JPH097977A - Dicing device and dicing system - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a dicing device and a dicing system having both a function of reading an ID symbol and a function of reading an identification display such as a barcode. In a dicing device for dicing a wafer arranged on a frame via a tape, a wafer ID symbol is formed on the wafer, and an identification mark for identifying the other is formed on the frame or the tape. Thus, the dicing device is provided with an ID symbol detecting means for detecting an ID symbol and an identification display detecting means for detecting an identification display. Before dicing the wafer, the ID symbol is detected by the ID symbol detecting means and the identification display is detected by the identification display detecting means, and the information on the wafer of the CPU and the identification display are connected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing device and a dicing system.

[0002]

2. Description of the Related Art A dicing apparatus, for example, as shown in FIG. 4, has a semiconductor wafer W (fixed to a frame F via an adhesive tape N by a loading / unloading means B from inside a cassette C placed in a cassette loading area A. Is held in the standby area D, the wafer is transferred to and held on the chuck table T by the transfer means E having a swing arm, and the chuck table T is moved to be aligned by the alignment means G, and then the rotary blade is provided. Dicing is performed by the cutting means H.

[0003]

An ID symbol is attached to each wafer W, and the characteristics and necessary information of each wafer W can be recognized by reading the ID symbol. After that, since the ID symbol was cut off, the reading became extremely difficult, which hindered the subsequent wafer processing. Therefore, it has been conventionally attempted to manage the wafer by forming an identification mark such as a bar code on the frame F or the tape N and reading the identification mark after cutting. However, a device for connecting the ID symbol and an identification display such as a bar code or a tape mounter (device for integrating the wafer W and the frame F by the adhesive tape N) having such a function is required. There was a problem that the combination became complicated. The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a dicing device and a dicing system having both a function of reading an ID symbol and a function of reading an identification display such as a barcode. .

[0004]

As a means for technically solving the above problems, the present invention provides a dicing apparatus for dicing a wafer arranged on a frame via a tape, wherein the wafer has a wafer ID. Symbols are formed, an identification mark for identifying the other is formed on the frame or the tape, an ID mark detecting means for detecting an ID mark on the dicing device, and an identification mark for detecting the identification mark. The gist is a dicing device provided with a detection means. Also, before dicing the wafer, the ID symbol is detected by the ID symbol detecting means,
The gist is a dicing device that detects the identification display by the identification display means and connects the information about the wafer of the CPU and the identification display. Further, a post-processing device for processing the wafer after dicing is connected to the CPU, and the post-processing device detects the identification mark formed on the frame or on the tape to recognize the information about the wafer, The gist is a dicing system including a dicing device that processes this wafer.

[0005]

[Operation] Since the ID symbol detecting means and the identification display detecting means are provided in the dicing device, a device for connecting the ID symbol and the identification display such as a bar code or a tape mounter having such a function is not required, There is no need for complicated device combinations.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 1 denotes a detection mechanism, which includes an ID symbol detection means 2 and an identification display detection means 3, and I
The D-symbol detecting means 2 reads the ID symbol 4 formed on the end portion of the wafer W as shown in FIG. 2, and the identification display detecting means 3 reads the identification display 5 such as a bar code attached to the adhesive tape N. I am doing it. The identification display 5 may be attached to the frame F as shown in FIG.

The detection mechanism 1 thus formed is shown in FIG.
As indicated by the chain double-dashed line, for example, the position P above the waiting area D
The wafer is carried out from the cassette C by the carry-in / out means B, or the wafer carried to the chuck table T by the carrying means E is located above the chuck table T.

In any case, before the wafer W is diced, the ID symbol 4 is detected by the ID symbol detecting means 2 and the identification display 5 is detected by the identification display detecting means 3, and the CPU 6 shown in FIG. The information related to the wafer and the identification display are connected. In this case, since the ID symbol detecting means 2 and the identification display detecting means 3 are arranged in the dicing device,
A device for connecting the ID symbol and an identification display such as a bar code or a tape mounter having such a function is unnecessary.

After that, the chuck table T is moved to be positioned on the alignment means G, and after the alignment, the cutting means H performs dicing. This dicing cuts the ID symbol 4 and makes it difficult to read, but the identification mark 5 attached to the tape N or the frame F remains uncut.

Therefore, in the post-processing device 7 such as a die bonder, each remaining wafer can be processed by detecting the remaining identification display 5 and recognizing the information regarding the wafer W. Therefore, the post-processing device 7 is provided with a means for detecting the identification display 5 inside or outside.

The identification display 5 is not limited to a bar code as long as it can be distinguished from others. Further, it may be displayed at any place on the frame F and the tape N as long as it is not affected by the dicing. Furthermore, the identification display is a sticker type,
There are various types such as an engraved type, a penetrating type such as a hole, and a printing type, and any type may be adopted.

The wafer after dicing as described above is
Since the information is managed by the identification display 5, information other than the information recognizable by the ID symbol can be recorded in the memory connected to the identification display 5, and the information on the wafer W can be enhanced.

Although the detection mechanism 1 is used as a separate mechanism in the dicing device, the detection of the ID symbol on the wafer W and the detection of the identification mark formed on the frame F or the adhesive tape N are performed by the dicing device. If the image processing system included in the means G is used, the alignment means G also serves as the detection mechanism 1, and the present invention can be realized at low cost without disposing an independent detection mechanism.

[0014]

As described above, according to the present invention, the dicing device is provided with the function of connecting the information of the ID symbol and the identification display, so that the ID symbol and the identification display such as the bar code are connected. No separate device or a tape mounter having such a function is required, and there is an effect that the combination of devices is not complicated. Further, by providing the alignment means with a detection mechanism function, the present invention can be implemented at low cost.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a detection mechanism of a dicing device according to the present invention.

FIG. 2 is a perspective view of a wafer showing an installation example of an ID symbol and an identification display.

FIG. 3 is a plan view of a wafer showing another installation example of an ID symbol and an identification display.

FIG. 4 is a perspective view of a main part of a dicing system including a dicing device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Detection mechanism 2 ... ID symbol detection means 3 ... Identification display detection means 4 ... ID symbol 5 ... Identification display 6 ...
CPU 7 ... Post-processing device

Claims (3)

[Claims] 1. A dicing apparatus for dicing a wafer arranged on a frame via a tape, wherein a wafer ID symbol is formed on the wafer, and the frame or the tape is provided with an identification mark for identifying the other. And a dicing device in which an ID symbol detecting means for detecting an ID symbol and an identification display detecting means for detecting an identification display are provided in the dicing device. 2. The ID symbol is detected by the ID symbol detecting means before the wafer is diced, and the identification display is detected by the identification displaying means, and the information on the wafer of the CPU,
The dicing device according to claim 1, wherein the dicing device is connected to an identification display. 3. A post-processing device for processing a wafer after dicing is connected to the CPU, and the post-processing device detects an identification mark formed on the frame or on the tape to display information about the wafer. A dicing system including the dicing apparatus according to claim 2, which recognizes and processes the wafer.