JPH07201655A - Multilayer electronic device - Google Patents

Abstract

PURPOSE:To obtain a multilayer electronic device in which delamination is prevented even when inner electrodes are laminated in multilayer. CONSTITUTION:A noise filter 1 comprises a plurality of insulator sheets 2, signal conductors 4, 5 and ground conductors 3, 6. The conductors 3-6 are formed by coating the surface of the insulator sheet with a conductive paste by screen printing and then drying. The conductors 3-6 are normally thicker at the fringe parts 3a-6a as compared with the central parts 3b-6b. Each of the signal conductors 4, 5 is provided, respectively, at left-of-center and right-of- center positions with bent parts 4e and 5e which are bent in the breadthwise direction of the signal conductors 4, 5. The bending shape of signal conductors 4, 5 is set such that the fringe parts 3a-6a of the conductors 3-6 are not overlapped easily in the thickness direction when the conductors 3-6 are laminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component used for forming various electronic circuits, particularly a capacitor and a filter.

[0002]

2. Description of the Related Art Hitherto, there has been known a laminated electronic component manufactured by stacking a plurality of insulators and a plurality of inner conductors and firing them integrally. In this electronic component, when dozens of internal conductors having substantially the same shape and overlapping each other are laminated, there is a problem that delamination easily occurs. The reason is that when the inner conductor is formed by means of screen printing, the conductor thickness at the edge becomes thicker than at the center of the inner conductor, and when several tens of inner conductors are stacked, the edge becomes thicker in the thickness direction. This is because the thickness of the laminated body varies due to the overlapping, and the distortion due to the difference in shrinkage ratio between the internal conductor and the insulator generated during firing becomes large.

Therefore, an object of the present invention is to provide a laminated electronic component in which delamination does not occur even if a large number of internal conductors are laminated.

[0004]

In order to solve the above-mentioned problems, the laminated electronic component according to the present invention is such that at least one of the overlapping inner conductors has at least a part of its edge remaining as the inner conductor. Not to overlap the edge of
It is characterized in that the inner conductor is bent in the width direction, the conductor width is set to a dimension different from the conductor width of the remaining inner conductors, or the arrangement position is shifted with respect to the remaining inner conductors. .

With the above structure, the overlap of the edges of the internal conductors is reduced as compared with the conventional laminated electronic component.
Even if a large number of internal conductors are laminated, variations in the thickness of the laminated body are less likely to occur, and distortion due to the difference in contraction rate between the internal conductor and the insulator that occurs during firing is reduced. Further, the multilayer electronic component according to the present invention, at least one of the insulating sheets provided with overlapping inner conductors on the surface thereof, is provided with a hole or a recess at least at a part of the edge portion of the inner conductor. An edge portion of the internal conductor is arranged in the recess.

Since the edge portion of the inner conductor is arranged in the hole or the recess provided in the insulator sheet, the thickness of the edge portion of the inner conductor from the surface of the insulator sheet is reduced by the hole or the recess portion. Become. Therefore, even if a large number of internal conductors are laminated, variations in the thickness of the laminated body are less likely to occur, and distortion caused by the difference in shrinkage rate between the internal conductor and the insulating sheet during firing is reduced.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a laminated electronic component according to the present invention will be described below with reference to the accompanying drawings. In each embodiment, a three-terminal type noise filter will be described as an example of the multilayer electronic component. [First Embodiment, FIGS. 1 to 5] As shown in FIG. 1, a noise filter 1 is composed of a plurality of insulating sheets 2, signal conductors 4 and 5, and ground conductors 3 and 6. As the material of the insulator sheet 2, ceramics such as barium titanate is used.

The conductors 3 to 6 are made of Ag, Ag-Pd, Cu,
It is formed by applying a conductive paste such as Ni on the surface of the insulator sheet 2 by means of screen printing and drying. In this case, the edges 3a, 4a, 5a of the conductors 3 to 6,
The thickness of 6a is usually thicker than that of the central portions 3b, 4b, 5b, 6b (see FIG. 3). Ground conductor 3,
One of the drawn-out portions 3c and 6c of 6 is exposed on the front side of the insulating sheet 2, and the other of the drawn-out portions 3d and 6d is exposed on the rear side of the insulating sheet 2. One of the lead portions 4c and 5c of the signal conductors 4 and 5 is exposed on the left side of the insulator sheet 2, and the other of the lead portions 4d and 5c.
Each of d is exposed on the right side of the insulator sheet 2. The signal conductors 4 and 5 are respectively provided with a bent portion 4 at a position on the left side of the center.
e and a bent portion 5e at a position from the right of the center, and has a shape bent in the width direction of the signal conductors 4 and 5. The bent shapes of the signal conductors 4 and 5 are set such that the edges 3a to 6a of the conductors 3 to 6 are less likely to overlap in the thickness direction when the conductors 3 to 6 are stacked.

An insulating sheet 2 having conductors 3 to 6 on its surface and a protective insulating sheet 2 having nothing on the surface are stacked. At this time, as shown in FIGS. 2 and 3, due to the bent shapes of the signal conductors 4 and 5, the overlaps of the edge portions 3a to 6a of the conductors 3 to 6, that is, the thick portions are reduced as compared with the conventional filter. Therefore, the distortion due to the difference in shrinkage between the conductors 3 to 6 and the insulator sheet 2 that occurs during firing in the subsequent step is reduced, and delamination is less likely to occur.

The stacked insulator sheets 2 are molded and fired to form the noise filter 1. In the laminated state, capacitance is formed between the signal conductors 4 and 5 and the ground conductors 3 and 6. As shown in FIG. 4, the filter 1
Are provided with input / output electrodes 16 and 17 at both ends, and ground electrodes 18 are provided on the front and back side surfaces, respectively.
a and 18b are provided. The input / output electrode 16 is electrically connected to one of the lead-out portions 4c, 5c of the signal conductors 4, 5, and the input / output electrode 17 is electrically connected to the other lead-out portion 4d, 5d of the signal conductors 4, 5. The ground electrode 18a is electrically connected to one of the lead portions 3c and 6c of the ground conductors 3 and 6, and the ground electrode 18b is electrically connected to the other lead portions 3d and 6d of the ground conductors 3 and 6. FIG. 5 is an electrical equivalent circuit diagram of the noise filter 1.

[Second Embodiment, FIGS. 6 to 8] As shown in FIG. 6, the noise filter 21 is composed of a plurality of insulator sheets 22, a signal conductor 23 and a ground conductor 24.
The conductors 23 and 24 are formed on the surface of the insulator sheet 22 by means of screen printing. Also in this case, the conductors 23, 2
The thickness of the edge portions 23a, 24a of 4 is normally the central portion 23b,
It is thicker than 24b (see FIG. 7). The lead portions 23c and 23d of the signal conductor 23 are exposed on the left side and the right side of the insulator sheet 22, respectively. Ground conductor 2
4 is the insulating sheet 2
It is exposed on the front and back sides of 2. Signal conductor 23
The conductor width is designed to be narrower than the conductor width of the ground conductor 24.

An insulating sheet 22 having conductors 23 and 24 on its surface and a protective insulating sheet 22 having nothing on the surface are stacked. As shown in FIG. 7, since the conductor width of the signal conductor 23 is narrower than the conductor width of the ground conductor 24, the overlapping of the edges 23a and 24a of the conductors 23 and 24, that is, the thick portions is reduced as compared with the conventional filter. To do.
Therefore, the conductors 23 and 24 generated during firing in the subsequent process
The strain due to the difference in shrinkage ratio between the insulating sheet 22 and the insulating sheet 22 is reduced, and delamination is less likely to occur.

The stacked insulator sheets 22 are molded and fired to form the noise filter 21. In the stacked state, capacitance is formed between the signal conductor 23 and the ground conductor 24. As shown in FIG.
Are provided with input / output electrodes 26 and 27 at both ends, and ground electrodes 28 are provided on the front and back side surfaces, respectively.
a and 28b are provided. The input / output electrodes 26 and 27 are electrically connected to the lead portions 23c and 23d of the signal conductor 23, respectively, and the ground electrodes 28a and 28b are electrically connected to the lead portions 24c and 24d of the ground conductor 24, respectively.

[Third Embodiment, FIGS. 9 to 11] As shown in FIG. 9, the noise filter 31 includes a plurality of insulating sheets 32.
And the signal conductors 34 and 35 and the ground conductor 33. Further, the insulator sheet 32 having the signal conductor 34 on its surface is provided with a slit-shaped hole 36 at a position where the edge portion of the signal conductor 34 is disposed.

For the conductors 33 to 35, a conductive paste is applied to the surface of the insulator sheet 32 by means of screen printing,
It is formed by drying. Also in this case, the conductor 33-
The thickness of the edge portions 33a to 35a of 35 is normally the central portion 33b.
It is thicker than that of ~ 35b (see FIG. 10). However, with respect to the conductor 34, since the conductive paste penetrates into the slit-shaped hole 36, the conductor thickness of the edge portion 34a from the surface of the insulating sheet is substantially equal to the conductor thickness of the central portion 34b, or more than that. Is also thinning. The lead-out portions 33c and 33d of the ground conductor 33 are exposed on the front side and the back side of the insulator sheet 32, respectively. Lead-out portions 34c, 35c, 34d, 3 of the signal conductors 34, 35
5d is exposed on the left side and the right side of the insulator sheet 32, respectively.

An insulating sheet 32 having conductors 33, 34 and 35 on its surface and a protective insulating sheet (not shown) having nothing on the surface are stacked. In the stacked state, as shown in FIG. 10, the edge portion 35 of the signal conductor 35 is
a is the edge portion 3 of the signal conductor 34 through the slit-shaped hole 36.
4a is electrically connected to form an electrostatic capacitance between the signal conductors 34 and 35 and the ground conductor 33. Since the thickness of the edge portion 34a of the signal conductor 34 from the surface of the insulator sheet is reduced by the slit-shaped holes 36 provided in the insulator sheet 32, the conductor 33 generated during firing in a later step. The strain due to the difference between the shrinkage ratios of .about.35 and the insulating sheet 32 is reduced, and delamination is less likely to occur.
The insulator sheet forming the slit holes 36 is not limited to the sheet provided with the conductor 34. However, if a short circuit may occur due to the holes 36, another insulating sheet may be inserted.

The stacked insulator sheets 32 are molded and fired to form the noise filter 31. In the stacked state, capacitance is formed between the signal conductors 34 and 35 and the ground conductor 33. As shown in FIG. 11, the filter 31 is provided with input / output electrodes 38 and 39 at both ends, and ground electrodes 40a and 40b are provided on the front and back side surfaces, respectively. The input / output electrode 38 is electrically connected to one of the lead portions 34c, 35c of the signal conductors 34, 35, and the input / output electrode 39 is electrically connected to the other lead portion 34d, 35d of the signal conductors 34, 35. The ground electrodes 40a and 40b are electrically connected to the lead portions 33c and 33d of the ground conductor 33, respectively.

[Fourth Embodiment, FIGS. 12 to 14] As shown in FIG. 12, the noise filter 41 is composed of a plurality of insulating sheets 42, signal conductors 44 and 45, and ground conductors 43 and 46. . The conductors 43 to 46 are formed on the surface of the insulator sheet 42 by means of screen printing. Also in this case, the edges 43a, 44a, 45a of the conductors 43 to 46,
The thickness of 46a is normally the central portion 43b, 44b, 45b,
It is thicker than 46b (see FIG. 13). One of the lead portions 43c and 46c of the ground conductors 43 and 46 is exposed on the front side of the insulator sheet 42, and the other lead portions 43d and 46d of the ground conductors 43 and 46 are attached to the insulator sheet 42.
Is exposed on the back side of the. One of the lead-out portions 44c and 45c of the signal conductors 44 and 45 is the insulator sheet 42 respectively.
Of the lead-out portions 44d and 45d are exposed to the right side of the insulator sheet 42. The arrangement position of the signal conductor 45 is such that when the conductors 43 to 46 are stacked,
The edge portion 45a is the edge portion 43a of the other conductor 43, 44, 46,
44a, 46a so that they do not overlap, the conductors 43, 44,
It is displaced in the width direction with respect to 46.

An insulating sheet 42 having conductors 43 to 46 on the surface and a protective insulating sheet (not shown) having nothing on the surface are stacked. At this time, as shown in FIG. 13, the overlap of the edge portions 43a to 46a of the conductors 43 to 46, that is, the thick portions is reduced as compared with the conventional filter. Therefore, the conductor 4 generated during firing in the subsequent process
The strain due to the difference between the shrinkage rates of 3 to 46 and the insulating sheet 42 is reduced, and delamination is less likely to occur.

The stacked insulator sheets 42 are molded and fired to form the noise filter 41. In the stacked state, the signal conductors 44 and 45 and the ground conductor 43,
A capacitance is formed between 46. As shown in FIG. 14, the filter 41 has input / output electrodes 48, 49 at both ends.
And ground electrodes 50a and 50b are provided on the front and back side surfaces, respectively. The input / output electrode 48 is one of the lead portions 44c, 4 of the signal conductors 44, 45.
5c and the input / output electrode 49 is electrically connected to the signal conductor 4
4, 45 are electrically connected to the other lead-out portions 44d and 45d, the ground electrode 50a is electrically connected to one of the lead-out portions 43c and 46c of the ground conductors 43 and 46, and the ground electrode 50b is connected to the ground conductor 43, It is electrically connected to the other lead-out portions 43d and 46d of 46.

[Other Embodiments] The laminated electronic component according to the present invention is not limited to the above-mentioned embodiments, but can be variously modified within the scope of the gist thereof. Although the above embodiment has been described by taking the noise filter as an example, it may be a simple capacitor or the like.

Further, in the third embodiment, an insulating sheet provided with slit holes is used.
Also, as shown in FIG. 16, even if the insulating sheet 52 provided with the circular recess 55 is used, a laminated electronic component having the same effect can be obtained. The concave portion 55 is provided at a position where the edge portion 53a of the internal conductor 53 is arranged. Further, in the present invention, it is desirable that the edges of the inner conductor do not overlap as much as possible, but it is not always necessary that the entire edges do not overlap.

Further, in each of the above embodiments, the insulating sheets are stacked and then integrally fired, but the invention is not necessarily limited to this. For example, you may manufacture a laminated body by the manufacturing method demonstrated below. A paste-like insulator material is applied and dried to form an insulator material film, and then a paste-like internal conductor material is applied to the surface of the insulator material film and dried to form an internal conductor. In this way, a laminated body is formed by sequentially applying the layers, and then integrally fired.

[0024]

As is apparent from the above description, according to the present invention, at least one of the inner conductors has a shape bent in the width direction or has a conductor width different from that of the remaining inner conductors. Since the inner conductor is arranged or displaced from the rest of the inner conductor, the overlap of the edges of the inner conductor in the thickness direction is reduced as compared with the conventional laminated electronic component. Therefore, it is possible to obtain a laminated electronic component in which delamination does not occur even if a large number of internal conductors are laminated.

Further, since at least one of the insulator sheets is provided with a hole or a recess and the edge portion of the internal conductor is arranged in this hole or recess, the thickness of the edge portion of the internal conductor from the surface of the insulator sheet is set. Are reduced by holes or recesses.
Therefore, even if a large number of internal conductors are laminated, it is possible to obtain a conductor that does not cause delamination.

[Brief description of drawings]

FIG. 1 is an assembled perspective view showing a first embodiment of a multilayer electronic component according to the present invention.

FIG. 2 is a plan view showing the positional relationship of internal conductors of the multilayer electronic component shown in FIG.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a perspective view showing the appearance of the multilayer electronic component shown in FIG.

5 is an electrical equivalent circuit diagram of the multilayer electronic component shown in FIG.

FIG. 6 is an assembled perspective view showing a second embodiment of the multilayer electronic component according to the present invention.

7 is a sectional view taken along line VII-VII of FIG.

8 is a perspective view showing an appearance of the multilayer electronic component shown in FIG.

FIG. 9 is an assembled perspective view showing a third embodiment of the multilayer electronic component according to the present invention.

10 is a cross-sectional view taken along line XX of FIG.

11 is a perspective view showing the external appearance of the multilayer electronic component shown in FIG.

FIG. 12 is an assembled perspective view showing a fourth embodiment of a multilayer electronic component according to the present invention.

13 is a sectional view taken along line XIII-XIII in FIG.

14 is a perspective view showing the outer appearance of the multilayer electronic component shown in FIG.

FIG. 15 is a perspective view showing another embodiment.

16 is a sectional view taken along line XVI-XVI shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Noise filter 2 ... Insulator sheet 3, 6 ... Ground conductor 4,5 ... Signal conductor 3a, 4a, 5a, 6a ... Edge part 4e, 5e ... Bending part 21 ... Noise filter 22 ... Insulator sheet 23 ... Signal conductor 24 ... Ground conductor 23a, 24a ... Edge part 31 ... Noise filter 32 ... Insulator sheet 33 ... Ground conductor 34, 35 ... Signal conductor 33a, 34a, 35a ... Edge part 36 ... Slit-like hole 41 ... Noise filter 42 ... Insulation Body sheet 43, 46 ... Ground conductor 44, 45 ... Signal conductor 43a, 44a, 45a, 46a ... Edge 52 ... Insulator sheet 53 ... Signal conductor 53a ... Edge 55 ... Circular recess

Claims (4)

[Claims] 1. In a laminated electronic component constituted by laminating a plurality of insulators and a plurality of internal conductors, at least one of the overlapping internal conductors has at least a part of its edge portion at the edge portion of the remaining internal conductor. A multilayer electronic component having a shape in which the inner conductor is bent in the width direction so as not to overlap with each other. 2. In a laminated electronic component formed by laminating a plurality of insulators and a plurality of inner conductors, at least one of the overlapping inner conductors has at least a part of its edge portion at the edge portion of the remaining inner conductor. A multilayer electronic component, wherein the conductor width is set to a dimension different from the conductor widths of the remaining inner conductors so as not to overlap. 3. A laminated electronic component comprising a plurality of insulating sheets having inner conductors provided on the surface thereof, wherein at least one of the insulating sheets provided with overlapping inner conductors has an edge portion of the inner conductor. 2. A multilayer electronic component, wherein a hole or a recess is provided in at least a part of the position, and the edge portion of the internal conductor is disposed in the hole or the recess. 4. A laminated electronic component formed by laminating a plurality of insulators and a plurality of internal conductors, wherein at least one of the overlapping internal conductors has substantially the same shape and at least a part of the edge portion remains. A laminated electronic component, wherein the arrangement position is displaced with respect to the remaining inner conductors so as not to overlap the edges of the inner conductors.