JPH0744025Y2 - リードの半田メッキ装置 - Google Patents

リードの半田メッキ装置

Info

Publication number
JPH0744025Y2
JPH0744025Y2 JP1990119689U JP11968990U JPH0744025Y2 JP H0744025 Y2 JPH0744025 Y2 JP H0744025Y2 JP 1990119689 U JP1990119689 U JP 1990119689U JP 11968990 U JP11968990 U JP 11968990U JP H0744025 Y2 JPH0744025 Y2 JP H0744025Y2
Authority
JP
Japan
Prior art keywords
solder plating
leads
lead
cathode
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990119689U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0476052U (2
Inventor
篤佳 太田
孝義 山村
清矢 西村
正良 高林
義久 前嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Priority to JP1990119689U priority Critical patent/JPH0744025Y2/ja
Publication of JPH0476052U publication Critical patent/JPH0476052U/ja
Application granted granted Critical
Publication of JPH0744025Y2 publication Critical patent/JPH0744025Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990119689U 1990-11-15 1990-11-15 リードの半田メッキ装置 Expired - Lifetime JPH0744025Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990119689U JPH0744025Y2 (ja) 1990-11-15 1990-11-15 リードの半田メッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990119689U JPH0744025Y2 (ja) 1990-11-15 1990-11-15 リードの半田メッキ装置

Publications (2)

Publication Number Publication Date
JPH0476052U JPH0476052U (2) 1992-07-02
JPH0744025Y2 true JPH0744025Y2 (ja) 1995-10-09

Family

ID=31867632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990119689U Expired - Lifetime JPH0744025Y2 (ja) 1990-11-15 1990-11-15 リードの半田メッキ装置

Country Status (1)

Country Link
JP (1) JPH0744025Y2 (2)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63263752A (ja) * 1987-04-22 1988-10-31 Nec Corp 高速部分めつき装置
JPH02111898A (ja) * 1988-10-20 1990-04-24 Mitsubishi Electric Corp 半導体素子の製造装置

Also Published As

Publication number Publication date
JPH0476052U (2) 1992-07-02

Similar Documents

Publication Publication Date Title
ATE380392T1 (de) Elektrochemisches abscheiden von lötbällen mit einheitlicher höhe auf halbleitersubstraten
US5308645A (en) Method and apparatus for through hole substrate printing
JP2014196540A (ja) 電気めっき方法およびそれに用いるマスク部材
JP3460401B2 (ja) 電解メッキ装置および方法
JPH07211724A (ja) メッキ装置およびメッキ方法と被メッキ処理基板
KR102744025B1 (ko) 도금 장치
JP2617637B2 (ja) 部分めっき装置および半導体装置用リードフレーム
JPH087642Y2 (ja) リードの半田メッキ装置
JPH05243183A (ja) 半導体装置の製造方法
JPH04199550A (ja) リードの半田メッキ装置
JP2506613Y2 (ja) リ―ドの半田メッキ装置
JPH0730687Y2 (ja) バンプめっき装置
JPH06179998A (ja) めっき装置
US12104266B2 (en) Plating apparatus having conductive liquid and plating method
JP3031478B2 (ja) ウェハの鍍金方法およびその装置
JP2926497B2 (ja) 半導体装置の製造方法
JPH04266036A (ja) プラスチックパッケージされてなる半導体装置
JP2513357B2 (ja) リ―ドの半田メッキ装置
JPH0821664B2 (ja) リードの半田メッキ装置
JP2522110B2 (ja) リ―ドの半田メッキ装置
JPH0375394A (ja) メッキ装置
JPH06236951A (ja) リードの半田メッキ装置
JPH0568559B2 (2)
JPH04137541A (ja) 突起電極の形成方法
JPS6159742A (ja) 半導体装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term