxy resin (YX4000H, manufactured by Yuka Shell Co., Ltd.), 4 parts of dicyandiamide, 0.2 part of benzyldimethylamine, and 100 parts of methyloxytol were added to an epoxy resin varnish, and a thickness of 0. 018mm plain woven glass cloth has a resin adhesion of 45%
To obtain a resin-impregnated base material. Next, a thickness of 0.035 m is applied to the upper and lower surfaces of the eight resin-impregnated base materials
Molding pressure of 40 Kg / c
m 2 at 160 ° C. for 90 minutes under heat and pressure molding to a thickness of 1.6
A double-sided copper-clad laminate board having a size of mm was obtained.
【０００８】[0008]
【比施例】エポキシ樹脂（シエル化学株式会社製、エピ
コート１００１）１００部に対してジシアンジアミド４
部、ベンジルジメチルアミン０．２部、メチルオキシト
ール１００部を添加したエポキシ樹脂ワニスを用いた以
外は実施例と同様に処理して樹脂含浸基材を得ると共に
厚み１．６ｍｍの両面銅張り配線基板を得た。[Comparative Example] Dicyandiamide 4 to 100 parts of epoxy resin (Epicoat 1001 manufactured by Ciel Chemical Co., Ltd.)
Part, benzyl dimethylamine 0.2 part, and methyloxytol 100 parts were used to obtain a resin-impregnated base material and double-sided copper-clad wiring having a thickness of 1.6 mm by the same treatment as in Example except that an epoxy resin varnish was used. A substrate was obtained.
【０００９】実施例及び比較例の電気用積層板の性能は
表１のようである。吸湿後耐熱性は湿度８５％、８５℃
で４８時間吸湿後、２５０℃の溶融半田に１０秒間浸漬
し断面カットにより内部クラックの有無を調べ、クラッ
クのあるものを不良とした。Table 1 shows the performance of the electrical laminates of Examples and Comparative Examples. Heat resistance after moisture absorption is 85% humidity, 85 ℃
After absorbing moisture for 48 hours, it was immersed in molten solder at 250 ° C. for 10 seconds, and the cross-section was cut to check for internal cracks.
【００１０】[0010]
【表１】 [Table 1]
【００１１】[0011]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する樹脂含浸基材を
用いた電気用積層板は吸湿後耐熱性がよく、本発明の優
れていることを確認した。The present invention is constructed as described above.
It has been confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has good heat resistance after moisture absorption and is excellent in the present invention.
Claims (2)
ポキシ樹脂に硬化剤を加え、更に必要に応じて硬化促進
剤、溶剤等を添加したエポキシ樹脂ワニスを基材に含
浸、乾燥したことを特徴とする樹脂含浸基材。1. An epoxy resin varnish obtained by adding a curing agent to an epoxy resin containing a biphenyl skeleton epoxy resin, and further optionally adding a curing accelerator, a solvent, etc. to a substrate and drying the varnish. Resin impregnated base material.
ポキシ樹脂に硬化剤を加え、更に必要に応じて硬化促進
剤、溶剤等を添加したエポキシ樹脂ワニスを基材に含
浸、乾燥した樹脂含浸基材の所要枚数の上面及び又は下
面に金属箔を配設ー体化してなることを特徴とする電気
用積層板。2. A resin-impregnated base material obtained by impregnating a base material with an epoxy resin varnish obtained by adding a curing agent to an epoxy resin containing a biphenyl skeleton epoxy resin, and further adding a curing accelerator, a solvent, etc., if necessary. An electrical laminate, comprising a required number of upper and / or lower surfaces provided with metal foil and integrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23619292A JPH0680802A (en) | 1992-09-03 | 1992-09-03 | Resin-impregnated base material and electrical laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23619292A JPH0680802A (en) | 1992-09-03 | 1992-09-03 | Resin-impregnated base material and electrical laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0680802A true JPH0680802A (en) | 1994-03-22 |
Family
ID=16997146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23619292A Pending JPH0680802A (en) | 1992-09-03 | 1992-09-03 | Resin-impregnated base material and electrical laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680802A (en) |
-
1992
- 1992-09-03 JP JP23619292A patent/JPH0680802A/en active Pending
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