JPH0727650Y2 - 印刷回路機器 - Google Patents
印刷回路機器Info
- Publication number
- JPH0727650Y2 JPH0727650Y2 JP2207887U JP2207887U JPH0727650Y2 JP H0727650 Y2 JPH0727650 Y2 JP H0727650Y2 JP 2207887 U JP2207887 U JP 2207887U JP 2207887 U JP2207887 U JP 2207887U JP H0727650 Y2 JPH0727650 Y2 JP H0727650Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- housing
- soldering
- solder
- lifter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2207887U JPH0727650Y2 (ja) | 1987-02-19 | 1987-02-19 | 印刷回路機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2207887U JPH0727650Y2 (ja) | 1987-02-19 | 1987-02-19 | 印刷回路機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63131187U JPS63131187U (2) | 1988-08-26 |
| JPH0727650Y2 true JPH0727650Y2 (ja) | 1995-06-21 |
Family
ID=30819118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2207887U Expired - Lifetime JPH0727650Y2 (ja) | 1987-02-19 | 1987-02-19 | 印刷回路機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727650Y2 (2) |
-
1987
- 1987-02-19 JP JP2207887U patent/JPH0727650Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63131187U (2) | 1988-08-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6051781A (en) | Surface mount electromagnetic frequency interference shield clip | |
| JP3064756U (ja) | ア―ス用端子 | |
| JPH0727650Y2 (ja) | 印刷回路機器 | |
| JPS63229895A (ja) | ハンダ付け方法 | |
| JPH04129290A (ja) | 混成集積回路装置 | |
| JPS6017849Y2 (ja) | ボビン | |
| EP0976309B1 (en) | Case for circuit boards | |
| JPH062301Y2 (ja) | 部品取付装置 | |
| JP2591374B2 (ja) | 電子部品の位置決め器具 | |
| JPH0677620A (ja) | 電子部品実装構造 | |
| JPH0432792Y2 (2) | ||
| JPH0433650Y2 (2) | ||
| JPH056665Y2 (2) | ||
| JP2545679Y2 (ja) | プリント基板のタブ端子用ランド形状 | |
| JPH05335764A (ja) | 電子回路装置とその製造方法 | |
| JPH0964526A (ja) | 電子部品の実装方法 | |
| JPH0582999A (ja) | 表面実装部品の実装方法および表面実装部品 | |
| JPH02148710A (ja) | リード端子付回路部品の挿入組付け方法 | |
| JPS63229896A (ja) | ハンダ付け方法 | |
| JP2767677B2 (ja) | リフロー時におけるメモリ用コネクタとプリント基板の仮止め方法 | |
| JPH04171992A (ja) | プリント基板の部品取付装置 | |
| JPH0785961A (ja) | 高周波加熱装置 | |
| JPH08150469A (ja) | 電子部品の半田付け装置 | |
| JPS6380513A (ja) | 磁気部品用ボビン | |
| JPH04163987A (ja) | チップ部品実装方式 |