JPH087642Y2 - リードの半田メッキ装置 - Google Patents

リードの半田メッキ装置

Info

Publication number
JPH087642Y2
JPH087642Y2 JP1990119448U JP11944890U JPH087642Y2 JP H087642 Y2 JPH087642 Y2 JP H087642Y2 JP 1990119448 U JP1990119448 U JP 1990119448U JP 11944890 U JP11944890 U JP 11944890U JP H087642 Y2 JPH087642 Y2 JP H087642Y2
Authority
JP
Japan
Prior art keywords
solder plating
solder
leads
cathode
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990119448U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0476051U (da
Inventor
正良 高林
孝義 山村
清矢 西村
義久 前嶋
篤佳 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Priority to JP1990119448U priority Critical patent/JPH087642Y2/ja
Publication of JPH0476051U publication Critical patent/JPH0476051U/ja
Application granted granted Critical
Publication of JPH087642Y2 publication Critical patent/JPH087642Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990119448U 1990-11-16 1990-11-16 リードの半田メッキ装置 Expired - Fee Related JPH087642Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990119448U JPH087642Y2 (ja) 1990-11-16 1990-11-16 リードの半田メッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990119448U JPH087642Y2 (ja) 1990-11-16 1990-11-16 リードの半田メッキ装置

Publications (2)

Publication Number Publication Date
JPH0476051U JPH0476051U (da) 1992-07-02
JPH087642Y2 true JPH087642Y2 (ja) 1996-03-04

Family

ID=31867405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990119448U Expired - Fee Related JPH087642Y2 (ja) 1990-11-16 1990-11-16 リードの半田メッキ装置

Country Status (1)

Country Link
JP (1) JPH087642Y2 (da)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4302316A (en) * 1980-05-07 1981-11-24 The Perkin-Elmer Corporation Non-contacting technique for electroplating X-ray lithography
JPS6067689A (ja) * 1983-09-22 1985-04-18 Nec Corp めつき方法及びめつき装置
JPS6092497A (ja) * 1983-10-27 1985-05-24 Nec Corp メツキ装置
JPS61253399A (ja) * 1985-05-07 1986-11-11 Sumitomo Metal Ind Ltd メツキ液浄化装置
JPH0696789B2 (ja) * 1985-08-13 1994-11-30 松下電器産業株式会社 情報記録体の電鋳装置
JPS62210688A (ja) * 1986-03-11 1987-09-16 日本碍子株式会社 セラミツクパツケ−ジの部分めつき方法及びその装置
JPS63243297A (ja) * 1987-03-31 1988-10-11 Mitsubishi Metal Corp 伝熱管の製造方法
JPH02111898A (ja) * 1988-10-20 1990-04-24 Mitsubishi Electric Corp 半導体素子の製造装置

Also Published As

Publication number Publication date
JPH0476051U (da) 1992-07-02

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Legal Events

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