JPH06143264A - Resin-impregnated base and electrical laminate - Google Patents
Resin-impregnated base and electrical laminateInfo
- Publication number
- JPH06143264A JPH06143264A JP29537792A JP29537792A JPH06143264A JP H06143264 A JPH06143264 A JP H06143264A JP 29537792 A JP29537792 A JP 29537792A JP 29537792 A JP29537792 A JP 29537792A JP H06143264 A JPH06143264 A JP H06143264A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated
- epoxy resin
- laminate
- impregnated base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- PVAONLSZTBKFKM-UHFFFAOYSA-N diphenylmethanediol Chemical class C=1C=CC=CC=1C(O)(O)C1=CC=CC=C1 PVAONLSZTBKFKM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 239000002966 varnish Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- 239000000835 fiber Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MILSYCKGLDDVLM-UHFFFAOYSA-N 2-phenylpropan-2-ylbenzene Chemical class C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 MILSYCKGLDDVLM-UHFFFAOYSA-N 0.000 description 1
- JRLTTZUODKEYDH-UHFFFAOYSA-N 8-methylquinoline Chemical group C1=CN=C2C(C)=CC=CC2=C1 JRLTTZUODKEYDH-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子機器、電気機器、計
算器、通信機器等に用いられる樹脂含浸基材、電気用積
層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.
【０００２】[0002]
【従来の技術】近年、電気、電子機器用に各種のプリン
ト配線板が用いられ、その使用量も多くなっている。こ
のためプリント配線板に品番、配線図等のように各種記
号をマーキングする必要があるが樹脂面の印刷は、はじ
き、にじみを発生し易く明瞭なマーキングは困難であっ
た。2. Description of the Related Art In recent years, various printed wiring boards have been used for electric and electronic devices, and the amount thereof has been increasing. For this reason, it is necessary to mark various symbols such as a product number and a wiring diagram on the printed wiring board, but printing on the resin surface easily causes bleeding and bleeding, and it is difficult to make clear marking.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、プリント配線板への明瞭なマーキングは困難であ
る。本発明は従来の技術における上述の問題点に鑑みて
なされたもので、その目的とするところは明瞭なマーキ
ングを施すことのできるプリント配線板を得ることがで
きる樹脂含浸基材、電気用積層板を提供することにあ
る。As described in the prior art, it is difficult to clearly mark a printed wiring board. The present invention has been made in view of the above-mentioned problems in the prior art, and the purpose thereof is to obtain a resin-impregnated base material and an electric laminated board from which a printed wiring board capable of providing clear marking can be obtained. To provide.
【０００４】[0004]
【課題を解決するための手段】本発明はエポキシ樹脂に
硬化剤、ジヒドロキシジフェニルメタン誘導体を加え、
更に必要に応じて硬化促進剤、溶剤等を添加したエポキ
シ樹脂ワニスに基材を含浸、乾燥した樹脂含浸基材及び
該樹脂含浸基材の所要枚数の上面及び又は下面に金属箔
を配設ー体化してなることを特徴とする電気用積層板の
ため、上記目的を達成することができたもので、以下本
発明を詳細に説明する。According to the present invention, a curing agent and a dihydroxydiphenylmethane derivative are added to an epoxy resin,
Further, a substrate is impregnated with an epoxy resin varnish to which a curing accelerator, a solvent, etc. are added, if necessary, and a resin-impregnated substrate is dried, and a metal foil is provided on the required number of upper and / or lower surfaces of the resin-impregnated substrate. The present invention can be achieved in detail because the laminated body for electric use is characterized by being embodied, and the present invention will be described in detail below.
【０００５】本発明に用いるエポキシ樹脂としては、１
分子中に２個以上のエポキシ基を有するビスフェノ−ル
Ａ型エポキシ樹脂、フェノ−ルノボラック型エポキシ樹
脂、クレゾールノボラック型エポキシ樹脂、グリシジル
エーテル型エポキシ樹脂、グリシジルエステル型エポキ
シ樹脂、グリシジルアミン型エポキシ樹脂、線状脂肪族
エポキシ樹脂、脂環式エポキシ樹脂、複素環型エポキシ
樹脂、ハロゲン化エポキシ樹脂等の単独、変性物、混合
物を用いることができる。硬化剤としてはフェノ−ル樹
脂、イソシアネート、アミン系硬化剤、酸無水物、ルイ
ス酸錯化合物、イミダゾール系化合物等が用いられ特に
限定しない。ジヒドロキシジフェニルメタン誘導体とし
ては、ジヒドロキシジフェニルメタン誘導体全般を用い
ることができ、添加量はエポキシ樹脂１００重量部（以
下単に部と記す）に対して１〜２０部であることが好ま
しい。即ち１部未満ではマーキング性が向上し難く、２
０部をこえるとこれまたマーキング性が低下する傾向に
あるからである。必要に応じて硬化促進剤としては、燐
系、３級アミン系硬化促進剤が用いられる。必要に応じ
て溶剤としてはケトン系、アルコール系等のように樹脂
と相溶するものを用いることができ特に限定しない。更
に必要に応じてタルク、クレー、シリカ、炭酸カルシュ
ウム、水酸化アルミニゥム、三酸化アンチモン、五酸化
アンチモン等の無機質粉末充填剤、ガラス繊維、アスベ
スト繊維、パルプ繊維、合成繊維、セラミック繊維等の
繊維質充填剤、着色剤等を添加することができる。基材
としてはガラス、アスベスト等の無機質繊維、ポリエス
テル、ポリアミド、ポリアクリル、ポリビニルアルコー
ル、ポリイミド、フッ素樹脂等の有機質繊維、木綿等の
天然繊維の織布、不織布、紙、マット等を用いることが
できる。基材に対する含浸は同一の樹脂のみによる含浸
でもよいが、同系樹脂又は異系樹脂による１次含浸、２
次含浸というように含浸を複数にし、より含浸が均一に
なるようにすることもできる。かくして基材に樹脂を含
浸、乾燥して樹脂含浸基材を得るものである。金属箔と
しては銅、アルミニュウム、真鍮、ニッケル、鉄等の単
独、合金、複合箔を用いることができる。このようにし
て上記樹脂含浸基材の所要枚数の上面及び又は下面に金
属箔を配設ー体化して電気用積層板を得るものである。
以下本発明を実施例に基づいて説明する。The epoxy resin used in the present invention is 1
Bisphenol A type epoxy resin having two or more epoxy groups in the molecule, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, A linear aliphatic epoxy resin, an alicyclic epoxy resin, a heterocyclic epoxy resin, a halogenated epoxy resin or the like may be used alone, or as a modified product or a mixture thereof. As the curing agent, a phenol resin, an isocyanate, an amine type curing agent, an acid anhydride, a Lewis acid complex compound, an imidazole type compound or the like can be used without any particular limitation. As the dihydroxydiphenylmethane derivative, all dihydroxydiphenylmethane derivatives can be used, and the addition amount is preferably 1 to 20 parts with respect to 100 parts by weight of the epoxy resin (hereinafter simply referred to as “part”). That is, if it is less than 1 part, it is difficult to improve the marking property.
This is because if it exceeds 0 part, the marking property also tends to deteriorate. If necessary, a phosphorus-based or tertiary amine-based curing accelerator is used as the curing accelerator. If necessary, a solvent that is compatible with the resin, such as a ketone-based solvent or an alcohol-based solvent, can be used and is not particularly limited. Further, if necessary, inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide and antimony pentoxide, and fiber materials such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber and ceramic fiber. Fillers, colorants and the like can be added. As the base material, it is possible to use glass, inorganic fibers such as asbestos, organic fibers such as polyester, polyamide, polyacrylic, polyvinyl alcohol, polyimide and fluororesin, woven cloth of natural fibers such as cotton, non-woven fabric, paper and mat. it can. The base material may be impregnated only with the same resin, but primary impregnation with the same resin or a different resin,
It is also possible to make multiple impregnations such as the second impregnation so that the impregnation becomes more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like can be used. In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate.
The present invention will be described below based on examples.
【０００６】[0006]
【実施例】エポキシ当量２００のビスフェノ−ルＡ型エ
ポキシ樹脂１００部に対し、ジシアンジアミド４部、メ
チル基８個含有ジヒドロキシジフェニルメタン誘導体２
部、ベンジルジメチルアミン０．２部、メチルオキシト
ール１０0 部を添加したエポキシ樹脂ワニスに、厚み
０．０１８ｍｍの平織ガラス布を樹脂付着量が４５重量
％になるように含浸、乾燥して樹脂含浸基材を得た。次
に該樹脂含浸基材８枚を重ねた上下面に厚み０．０３５
ｍｍの銅箔を各々配設した積層体を成形圧力４０Ｋｇ／
ｃｍ2 、１６０℃で９０分間加熱加圧成形して厚み１．
６ｍｍの両面銅張り積層板を得た。Example: To 100 parts of a bisphenol A type epoxy resin having an epoxy equivalent of 200, 4 parts of dicyandiamide and 8 dimethyldiphenylmethane derivatives containing 8 methyl groups were used.
Part, benzyl dimethylamine 0.2 part, and methyl oxitol 100 parts epoxy resin varnish are impregnated with a 0.018 mm thick plain woven glass cloth so that the resin adhesion amount becomes 45% by weight, and dried to impregnate the resin. A base material was obtained. Next, a thickness of 0.035 is applied to the upper and lower surfaces on which the eight resin-impregnated base materials are stacked.
mm of copper foil is placed on the laminated body and the molding pressure is 40 kg /
thickness of 1. cm 2 at 160 ° C. for 90 minutes.
A 6 mm double-sided copper-clad laminate was obtained.
【０００７】[0007]
【比施例】ジヒドロキシジフェニルメタン誘導体を用い
ない以外は実施例と同様に処理して樹脂含浸基材を得る
と共に厚み１．６ｍｍの両面銅張り積層板を得た。[Comparative Example] A resin-impregnated base material was obtained in the same manner as in Example except that the dihydroxydiphenylmethane derivative was not used, and a double-sided copper-clad laminate having a thickness of 1.6 mm was obtained.
【０００８】実施例及び比較例の電気用積層板の性能は
表１のようである。Table 1 shows the performance of the electrical laminates of Examples and Comparative Examples.
【０００９】[0009]
【表１】 [Table 1]
【００１０】[0010]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する樹脂含浸基材を
用いた電気用積層板はマーキング性に優れ、本発明の優
れていることを確認した。The present invention is constructed as described above.
It was confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has excellent marking properties and is excellent in the present invention.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０８Ｌ 63/02 ＮＫＺ 8830−4Ｊ // Ｂ２９Ｋ 63:00 105:06 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location C08L 63/02 NKZ 8830-4J // B29K 63:00 105: 06
Claims (2)
ェニルメタン誘導体を加え、更に必要に応じて硬化促進
剤、溶剤等を添加したエポキシ樹脂ワニスに基材を含
浸、乾燥したことを特徴とする樹脂含浸基材。1. A resin-impregnated group characterized in that an epoxy resin varnish obtained by adding a curing agent and a dihydroxydiphenylmethane derivative to an epoxy resin, and optionally a curing accelerator, a solvent and the like is impregnated with a base material and dried. Material.
ェニルメタン誘導体を加え、更に必要に応じて硬化促進
剤、溶剤等を添加したエポキシ樹脂ワニスに基材を含
浸、乾燥した樹脂含浸基材の所要枚数の上面及び又は下
面に金属箔を配設ー体化してなることを特徴とする電気
用積層板。2. An epoxy resin varnish obtained by adding a curing agent and a dihydroxydiphenylmethane derivative to an epoxy resin and, if necessary, further adding a curing accelerator, a solvent, etc. An electric laminate comprising an upper surface and / or a lower surface on which metal foils are disposed and integrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29537792A JPH06143264A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29537792A JPH06143264A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06143264A true JPH06143264A (en) | 1994-05-24 |
Family
ID=17819844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29537792A Pending JPH06143264A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06143264A (en) |
-
1992
- 1992-11-04 JP JP29537792A patent/JPH06143264A/en active Pending
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