JPH06143265A - Resin-impregnated base and electrical laminate - Google Patents
Resin-impregnated base and electrical laminateInfo
- Publication number
- JPH06143265A JPH06143265A JP29537892A JP29537892A JPH06143265A JP H06143265 A JPH06143265 A JP H06143265A JP 29537892 A JP29537892 A JP 29537892A JP 29537892 A JP29537892 A JP 29537892A JP H06143265 A JPH06143265 A JP H06143265A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- impregnated
- base material
- impregnated base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 abstract description 29
- 229920000647 polyepoxide Polymers 0.000 abstract description 29
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 abstract description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 235000010290 biphenyl Nutrition 0.000 abstract description 6
- 239000004305 biphenyl Substances 0.000 abstract description 6
- 239000011888 foil Substances 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 239000002966 varnish Substances 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 14
- 239000000835 fiber Substances 0.000 description 5
- 238000005470 impregnation Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子機器、電気機器、計
算器、通信機器等に用いられる樹脂含浸基材、電気用積
層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.
【０００２】[0002]
【従来の技術】近年、電気、電子機器の高信頼化対策と
して耐スミア性が要求されている。このため基板の開穴
工程では細心の配慮が必要で、作業能率の低下は避けら
れなかった。2. Description of the Related Art In recent years, smear resistance has been required as a measure for increasing the reliability of electrical and electronic equipment. For this reason, it is necessary to pay close attention to the opening process of the substrate, and it is inevitable that the work efficiency is lowered.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、耐スミア性を向上させるためには開穴工程の作業
能率が低下する。本発明は従来の技術における上述の問
題点に鑑みてなされたもので、その目的とするところは
開穴工程の作業能率を低下させることなく耐スミア性の
よい基板が得られる樹脂含浸基材、電気用積層板を提供
し電気、電子機器の高信頼化を向上させることにある。As described in the prior art, in order to improve the smear resistance, the work efficiency of the opening process is lowered. The present invention has been made in view of the above problems in the prior art, the object is to obtain a resin-impregnated base material that can obtain a substrate with good smear resistance without lowering the work efficiency of the opening step, The purpose of the present invention is to provide a laminated board for electric use and improve the reliability of electric and electronic devices.
【０００４】[0004]
【課題を解決するための手段】本発明はビフェニル骨格
エポキシ樹脂、臭素化ビスフェノールＡ型エポキシ樹脂
を含むエポキシ樹脂に硬化剤を加え、更に必要に応じて
硬化促進剤、溶剤等を添加したエポキシ樹脂ワニスに基
材を含浸、乾燥した樹脂含浸基材及び該樹脂含浸基材の
所要枚数の上面及び又は下面に金属箔を配設ー体化して
なることを特徴とする電気用積層板のため、上記目的を
達成することができたもので、以下本発明を詳細に説明
する。The present invention is an epoxy resin in which a curing agent is added to an epoxy resin containing a biphenyl skeleton epoxy resin and a brominated bisphenol A type epoxy resin, and a curing accelerator, a solvent and the like are further added if necessary. A varnish is impregnated with a base material, a resin-impregnated base material that has been dried, and a metal foil disposed on and integrated with a required number of upper and / or lower surfaces of the resin-impregnated base material for an electrical laminate, Now that the above object has been achieved, the present invention will be described in detail below.
【０００５】本発明に用いるエポキシ樹脂としては、ビ
フェニル骨格エポキシ樹脂、臭素化ビスフェノールＡ型
エポキシ樹脂を含有していることが必要で、ビフェニル
骨格エポキシ樹脂の添加量はエポキシ樹脂中の５０〜８
５重量％（以下単に％と記す）であることが好ましい。
即ち５０％未満では耐スミア性が向上し難く、８５％を
こえると成形性が低下する傾向にあるからである。臭素
化ビスフェノールＡ型エポキシ樹脂の添加量はエポキシ
樹脂中の１５〜５０％であることが好ましい。即ち１５
％未満では耐スミア性が向上し難く、５０％をこえると
これまた成形性が低下する傾向にあるからである。ビフ
ェニル骨格エポキシ樹脂、臭素化ビスフェノールＡ型エ
ポキシ樹脂以外のエポキシ樹脂としては、フェノ−ルノ
ボラック型エポキシ樹脂、クレゾールノボラック型エポ
キシ樹脂、グリシジルエーテル型エポキシ樹脂、グリシ
ジルエステル型エポキシ樹脂、グリシジルアミン型エポ
キシ樹脂、線状脂肪族エポキシ樹脂、脂環式エポキシ樹
脂、複素環型エポキシ樹脂等の単独、変性物、混合物を
用いることができる。硬化剤としてはフェノ−ル樹脂、
イソシアネート、アミン系硬化剤、酸無水物、ルイス酸
錯化合物、イミダゾール系化合物等が用いられ特に限定
しない。必要に応じて硬化促進剤としては、燐系、３級
アミン系硬化促進剤が用いられる。必要に応じて溶剤と
してはケトン系、アルコール系等のように樹脂と相溶す
るものを用いることができ特に限定しない。更に必要に
応じてタルク、クレー、シリカ、炭酸カルシュウム、水
酸化アルミニゥム、三酸化アンチモン、五酸化アンチモ
ン等の無機質粉末充填剤、ガラス繊維、アスベスト繊
維、パルプ繊維、合成繊維、セラミック繊維等の繊維質
充填剤、着色剤等を添加することができる。基材として
はガラス、アスベスト等の無機質繊維、ポリエステル、
ポリアミド、ポリアクリル、ポリビニルアルコール、ポ
リイミド、フッ素樹脂等の有機質繊維、木綿等の天然繊
維の織布、不織布、紙、マット等を用いることができ
る。基材に対する含浸は同一の樹脂のみによる含浸でも
よいが、同系樹脂又は異系樹脂による１次含浸、２次含
浸というように含浸を複数にし、より含浸が均一になる
ようにすることもできる。かくして基材に樹脂を含浸、
乾燥して樹脂含浸基材を得るものである。金属箔として
は銅、アルミニュウム、真鍮、ニッケル、鉄等の単独、
合金、複合箔を用いることができる。このようにして上
記樹脂含浸基材の所要枚数の上面及び又は下面に金属箔
を配設ー体化して電気用積層板を得るものである。以下
本発明を実施例に基づいて説明する。The epoxy resin used in the present invention needs to contain a biphenyl skeleton epoxy resin and a brominated bisphenol A type epoxy resin, and the addition amount of the biphenyl skeleton epoxy resin is 50 to 8 in the epoxy resin.
It is preferably 5% by weight (hereinafter simply referred to as%).
That is, if it is less than 50%, it is difficult to improve the smear resistance, and if it exceeds 85%, the formability tends to decrease. The addition amount of the brominated bisphenol A type epoxy resin is preferably 15 to 50% of the epoxy resin. That is 15
If it is less than 50%, it is difficult to improve the smear resistance, and if it exceeds 50%, the moldability tends to decrease. Examples of the epoxy resin other than the biphenyl skeleton epoxy resin and the brominated bisphenol A type epoxy resin include phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, A linear aliphatic epoxy resin, an alicyclic epoxy resin, a heterocyclic epoxy resin or the like may be used alone, or as a modified product or a mixture thereof. As a curing agent, phenol resin,
Isocyanates, amine-based curing agents, acid anhydrides, Lewis acid complex compounds, imidazole-based compounds and the like are used without particular limitation. If necessary, a phosphorus-based or tertiary amine-based curing accelerator is used as the curing accelerator. If necessary, a solvent that is compatible with the resin, such as a ketone-based solvent or an alcohol-based solvent, can be used and is not particularly limited. Further, if necessary, inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide and antimony pentoxide, and fiber materials such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber and ceramic fiber. Fillers, colorants and the like can be added. As the base material, glass, inorganic fibers such as asbestos, polyester,
Woven cloth, non-woven cloth, paper, mat and the like of organic fibers such as polyamide, polyacryl, polyvinyl alcohol, polyimide and fluororesin, and natural fibers such as cotton can be used. The base material may be impregnated only with the same resin, but a plurality of impregnations such as primary impregnation with the same resin or different type resin and secondary impregnation may be performed to make the impregnation more uniform. Thus, the base material is impregnated with resin,
The resin-impregnated base material is obtained by drying. As a metal foil, copper, aluminum, brass, nickel, iron etc. alone,
Alloys and composite foils can be used. In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate. The present invention will be described below based on examples.
【０００６】[0006]
【実施例】エポキシ当量１８０のビフェニル骨格エポキ
シ樹脂７０重量部（以下単に部と記す）、エポキシ当量
６５０の臭素化ビスフェノールＡ型エポキシ樹脂３０部
に対し、ジシアンジアミド４部、ベンジルジメチルアミ
ン０．２部、メチルオキシトール１０0 部を添加したエ
ポキシ樹脂ワニスに、厚み０．０１８ｍｍの平織ガラス
布を樹脂付着量が４５％になるように含浸、乾燥して樹
脂含浸基材を得た。次に該樹脂含浸基材８枚を重ねた上
下面に厚み０．０３５ｍｍの銅箔を各々配設した積層体
を成形圧力４０Ｋｇ／ｃｍ2 、１６０℃で９０分間加熱
加圧成形して厚み１．６ｍｍの両面銅張り積層板を得
た。EXAMPLES 70 parts by weight of a biphenyl skeleton epoxy resin having an epoxy equivalent of 180 (hereinafter simply referred to as “part”), 30 parts of a brominated bisphenol A type epoxy resin having an epoxy equivalent of 650, 4 parts of dicyandiamide and 0.2 part of benzyldimethylamine. An epoxy resin varnish containing 100 parts of methyl oxitol was impregnated with a 0.018 mm-thick plain woven glass cloth so that the resin adhesion amount was 45%, and dried to obtain a resin-impregnated base material. Next, a laminated body in which copper foil having a thickness of 0.035 mm is arranged on the upper and lower surfaces of the eight resin-impregnated base materials stacked on each other is heated and pressure-molded at 160 ° C. for 90 minutes at a molding pressure of 40 Kg / cm 2 , and a thickness of 1 is obtained. A 0.6 mm double-sided copper-clad laminate was obtained.
【０００７】[0007]
【比施例】エポキシ当量４７５のビスフェノ−ルＡ型エ
ポキシ樹脂１００部に対し、ジシアンジアミド４部、ベ
ンジルジメチルアミン０．２部、メチルオキシトール１
００部を添加したエポキシ樹脂ワニスを用いた以外は実
施例と同様に処理して樹脂含浸基材を得ると共に厚み
１．６ｍｍの両面銅張り積層板を得た。Comparative Example: To 100 parts of bisphenol A type epoxy resin having an epoxy equivalent of 475, 4 parts of dicyandiamide, 0.2 part of benzyldimethylamine and 1 part of methyloxitol.
A resin-impregnated base material was obtained in the same manner as in the example except that an epoxy resin varnish added with 00 parts was used to obtain a double-sided copper-clad laminate having a thickness of 1.6 mm.
【０００８】実施例及び比較例の電気用積層板の性能は
表１のようである。Table 1 shows the performance of the electrical laminates of Examples and Comparative Examples.
【０００９】[0009]
【表１】 [Table 1]
【００１０】[0010]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する樹脂含浸基材を
用いた電気用積層板は耐スミア性に優れ、本発明の優れ
ていることを確認した。The present invention is constructed as described above.
It has been confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has excellent smear resistance and is excellent in the present invention.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/03 Ｇ 7011−4Ｅ // Ｂ２９Ｋ 63:00 105:06 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 1/03 G 7011-4E // B29K 63:00 105: 06
Claims (2)
フェノールＡ型エポキシ樹脂を含むエポキシ樹脂に硬化
剤を加え、更に必要に応じて硬化促進剤、溶剤等を添加
したエポキシ樹脂ワニスに基材を含浸、乾燥したことを
特徴とする樹脂含浸基材。1. A base material is impregnated into an epoxy resin varnish obtained by adding a curing agent to an epoxy resin containing a biphenyl skeleton epoxy resin and a brominated bisphenol A type epoxy resin, and further adding a curing accelerator, a solvent, etc., if necessary. A resin-impregnated base material characterized by being dried.
フェノールＡ型エポキシ樹脂を含むエポキシ樹脂に硬化
剤を加え、更に必要に応じて硬化促進剤、溶剤等を添加
したエポキシ樹脂ワニスに基材を含浸、乾燥した樹脂含
浸基材の所要枚数の上面及び又は下面に金属箔を配設ー
体化してなることを特徴とする電気用積層板。2. An epoxy resin varnish obtained by adding a curing agent to an epoxy resin containing a biphenyl skeleton epoxy resin or a brominated bisphenol A type epoxy resin, and further adding a curing accelerator, a solvent and the like, if necessary, by impregnating a base material, An electrical laminate comprising: a metal foil disposed on and integrated with a required number of dried resin-impregnated base materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29537892A JPH06143265A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29537892A JPH06143265A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06143265A true JPH06143265A (en) | 1994-05-24 |
Family
ID=17819858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29537892A Pending JPH06143265A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06143265A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0959346A (en) * | 1995-08-28 | 1997-03-04 | Matsushita Electric Works Ltd | Epoxy resin composition for laminate |
-
1992
- 1992-11-04 JP JP29537892A patent/JPH06143265A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0959346A (en) * | 1995-08-28 | 1997-03-04 | Matsushita Electric Works Ltd | Epoxy resin composition for laminate |
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