JPH0719975B2 - Printed circuit board equipment - Google Patents
Printed circuit board equipmentInfo
- Publication number
- JPH0719975B2 JPH0719975B2 JP62122923A JP12292387A JPH0719975B2 JP H0719975 B2 JPH0719975 B2 JP H0719975B2 JP 62122923 A JP62122923 A JP 62122923A JP 12292387 A JP12292387 A JP 12292387A JP H0719975 B2 JPH0719975 B2 JP H0719975B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- case
- waterproof
- waterproof filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 3
- 239000000945 filler Substances 0.000 description 23
- 229920001971 elastomer Polymers 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229920006127 amorphous resin Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Casings For Electric Apparatus (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は防水処理を施したプリント基板装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waterproof printed circuit board device.
従来の技術 例えば洗濯機や自動車等に電子制御装置を搭載する場
合、そのプリント基板は、従来では下記の２つに代表さ
れる方式によって防水性充填材による防水処理が成され
ている。2. Description of the Related Art Conventionally, when an electronic control unit is mounted on a washing machine, an automobile, etc., its printed circuit board is conventionally waterproofed by a waterproof filler by the following two methods.
第１の方式は、第３図（ａ）に示すようにプリント基板
６を、プリント基板６に設けた穴部6aを貫通するような
位置決め用ボス部７を有するケース８を配置し、その
後、ケース８内部に防水性充填材９を注入して硬化する
方式である。In the first method, as shown in FIG. 3 (a), the printed circuit board 6 is arranged, and the case 8 having the positioning boss portion 7 penetrating the hole 6a provided in the printed circuit board 6 is arranged, and then, This is a method in which a waterproof filling material 9 is injected into the case 8 and cured.
第２の方式は、第４図（ａ）に示すようにプリント基板
11を、シリコーンゴム等のような離型性の良いゴム型10
に配置した後、ゴム型10の内部に防水性充填材12を注入
硬化し、その後ゴム型10より防水性充填材12と一体化し
たプリント基板11を脱型する方式である。The second method is a printed circuit board as shown in FIG.
11 is a rubber mold 10 with good releasability such as silicone rubber
After that, the waterproof filler 12 is injected and cured into the rubber mold 10, and then the printed board 11 integrated with the waterproof filler 12 is released from the rubber mold 10.
発明が解決しようとする問題点 第３図（ａ）の方式ではプリント基板６がケース８の位
置決めボス部７によって機械的にケースに固定されてい
て、防水性充填材９を介してケース８と一体化している
ため、冷熱サイクル等によってケース８と防水性充填材
９との線膨張係数差による寸法収縮差が生じ、第３図
（ｂ）のように冷熱サイクルを与えるとプリント基板装
置に「反り」となって現われる。このような状況では実
装部品、及びその接合部に力が作用してプリント基板ユ
ニットの不良原因になるなどの問題点があった。Problems to be Solved by the Invention In the method shown in FIG. 3 (a), the printed circuit board 6 is mechanically fixed to the case by the positioning boss portion 7 of the case 8, and the case 8 and the case 8 are interposed via the waterproof filler 9. Since they are integrated, a difference in dimensional shrinkage occurs due to a difference in linear expansion coefficient between the case 8 and the waterproof filler 9 due to a cooling / heating cycle or the like, and when a cooling / heating cycle is applied as shown in FIG. It appears as "warp". In such a situation, there is a problem that a force acts on the mounted component and the joint portion thereof to cause a defect of the printed circuit board unit.
第４図（ａ）の方式ではゴム型10を用いるため、ゴム型
10用に余分な材料代が発生すると同時に、第４図（ｂ）
のように脱型するという作業工程が必要となる問題点が
あった。Since the rubber mold 10 is used in the method of FIG.
At the same time as an extra material charge is generated for 10, at the same time as shown in Fig. 4 (b).
As described above, there is a problem that a work process of removing the mold is required.
本発明は冷熱サイクル等によってもプリント基板に不要
な力が作用せず、しかも脱型という余分な作業工程が不
必要なプリント基板の防水処理装置を提供することを目
的とする。An object of the present invention is to provide a waterproofing device for a printed circuit board in which an unnecessary force does not act on the printed circuit board even by a heat cycle or the like, and which does not require an extra work step such as demolding.
問題点を解決するための手段 上記目的を達成するために本発明のプリント基板装置
は、電装部品を実装したプリント基板を内部に配置した
スチロール系合成樹脂からなるケースと、ケース内に前
記電装部品の導電部が被覆可能な高さまで充填固化した
ウレタン系樹脂からなる防水性充填材と、前記ケースと
防水性充填材との間に形成したフッ素系樹脂よりなる層
とを備えた構成である。Means for Solving the Problems In order to achieve the above object, a printed circuit board device of the present invention includes a case made of styrene-based synthetic resin in which a printed circuit board on which electrical components are mounted is disposed, and the electrical component in the case. The waterproof filler made of urethane resin filled and solidified to a height at which the conductive portion can be covered, and a layer made of fluorine resin formed between the case and the waterproof filler.
作用 この構成によるとプリント基板はケース内に配置してプ
リント基板を機械的にケースと一体化することはせず、
さらにケースと防水性充填材とが接着力をもたないよう
に、ケースと防水性充填材との界面にフッ素系樹脂より
なる層を形成したため、冷熱サイクル等によって線膨張
係数差による収縮差が生じてもケースと防水性充填材と
の界面でのスベリ現象によって吸収できる。Function According to this configuration, the printed circuit board is not placed in the case and the printed circuit board is not mechanically integrated with the case,
Furthermore, since a layer made of a fluororesin is formed at the interface between the case and the waterproof filler so that the case and the waterproof filler do not have adhesive force, there is a difference in shrinkage due to the difference in linear expansion coefficient due to a thermal cycle or the like. Even if it occurs, it can be absorbed by the sliding phenomenon at the interface between the case and the waterproof filler.
実施例 以下、本発明の実施例を第１図および第２図に基づいて
説明する。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
本実施例におけるプリント基板装置の構成は第１図に示
すように、各種電装部品１を実装したプリント基板２
を、一側が開口したケース３内に配置する。ケース３内
部には防水性充填材４を前記電装部品１の導電部が被覆
可能な高さまで注入して硬化する。As shown in FIG. 1, the structure of the printed circuit board device in this embodiment is a printed circuit board 2 on which various electrical components 1 are mounted.
Is placed in the case 3 having an opening on one side. The waterproof filler 4 is injected into the case 3 to a height at which the conductive part of the electrical component 1 can be covered and cured.
前記ケース３は、合成樹脂からなる成型品で、材質とし
ては、非晶性樹脂であるスチロール系のものを用いる。
例えば、ポリプロピレンに代表されるような結晶性の樹
脂を用いると、防水性充填材４を注入して硬化した後も
ケース３があと収縮をおこし、内部の防水性充填材４の
存在によりケース３に力が加わり、その力が大きくなっ
た場合は、プリント基板装置に「反り」やケース３に割
れが生じることがあった。従って本発明の構成ではケー
ス３の材質としては、あと収縮のない非晶性樹脂である
スチロール系のものが好適である。防水性充填材４は、
耐湿性がよいことはもちろん、冷熱サイクル等によって
プリント基板２に実装してある各種電装部品１の接合部
であるハンダ接合部にストレスによるクラックが発生し
ないよう考慮し、常温においてはもちろんのこと、低温
においてもゴム弾性を有する材質のものがよい。具体的
にウレタン系樹脂よりなる防水性充填材が好適である。
ウレタン系樹脂のものは、防水性充填材として一般に用
いられているエポキシ系樹脂のものに比べ低温でもゴム
弾性を有するため、部品接合部へ加わるストレスが少な
く、耐湿性が良好である。また硬化が速いとか、作業上
安全であるといった利点もある。The case 3 is a molded product made of synthetic resin, and the material used is a styrene type which is an amorphous resin.
For example, when a crystalline resin typified by polypropylene is used, the case 3 further shrinks even after the waterproof filler 4 is injected and cured, and the presence of the waterproof filler 4 inside causes the case 3 to shrink. When a force is applied to the printed circuit board device and the force is increased, "warpage" of the printed circuit board device or cracking of the case 3 may occur. Therefore, in the configuration of the present invention, the material of the case 3 is preferably a styrene type which is an amorphous resin that does not shrink. The waterproof filler 4 is
In addition to having good moisture resistance, at the room temperature, not to mention that cracks due to stress do not occur in the solder joints that are joints of various electrical components 1 mounted on the printed circuit board 2 due to a heat cycle, etc. A material having rubber elasticity even at a low temperature is preferable. Specifically, a waterproof filler made of urethane resin is suitable.
Urethane-based resins have rubber elasticity even at low temperatures as compared with epoxy-based resins generally used as waterproof fillers, so that less stress is applied to the joints of parts and moisture resistance is good. It also has the advantage that it cures quickly and is safe in operation.
次にフッ素系樹脂よりなる層５の働きについて説明す
る。第１図に示すような構成で、ケース３にスチロール
系合成樹脂、防水性充填材４にウレタン系樹脂を用いた
場合、両者の界面で接着力が発生する。この接着力によ
って冷熱サイクルでプリント基板装置に「反り」やケー
ス割れが生じる。これは、ケース３と防水性充填材４と
の線膨張係数が異なるために生じる現象である。両者の
熱収縮差を吸収するためには、両者の界面で滑りを起こ
すことが必要であり、この役目を果たすのがフッ素系樹
脂よりなる層５である。発明者らが考えた方法では、フ
ッ素系樹脂よりなる層５をケース３内部へ防水性充填材
４を注入硬化する前に、塗布または浸漬によって形成す
る。このためフッ素樹脂よりなる層の厚みは付着程度で
あるがこれを層と呼ぶ。また層５の目的は、ケース３と
防水性充填材４との間に接着力をもたせないことからフ
ッ素系樹脂以外にシリコーン系樹脂のものの使用も考え
られるが、シリコーン系樹脂は、電装部品の接点に付着
した場合、接点不良を起こすことが知られており、今回
の用途には不適当で、フッ素系樹脂の方が適当である。Next, the function of the layer 5 made of a fluororesin will be described. When a styrene-based synthetic resin is used for the case 3 and a urethane-based resin is used for the waterproof filler 4 in the structure as shown in FIG. 1, an adhesive force is generated at the interface between the two. This adhesive force causes "warpage" and case cracking in the printed circuit board device during the thermal cycle. This is a phenomenon that occurs because the linear expansion coefficients of the case 3 and the waterproof filler 4 are different. In order to absorb the difference in heat shrinkage between the two, it is necessary to cause slippage at the interface between the two, and the layer 5 made of a fluororesin plays this role. According to the method considered by the inventors, the layer 5 made of a fluororesin is formed by coating or dipping before injecting and hardening the waterproof filler 4 into the case 3. For this reason, the thickness of the layer made of fluororesin is about the amount of adhesion, but this is called a layer. Further, the purpose of the layer 5 is to use a silicone resin other than the fluororesin because it does not have an adhesive force between the case 3 and the waterproof filling material 4. However, the silicone resin is used as an electrical component. It is known that when it adheres to the contact, it causes contact failure, and it is unsuitable for this application, and fluorine resin is more suitable.
第２図は、フッ素系樹脂よりなる層５を設けたプリント
基板装置と設けなかったものとで冷熱サイクルを行った
っときの「反り」やケース割れ等の不良発生を比較した
もので、フッ素系樹脂よりなる層５が有効に律いている
ことが明らかである。Fig. 2 compares the occurrence of defects such as "warping" and case cracking when a thermal cycle was performed between a printed circuit board device provided with a layer 5 made of a fluororesin and one not provided. It is clear that the layer 5 made of resin effectively regulates.
発明の効果 以上実施例の説明から明らかなように本発明のプリント
基板の防水処理装置では、ケースを用いているためプリ
ント基板の防水性充填材による連続処理が可能となり、
ゴム型を用いた場合のように脱型する必要がなく量産性
がよい。ケースと防水性充填材処理されたプリント基板
とはフッ素系樹脂よりなる層により一体化されていない
ため、ケースと防水性充填材との線膨張係数が異なる場
合においても、冷熱サイクル等での「反り」やケース割
れが発生せずプリント基板装置の信頼性が向上するもの
である。EFFECTS OF THE INVENTION As is apparent from the above description of the embodiments, in the printed circuit board waterproof treatment apparatus of the present invention, since the case is used, continuous treatment of the printed circuit board with the waterproof filler is possible,
There is no need to remove the mold as in the case of using a rubber mold, and mass productivity is good. Since the case and the waterproof filler-treated printed circuit board are not integrated by the layer made of fluorocarbon resin, even when the case and the waterproof filler have different coefficients of linear expansion, " The warp "and the case crack do not occur, and the reliability of the printed circuit board device is improved.
第１図は本発明の一実施例におけるプリント基板装置の
断面図、第２図は冷熱サイクルのプリント基板装置の不
良発生状況を示す図、第３図は従来のプリント基板装置
の冷熱サイクル前後の断面図、第４図は従来のゴム型使
用のプリント基板装置の製造工程図である。 １……電装部品、２……プリント基板、３……ケース、
４……防水性充填材、５……層。FIG. 1 is a cross-sectional view of a printed circuit board device according to an embodiment of the present invention, FIG. 2 is a diagram showing a defect occurrence state of the printed circuit board device in a cooling / heating cycle, and FIG. A sectional view and FIG. 4 are manufacturing process diagrams of a conventional printed circuit board device using a rubber mold. 1 ... Electrical components, 2 ... Printed circuit board, 3 ... Case,
4 ... Waterproof filler, 5 ... layer.
フロントページの続き (72)発明者 今橋 久之 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 特開 昭60−125107（ＪＰ，Ａ) 実開 昭62−34474（ＪＰ，Ｕ)Front page continuation (72) Inventor Hisayuki Imahashi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-60-125107 (JP, A) U)
Claims (1)
配設するスチロール系の合成樹脂からなるケースと、ケ
ース内に前記電装部品の導電部が被覆可能な高さまで充
填固化したウレタン系樹脂からなる防水性充填材と、前
記ケースと防水性充填材との間に形成したフッ素系樹脂
よりなる層とを備えたプリント基板装置。1. A case made of a styrene-based synthetic resin in which a printed circuit board on which electrical components are mounted is disposed, and a urethane resin filled and solidified to a height at which a conductive portion of the electrical component can be covered in the case. A printed circuit board device comprising: a waterproof filling material; and a layer made of a fluororesin formed between the case and the waterproof filling material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62122923A JPH0719975B2 (en) | 1987-05-20 | 1987-05-20 | Printed circuit board equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62122923A JPH0719975B2 (en) | 1987-05-20 | 1987-05-20 | Printed circuit board equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63288096A JPS63288096A (en) | 1988-11-25 |
| JPH0719975B2 true JPH0719975B2 (en) | 1995-03-06 |
Family
ID=14847951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62122923A Expired - Fee Related JPH0719975B2 (en) | 1987-05-20 | 1987-05-20 | Printed circuit board equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719975B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60125107A (en) * | 1983-12-07 | 1985-07-04 | 昭和電線電纜株式会社 | Method of forming mold stress cone |
| JPS6234474U (en) * | 1985-08-15 | 1987-02-28 |
-
1987
- 1987-05-20 JP JP62122923A patent/JPH0719975B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63288096A (en) | 1988-11-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |