JPH079614Y2 - Mold for thermosetting resin encapsulation - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a thermosetting resin encapsulating mold used for resin molding of a semiconductor device.

[Conventional technology]

FIG. 2 shows a cavity portion of an example of a conventional standard thermosetting resin sealing die.

FIG. 3 shows an example of the flow of resin in the cavity shown in FIG. 2, and FIG. 4 shows an example of a lead frame for resin molding in the cavity shown in FIG.

In the figure, 1 is a gate, 2 is a cavity, 3 is a vent,
Reference numeral 4 is a frame of the lead frame, 5 is an inner lead of the lead frame, 6 is a thermosetting resin, and a curved line in the region shows a spread state of the resin injected from the gate 1. 7 is air.

In the thermosetting resin sealing die, the thermosetting resin 6 heated and melted in a pot (not shown) is pressed by a plunger (not shown) to run a runner (not shown). After that, it is injected from the gate 1 into the cavity 2, and the lead frame, which is placed in the cavity 2 and on which the chip mounting is completed, is resin-molded.

The resin 6 injected from the gate 1 into the cavity 2 spreads and is filled at a high speed in the state shown in FIG. 3 if there is no obstacle in the cavity 2.

In this case, the air 7 in front of the expanding resin 6 is discharged from the vent 3, but a part of the air on the front inner wall side is caught in the flow of the resin 6 and the escape place is lost.

Conventionally, the resin 6 injected from the gate 1 hits the inner lead portion 5 of the lead frame arranged in the cavity 2 and the flow speed is suppressed, so that the air can easily escape from the entrainment of the resin 6. It has been taken.

[Problems to be solved by the device]

In the conventional method as described above, the speed of the injected resin may not be suppressed due to the shape of the inner lead of the lead frame, and in order to eliminate this, the degree of freedom in designing the inner lead shape is impaired. was there.

The present invention has been made to solve the above problems,
It is an object of the present invention to provide a material in which voids are unlikely to occur regardless of the shape of the inner lead.

[Means for Solving the Problems]

In order to achieve the above-mentioned object, the present invention, when molding the lead frame after the chip mounting, is made to press the molten thermosetting resin heated in the pot by the plunger and inject it into the cavity from the gate through the runner. In the mold for thermosetting resin encapsulation provided with a vent that is pushed by the injected resin and discharges the air in the cavity, the gate holds the lead frame between the upper mold and the lower mold of the mold. And a front side surface on which the gate is opened, wherein at least one of the vents is formed along the sandwiching surface and extends obliquely toward one side surface orthogonal to the front side surface of the cavity where the gate is opened. And is provided on the other side surface that is orthogonal to the one side surface facing the one side surface from which the gate extends.

〔Example〕

FIG. 1 shows a structure of a cavity portion and a flow of resin in the cavity portion according to an embodiment of the present invention.

In the figure, reference numerals 2, 3, 6, and 7 are the same as or corresponding to the same reference numerals in FIG.

The injected resin 6 from the gate 1a directly contacts one side surface of the cavity 2 and the flow velocity is suppressed, and the resin 6 is filled into the state shown in the figure. The air pushed by the resin 6 spreading in the forward direction is discharged from the vent 3, the air pushed by the resin 6 spreading in the other side surface is discharged from the vent 8, and the air is less likely to be entrained in the flow of the resin 6. ,
Therefore, regardless of the shape of the inner leads of the lead frame, a molding resin with few voids can be obtained.

[Effect of device]

As described above, according to the present invention, it is possible to obtain a resin mold with few voids regardless of the shape of the inner lead of the lead frame, and to increase the degree of freedom in designing the inner lead shape.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a structure of a cavity portion and a flow of resin according to an embodiment of the present invention, and FIG. 2 is a side view showing a cavity portion of an example of a conventional standard thermosetting resin sealing mold. 3 and 4 are explanatory views showing the flow of resin in the cavity shown in FIG. 2, and FIG. 4 is a plan view showing an example of a lead frame which is resin-molded in the cavity portion shown in FIG. 1a ... gate, 2 ... cavity, 3,8 ... vent, 6
… Thermosetting resin, 7… Air. The same reference numerals in the drawings denote the same or corresponding parts.

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Claims (1)

[Scope of utility model registration request] 1. A resin for molding a lead frame having a chip mounted thereon, wherein a thermosetting resin heated and melted in a pot is pressurized by a plunger and injected into a cavity from a gate through a runner. In a mold for thermosetting resin encapsulation provided with a vent for discharging air in a cavity by being pushed by, the gate is along a sandwiching surface sandwiching a lead frame between an upper mold and a lower mold of the mold. And extending obliquely toward one side surface that is orthogonal to the cavity front side surface where the gate is open, and at least one of the vents is orthogonal to the front side surface where the gate is open, and A thermosetting resin encapsulating mold, which is provided on another side surface facing one side surface from which a gate extends.