JPH08195363A - 流体軸受を有する半導体ウェーハポリシング装置 - Google Patents

流体軸受を有する半導体ウェーハポリシング装置

Info

Publication number
JPH08195363A
JPH08195363A JP26042795A JP26042795A JPH08195363A JP H08195363 A JPH08195363 A JP H08195363A JP 26042795 A JP26042795 A JP 26042795A JP 26042795 A JP26042795 A JP 26042795A JP H08195363 A JPH08195363 A JP H08195363A
Authority
JP
Japan
Prior art keywords
fluid
polishing pad
support
pad assembly
bearings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26042795A
Other languages
English (en)
Japanese (ja)
Inventor
Homayoun Talieh
タリエー ホメイヤン
David E Weldon
エドウィン ウェルドン ディヴィッド
Boguslaw A Nagorski
エイ ナゴルスキー ボーグスロウ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ontrak Systems Inc
Original Assignee
Ontrak Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/321,085 external-priority patent/US5593344A/en
Application filed by Ontrak Systems Inc filed Critical Ontrak Systems Inc
Publication of JPH08195363A publication Critical patent/JPH08195363A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP26042795A 1994-10-11 1995-10-06 流体軸受を有する半導体ウェーハポリシング装置 Pending JPH08195363A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/321085 1994-10-11
US08/321,085 US5593344A (en) 1994-10-11 1994-10-11 Wafer polishing machine with fluid bearings and drive systems
US08/333463 1994-11-02
US08/333,463 US5558568A (en) 1994-10-11 1994-11-02 Wafer polishing machine with fluid bearings

Publications (1)

Publication Number Publication Date
JPH08195363A true JPH08195363A (ja) 1996-07-30

Family

ID=26982813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26042795A Pending JPH08195363A (ja) 1994-10-11 1995-10-06 流体軸受を有する半導体ウェーハポリシング装置

Country Status (4)

Country Link
EP (1) EP0706857B1 (de)
JP (1) JPH08195363A (de)
AT (1) ATE182103T1 (de)
DE (1) DE69510745T2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001054856A (ja) * 1999-07-09 2001-02-27 Applied Materials Inc 化学的機械研磨装置での使用のための溝付パターンを有する研磨パッド
KR100521538B1 (ko) * 1997-11-12 2006-03-23 램 리서치 코포레이션 반도체 웨이퍼를 폴리싱 처리하기 위한 장치

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961372A (en) * 1995-12-05 1999-10-05 Applied Materials, Inc. Substrate belt polisher
US5886535A (en) * 1996-11-08 1999-03-23 W. L. Gore & Associates, Inc. Wafer level burn-in base unit substrate and assembly
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6108091A (en) 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US5980368A (en) * 1997-11-05 1999-11-09 Aplex Group Polishing tool having a sealed fluid chamber for support of polishing pad
US6062959A (en) * 1997-11-05 2000-05-16 Aplex Group Polishing system including a hydrostatic fluid bearing support
US6068539A (en) 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
US7204924B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Method and apparatus to deposit layers with uniform properties
US6413388B1 (en) * 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US7141146B2 (en) 2000-02-23 2006-11-28 Asm Nutool, Inc. Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
US6991512B2 (en) * 2001-03-30 2006-01-31 Lam Research Corporation Apparatus for edge polishing uniformity control
US6729945B2 (en) 2001-03-30 2004-05-04 Lam Research Corporation Apparatus for controlling leading edge and trailing edge polishing
US6939212B1 (en) 2001-12-21 2005-09-06 Lam Research Corporation Porous material air bearing platen for chemical mechanical planarization
US6790128B1 (en) 2002-03-29 2004-09-14 Lam Research Corporation Fluid conserving platen for optimizing edge polishing
US6769970B1 (en) 2002-06-28 2004-08-03 Lam Research Corporation Fluid venting platen for optimizing wafer polishing
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
CN112975721B (zh) * 2021-03-10 2022-04-22 江苏特丽亮镀膜科技有限公司 金属件表面抛光系统及方法
CN116160331B (zh) * 2023-04-10 2025-08-05 合肥欢悦磁业科技有限公司 一种钕铁硼磁铁加工设备及其使用方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US529732A (en) 1894-11-27 Cravat
DE3411120A1 (de) * 1983-03-26 1984-11-08 TOTO Ltd., Kitakyushyu, Fukuoka Laeppvorrichtung
JPS59232768A (ja) * 1983-06-16 1984-12-27 Kanebo Ltd 平面研磨装置
JPS63200965A (ja) * 1987-02-12 1988-08-19 Fujitsu Ltd ウエ−ハ研磨装置
US4811522A (en) 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
JPS63251166A (ja) * 1987-04-07 1988-10-18 Hitachi Ltd ウエハチヤツク
JPH0811356B2 (ja) * 1989-04-06 1996-02-07 ロデール・ニッタ株式会社 ポリッシング方法およびポリッシング装置
FR2677276B1 (fr) 1991-06-06 1995-12-01 Commissariat Energie Atomique Machine de polissage a table porte-echantillon perfectionnee.
JPH05177523A (ja) 1991-06-06 1993-07-20 Commiss Energ Atom 張設された微小研磨剤小板、および改良されたウエハー支持ヘッドを備えた研磨装置
JP3334139B2 (ja) * 1991-07-01 2002-10-15 ソニー株式会社 研磨装置
US5287663A (en) 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100521538B1 (ko) * 1997-11-12 2006-03-23 램 리서치 코포레이션 반도체 웨이퍼를 폴리싱 처리하기 위한 장치
JP2001054856A (ja) * 1999-07-09 2001-02-27 Applied Materials Inc 化学的機械研磨装置での使用のための溝付パターンを有する研磨パッド

Also Published As

Publication number Publication date
EP0706857A1 (de) 1996-04-17
ATE182103T1 (de) 1999-07-15
EP0706857B1 (de) 1999-07-14
DE69510745T2 (de) 1999-12-09
DE69510745D1 (de) 1999-08-19

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