JPH1060628A - Material flying device and material flying source - Google Patents

Abstract

(57) [Problem] To provide a vacuum vapor deposition apparatus in which a flying vapor deposition material is vapor-deposited on a base film at a constant incident angle even in a state where an opening area of a shutter is narrowed due to adhesion of a flying vapor deposition material. . SOLUTION: An opening 1 of a deposition-preventing plate 5 of a vacuum evaporation apparatus 20.
At the lower part of Oa, a moving mechanism 21 for moving horizontally and vertically is provided, a crucible 22 containing the vapor deposition material 18 is arranged thereon, and a deflection coil 31 is provided at the tip of the electron gun 4. The movement of the moving mechanism 21 and the deflection of the electron beam 17 depend on the state of the adhered matter 19 adhered to the shutter 6.
Make sure that it is done according to a set program.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a material flying device (for example, a thin film material flying device suitable for forming a thin film on a substrate by vapor deposition) and a material flying source.

[0002]

2. Description of the Related Art In video tape recorders, image quality has been improved by high-density recording. In order to cope with this, for example, a metal magnetic thin film is used as a magnetic layer as a magnetic recording medium for an 8 mm VTR. So-called evaporation tapes have been put to practical use.

[0003] Evaporated tapes are superior to coated magnetic tapes in electromagnetic conversion characteristics due to their superior magnetic properties and thinner magnetic layer than the widely used coated magnetic tapes. It is expected to demonstrate performance.

[0004] Unlike a coating type tape, such a vapor deposition tape is, as shown in a schematic partial front view of the inside, in a vacuum vapor deposition apparatus (hereinafter simply referred to as an apparatus).
It is manufactured by dissolving a magnetic metal material such as Ni and uniformly attaching the vapor to the tape surface by oblique evaporation.

[0005] That is, in the apparatus 1, an evaporation source (a metal contained in a crucible, for example, a Co—Ni alloy) 3 is disposed below the opening 10 a of the deposition-preventing plate 5, and the base film 9 is wound therearound. The metal material is deposited on the outer periphery of the cooling roll 2 while running while being in close contact with the outer peripheral surface of the cooling roll 2 by the rotation of the winding hub 8.

The deposition-preventing plate 5 is detachable, and is fixed at a position very close to the cooling roll 2 by the operation of the lifter 12 during vapor deposition.
The positioning pins 14 and 15 are used as positioning blocks 13 and 16
This is done by contacting each. Each lifter 12 moves up and down periodically. When cleaning the deposition-preventing plate 5, the deposition-preventing plate 5 is put in and taken out of the door 11.

The attachment plate 5 is provided with windows 10a and 10b, and an electron beam 17 emitted from an electron gun 4 provided outside the apparatus 1 irradiates the evaporation source 3 through the window 10b.
Thereby, the evaporated metal flies from the evaporation source 3 and the window 10a
, The evaporated metal adheres to the base film 9 running on the cooling roll 2 in the area of the window 10a, and this deposits to form a metal thin film. The window 10a is closed by the shutter 6 when vapor deposition is not performed, and the shutter 6 moves so that the window 10a is opened only during vapor deposition.

However, in such an apparatus 1, when the vapor deposition material flies by heating and adheres to the base film 9,
In addition to the base film 9, most of the flying material that has fly to angles other than the limited angle of incidence continuously adheres to the shutter 6 and the surrounding deposition-preventing plate 5. Therefore, in order to prevent thermal deformation of the film, the cooling roll 2 is cooled.
The shutter 6 is provided as close as possible to the base film 9.

As described above, the deposition material adhering to the base film 9 is 15 to 20% of the material used, and the remainder adheres to the shutter 6 and the deposition-preventing plate 5. Then, the metal material attached to the shutter 6 and the deposition-preventing plate 5 is not liquid but solidifies and attaches, and thus grows over time.

FIG. 23 shows a state in which the evaporated metal 19 is deposited on the shutter 6 and the protection plate 5. As shown, the flying material 19 adheres over the entire inner surface of the ceiling wall of the shutter 6 and the attachment-preventing plate 5 and the upper portions of the inner surfaces of both side walls.

Therefore, the incidence of the flying material on the opening 10a is hindered, so that the incident angle changes and the growth direction of the deposited metal atoms attached to the base film 9 changes. As a result, the characteristics of the product may vary, and it may not be possible to produce a magnetic recording medium of a constant quality.

In addition, since the beam current is increased in order to increase the required evaporation power in order to obtain a constant film forming rate, the amount of the evaporation material used increases. As a result, the amount of alloy adhering to the shutter 6 and the deposition preventing plate 5 further increases. However, since the attached matter 19 is hard to peel off and is heavy, cleaning imposes a heavy burden on an operator.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has been described in connection with the case where the adhesion of a flying material causes the material to adhere to an opening region where the material can fly to a substrate. It is another object of the present invention to provide a material flying device and a material flying source in which the angle of incidence of the flying material on the substrate is kept substantially constant.

[0014]

Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventor has found an effective means for attaching a flying material to a substrate, and has reached the present invention. It was done.

That is, according to the present invention, in a material flying apparatus for adhering a flying material from a flying source to a substrate through an opening for regulating a flying region, the position of the flying source is adjusted, and the flying to the substrate is performed. The present invention relates to a material flying device characterized in that an incident state of a material is maintained.

According to the present invention, there is provided a material flying device using a regulating means having an opening for regulating a flying area, and attaching a flying material from a flying source onto the substrate through the opening of the regulating means. At least a second regulating means of the second regulating means for regulating the flying area and a third regulating means opposed to the second regulating means is provided in the flying source;
And the flying material adhering to the third regulating means is circulated to the flying position, and the position of the second regulating means is adjusted so that the state of incidence of the flying material on the base is maintained. A material flying device characterized by the following.

According to the present invention, there is provided a material flying apparatus using a regulating means having an opening for regulating a flying area, and attaching a flying material from a flying source to the substrate through the opening of the regulating means. A second regulating means for regulating the flying area and a third regulating means opposed thereto are provided in the flying source, and circulate the flying material adhering to the second and third regulating means to the flying position. As described above, the material flying apparatus is characterized in that the state of incidence of the flying material on the substrate is maintained.

In the present invention, since the material flying device is configured as described above, the incident angle at the start and end of the deposition is always substantially constant, so that a product of constant quality can be produced and the yield is improved. At the same time, it is possible to reduce the manufacturing cost by suppressing an increase in the materials used.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In a material flying apparatus and a material flying source according to the present invention, it is preferable that the position of the flying source is adjusted by moving the flying source.

In this case, the flying source moves at the time of vacuum deposition in accordance with the amount of the flying material adhered to the flying region regulating means (for example, the incident angle regulating mask portion) having the opening, and follows the movement of the flying source. It is desirable that the beam irradiation position for heating the flying source be changed.

The movement of the flying source and the change of the beam irradiation position are performed during the above-mentioned material flying operation, and the movement of the flying source and the change of the beam irradiation position are performed based on a predetermined program. Is desirable.

In the above apparatus, the angle of incidence of the flying material is adjusted by moving the second regulating means.
It is desirable that the restricting means move in accordance with the amount of the flying material attached to the second restricting means.

In this case, a driving mechanism for the second regulating means is provided below the flying source, and the driving mechanism is constituted by the driving motor and transmission means for transmitting the driving of the motor to the second regulating means. It is desirable to have been.

Further, the drive mechanism may be manually operated.

In the above apparatus, it is desirable that the movement of the second restricting means is performed based on a predetermined program.

The second restricting means extends above the third restricting means, and the second restricting means moves during vacuum deposition according to the amount of deposition material deposited on the second restricting means. It is desirable to do.

In the above apparatus, it is preferable that the third regulating means is provided on the beam incident side for heating the flying source, and the third regulating means is provided with a heating beam passage hole.

Thus, in the above-described apparatus, when the constituent material is deposited on the magnetic recording medium on the base, the base is guided obliquely downward from the upper side toward the second regulating means with respect to the deposition source. , Allows the deposition to take place.

It is desirable to constitute a material flying source comprising the above-mentioned flying source.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below, but it goes without saying that the present invention is not limited to the following embodiments.

FIG. 1 is a schematic sectional view of a vacuum deposition apparatus according to the first embodiment.

As shown in the figure, the apparatus 20 of this embodiment has a structure similar to that of the above-described conventional apparatus. However, the structure around the crucible 22 made of, for example, ceramic and the electron gun 4 The structure is different.

That is, the crucible 22 is provided with a drive mechanism 21 (to be described in detail later), and a horizontal arrow l shown in FIG.
In addition, the irradiation angle of the beam 17 of the electron gun 4 changes as shown by an arc arrow a on the beam 17 and can be adjusted.

Also in the apparatus 20 of this embodiment, a crucible 22 (hereinafter sometimes referred to as a vapor deposition source) is used as a vapor deposition source.
For example, a Co—Ni alloy is accommodated in the opening 1 of the anti-adhesion plate 5.
0a, the base film 9 (for example, 620 mm in width) is fed out from the feeding hub 7 around which the base film 9 is wound, and the rotation of the winding hub 8 while closely contacting the outer peripheral surface of the cooling roll 2 (for example, φ1 m). During this time, a vapor deposition material is vapor-deposited from the opening 10 a and wound around the winding hub 8.

The deposition-preventing plate 5 is fixed at a position very close to the cooling roll 2 during vapor deposition. The vertical movement of the deposition-preventing plate 5 is performed by the lifter 12, and in this case, the positioning pins 14, 15 are positioned by the positioning block 13,
16 respectively. Each lifter 12 moves up and down periodically. Further, the attachment-preventing plate 5 is detachable, and when the attachment-preventing plate 5 is cleaned, the attachment-preventing plate 5 is taken in and out of the door 11.

The deposition plate 5 is provided with windows 10a and 10b, and an electron beam 17 emitted from an electron gun 4 provided outside the apparatus 20 irradiates the evaporation source 22 through the window 10b. As a result, the vapor deposition metal 18 flies from the vapor deposition source 22, passes through the window 10a, and adheres to the base film 9 running on the cooling roll 2 in the area of the window 10a. Become. The window 10a is closed by the shutter 6 when vapor deposition is not performed, and the shutter 6 moves so that the window 10a opens only during vapor deposition. The basic configuration and operation of such an apparatus are the same in other embodiments described later.

FIG. 2 is an enlarged sectional view of a part of FIG.
The vapor deposition material 18 in the crucible 22 is heated by the beam 17 emitted from the electron gun 4 and flies, and the flying material 18 is heated.
A flies upward as indicated by the broken and solid arrows shown in FIG. The flying material 18A that has flown into the incident area angle α surrounded by the solid arrow adheres to the cooling film 2 through the opening 10a and adheres to the base film 9 that travels in the direction of the arrow.

Accordingly, the vaporized material 18 is heated and melted by the electron beam 17 emitted from the electron gun 4 to be melted and evaporated.
Of these, the incident angle of the flying material 18A adhering to the base film 9 with respect to the base film 9 is defined as 0 ° in the running direction of the base film 9 and 90 ° in a straight line perpendicular to the surface of the base film 9. Thus, in the case of the present embodiment, the incident angle can be set to an arbitrary angle θ ° by changing the position of the shutter 6 from 0 °.

Accordingly, in order to form the incident angle θ as shown in FIG. 2, the crucible 22 is moved in the R direction in advance, and the vapor deposition is started. However, as the deposition proceeds, as shown in FIG. 3, a metal deposit 19 made of a deposition material inevitably adheres to the surface near the opening 10 a of the shutter 6 and near the ceiling of the deposition-preventing plate 5. And grows over time as the deposition time elapses. For this reason, the incident angle is particularly hindered by the deposit 19 on the shutter 6, and the incident angle θ at the start of vapor deposition is increased.
And the incident area angle α is also narrowed to α ′.

Accordingly, the number of atoms to be effectively vaporized out of all the flying vaporized atoms is reduced to α ′ / α as compared with the time when vapor deposition starts. Therefore, in order to control the thickness of the vapor deposition layer to be constant, the amount of evaporation from the crucible 22 must be increased by α / α ′, which causes an increase in manufacturing cost.

Therefore, in this embodiment, as described above, the moving mechanism 21 for the crucible 22 is provided as a countermeasure for this. FIG. 4 is a schematic diagram thereof, taken along the line IV-IV in FIG.
It is a line sectional view.

As shown in FIG. 4, for example, the power of the pulse motor 60 is transmitted to the bevel gear 63 via the bevel gear 62 provided on the shaft 61 of the bevel gear 63, Fixedly coupled shaft 64
The receiving portion 65 screwed with the shaft 64 by the rotation of
Is fixed to the lower stage 24, so that the lower stage 24 moves up and down.

A rail 25 is provided on a lower stage 24 having such a vertical movement mechanism, and a crucible 22 is provided on an upper stage 23 having an engaging portion 26 engaged with the rail 25.
Is provided. A rack 27 is provided at one side lower portion of the upper stage 23, and is fixed to a tip end of a shaft 30 of a pulse motor 29 in which a pinion 28 engaged with the rack 27 is fixedly installed. The above-mentioned moving mechanism may be an appropriate method other than the above.

By such a moving mechanism 21 of the crucible 22, for example, as shown in FIG. 5, the incident area α ′ of the flying material 18A narrowed by the attachment 19 to the shutter 6 in FIG. The original area α is restored. That is, the moving mechanism 21 is operated to move the position of the crucible 22 in the L direction.
2 by slightly moving it upward (see FIG. 6).

However, since the irradiation position of the electron beam 17 shifts with the movement of the crucible 22, the shifted beam 17 indicated by the imaginary line is irradiated with the accurate beam 17 indicated by the solid line as shown in FIG. To correct the position, a deflection coil 31 is provided on the periphery of the tip of the electron gun 4. Accordingly, the irradiation position of the electron beam 17 changes in accordance with this movement.

FIG. 6 shows the position of the crucible 22 and the electron beam 1.
FIG. 7 is a diagram illustrating before and after the movement of the irradiation position of FIG. That is, the broken line indicates the position before the movement and the solid line indicates the position after the movement,
The crucible 22 changes its position in the lh direction as a result of the movement of l and up in the direction of the arrow shown in FIG.

Following this, the irradiation position of the electron beam 17 also changes by an angle a as shown by an arc arrow, so that the irradiation position is also S _1.
Changes to the S ₂ from. Accordingly, the incident area angle α of the flying material 18A indicated by a broken line starting from the irradiation position S ₁ before the movement is obtained.
After the movement, the incident area angle α ′ indicated by a solid line starting from S ₂ can be maintained, the same incident area angle (α = α ′) can be maintained, and the incident angle θ with respect to the base film 9 is θ ′.
By maintaining a certain angle, a preferable easy axis of magnetization described later can be formed.

Accordingly, the irradiation direction of the electron beam 17 emitted from the electron gun 4 follows the movement of the crucible 22 and moves in the L direction.
Deposition becomes possible. These series of operations are controlled by a control mechanism.

As described above, the shutter 6 controls the incident angle, and the cooling roll 2
The base film 9 is thermally deformed by the radiant heat from the shutter 6 when the temperature of the shutter 6 becomes high. Therefore, the shutter 6 needs to be cooled.

Therefore, the protection plate 5 located between the cooling roll 2 and the shutter 6 in contact with the shutter 6
A cooling mechanism is internally provided in the circular arc portion 5a as shown in FIG. In this cooling mechanism, the cooling pipe 33 meanders within the thickness of the arc portion 5a of the deposition-preventing plate 5, and is cooled through, for example, water.

In the vacuum vapor deposition apparatus 20 of this embodiment, as described above, the flying material 18A accompanying vapor deposition adheres to the shutter 6 and the like, and the incident area of the flying material 18A on the base film 9 surface is narrowed. The feature is that a substantially constant incident angle is maintained by moving the crucible 22 as a source.

The internal structure of the metal thin film formed by such a vacuum deposition method is an aggregate of columnar metal single crystals grown in the direction of the incident angle, and has an easy axis of magnetization in the height direction of the columnar single crystal. To form Therefore, the incident angle determined by the shutter 6 from the rotation direction of the cooling roll 2 determines the axis of easy magnetization of the surface of the metal thin film. This is one of the factors that affect the characteristics of the metal thin film as a magnetic recording medium, and the same product must have a unified standard.

That is, as shown in FIG. 8, a regular constant easy axis of magnetization 34A is formed on the metal film 34 deposited on the base film 9 according to the present embodiment. But,
The moving mechanism of the crucible 22 and the electron beam 17 as in this embodiment
When the deflector of the crucible 2 is not provided, as shown in FIG.
2, the angle of incidence on the base film 9 conveyed obliquely from above is gradually reduced. Accordingly, an irregular and easy axis of easy magnetization 34B is formed as shown by a virtual line in FIG. 8, and recording and reproduction of the magnetic tape cannot be performed normally.

As described above, a control mechanism is provided to control a series of subtle operations of movement of the crucible 22 and deflection of the electron beam 17. FIG. 9 is a block diagram of the control mechanism.

That is, the moving position of the crucible 22 and the direction of deflection of the beam 17 of the electron gun 4 are instructed by information recorded in the memory unit 37. Information programmed in advance in the memory section 37 by simulation is recorded, and is instructed to the driver circuit 36 based on the program, and the driver circuit 36 operates the pulse generator 35 based on the instruction.

The pulse motors 29 and 60 are driven based on the pulse signals, and the pulse motors 29 and 60 are driven.
The actual rotation speed of the driver 3 is determined by the rotation speed detection signal.
Give feedback to 6.

Therefore, the reference signal programmed by the driver 36 is compared with the detected actual number of rotations of the pulse motors 29 and 60, and the control signal obtained by this comparison is again instructed to the pulse generator 35, and The pulse motors 29 and 60 are finally driven by the number of pulses to be performed.

The control mechanism shown in FIG. 9 is schematically shown, and in actuality, for example, a sensor for detecting the amount of deposits on the shutter 6 or the like is provided, and the film thickness of the deposits is thereby reduced. It may be configured to detect and correct an error with the program.

On the other hand, the memory section 37 reproduces the programmed recording signal and instructs this signal to the electron beam deflecting circuit 38, whereby the current amplifier 39 operates to supply the required voltage and current to the deflecting coil 31. Flow to Therefore, the direction of the electron beam is changed following the movement of the crucible by the magnetic force of the deflection coil 31.

According to the present embodiment, the crucible 22, which is a flying material source, moves in accordance with the amount of deposits attached to the shutter 6, and the electron beam 17 is also deflected following the movement. The angle of incidence is kept constant. Therefore, a regular magnetic deposit 34A (see FIG. 8) of a vapor-deposited film is formed on the surface of the base film 9 with substantially the same inclination θ, so that a suitable magnetic layer is formed and the total amount of the flying metal material is reduced. It is possible to suppress the production cost.

FIG. 10 is a partial sectional view of a main part 55 of a vacuum evaporation apparatus showing a second embodiment.

In this embodiment, the crucible 22 is fixedly installed. However, the second incidence control plate 40 made of, for example, ceramic adjacent to the flying source moves laterally to regulate the flying region of the flying material. In addition, it is possible to suppress the adhesion of the adhered matter to the shutter 6, and to melt the adhered matter adhered to the second incidence control plate 40, return the melted substance to the inside of the crucible 22, and re-use the apparatus as a deposition material. is there.

As shown in FIG. 10, FIG. 10 is a diagram in which the vicinity of the deposition-preventing plate 32 is extracted and shown. However, similarly to the above-described first embodiment, in the apparatus of this embodiment, as shown in FIG. A lifter 12A for setting is provided, and a door (not shown) for attaching / detaching the attachment-preventing plate 32 is also provided. The crucible 22 is fixed to a base 58, and a fixing plate 46 that supports the second incidence control plate 40 by a driving mechanism 21 </ b> A provided below the base 58 is used to fix the second incidence control plate 40. Lateral movement (details will be described later) is performed.

The electron gun 4 in this embodiment applies an electron beam 17 obliquely downward from the side as shown in FIG.
2, the deflecting coil 41 is provided near the evaporation source 22 to control the irradiation position of the electron beam 17.

FIG. 11 is a schematic perspective view of the deflection coil 41. As shown, both ends of the deflection coil 41 are connected to yokes 53A and 53B.
The tip of B extends so as to sandwich the crucible 22 and a base 58.
(Not shown). Therefore, for example, if the yoke 53A is the magnetic pole S and the yoke 53B is the magnetic pole N (or vice versa), the main axis of the electron beam 17 is attracted to the leakage magnetic flux generated between the yokes 53A and 53B, and To irradiate the vapor deposition material 18 in the crucible 22. The same applies to a third embodiment described later.

The second incidence restricting plate 40 in this embodiment.
Is a second incident restricting plate 4 having a low shape as shown in FIG.
It may be 0A. In this case, the second incidence control plate 40A
Although the effect of suppressing the adhesion of the deposit 19 to the shutter 6 is smaller than that of the high-incidence second incidence control plate 40 shown in FIG. 10, the second incidence control plate is moved to the electron beam 17 side. The deposits 19 attached to the second incidence control plate can be effectively dissolved by the secondary electrons of the electron beam 17 and radiant heat. Therefore, the deposit 19 can be recycled before starting the vapor deposition.

Further, the height of the second incidence control plate 40A capable of dissolving the adhered matter 19 may be higher than that shown in FIG. 12, and if it is as high as possible, the effect of recycling can be improved. growing. Therefore, the regulating plate 40 shown in FIG.
As described above, if the size of the second incidence control plate is increased, the effect of controlling the incident angle of the vapor deposition material is increased and the recycling effect is also increased, so that the amount of the vapor deposition material used can be reduced.

In the apparatus of this embodiment, recycling of the deposit 19 by the above-mentioned second incidence regulating plate 40 and suppression of attachment of the deposit 19 to the shutter 6 (incident angle regulation).
It is intended. However, the second in FIG.
When the deposit 19 is deposited on the incidence control plate 40 to restrict the incidence area, as shown in FIG.
The original incident area can be maintained by retracting the incidence control plate 40 in the right direction in the drawing.

Next, the lateral movement mechanism of the second incidence control plate in this embodiment will be described in detail with reference to FIGS.

First, FIG. 14 shows an extraction around the crucible 22.
FIG. 15 is a front view (a cross-sectional view taken along line XVI-XVI in FIG. 15) showing a part in cross section, and FIG. 15 is a plan view thereof. As shown
The crucible 22 is installed in a state housed in the upper part of the base 58, and the upper edge is pressed and fixed by a pressing member 56.

A motor 42 serving as a drive source of the drive mechanism 21 is provided below the base 58, and a fixing support 46 operated by the drive mechanism fits outside the base 58 (right side in FIG. 13). The second incidence control plate 40 is attached to the upper end of the U-shape via a holding member 57 with a bolt 57a. Note that members 47 to 50 in FIG. 16, which will be described later, also exist in the upper part of FIG. 15 but are not shown.

FIG. 16 is a left side view of FIG.
FIG. 7 is a bottom view in which a part of FIG. 16 is omitted. From these figures, the configuration of the drive mechanism 21 described above is further clarified. That is, as shown in FIG. 17, the bevel gear 43a is provided via a bevel gear 43a provided at the end of the shaft of the motor 42.
And the power is transmitted to the bevel gears 43b and 43c arranged in a T-shape.

On both sides of the fixed plate 46, slide bearings 45b are provided, which are engaged with a shaft 45a having both ends fixedly supported on the bottom surface of the base 58.
Therefore, the slide bearing 45b is movable in the area of the shaft 45a. On the other hand, the shaft 44a of the bevel gear 43b and the bearing 44b make the ball screw 4
4 and the bearing 44b is a fixing plate 4
6, the fixing plate 46 reciprocates in the direction of the arrow shown in FIG. 17 by the rotation of the bevel gear 43b.

Accordingly, the power generated by the drive of the motor 42 is transmitted to the ball screw 44 via the bevel gears 43a and 43b, and the fixing plate 46 moves laterally. Also, bevel gear 4
The shaft 50A of the bevel gear 43c engaged with 3b is
It is connected to a shaft 50 via a coupling 51, is led out of the chamber 52, and the tip thereof is
9 (see FIG. 16).

The chamber 52 shown in FIG.
2a is provided, and a tubular flexible wire 48 is fixedly installed on a side surface of the chamber 52 on the outside thereof, and a rotation introducer 47 is connected to a distal end thereof. And
The shaft 50 is led out of the chamber 52 through the above-described through-hole 52a, further extends through the flexible wire 48 and the rotary introducer, and is connected to the manual handle 49.

Therefore, by operating the manual handle 49, the fixing plate 46 can be operated via the bevel gear 43c. In addition, since the rotation resistance caused by the change in the angle between the manual handle and the shaft 50A with respect to the shaft 50A during the operation is absorbed by the flexible wire 48 and the coupling 51, it can be easily performed without any trouble. Moreover, such a mechanism is a crucible 2
2, the influence of heating can be reduced.

The second incidence control plates 40, 40 as described above
The lateral movement of A operates based on a predetermined program in the same manner as in the above-described first embodiment, according to the state of attachment of the attached matter to the second incidence control plates 40 and 40A. Also,
The moving mechanism of the present embodiment is not limited to the horizontal movement described above, but may be a diagonal movement, and may be used together with a vertical movement.

According to the present embodiment, it is possible to restrict the incident angle of the flying material 18A to the base film 9 which has been restricted by the shutter 6 by using the above-described moving mechanism by the second incidence restricting plate. Becomes As a result, the alloy adhered to the shutter 6 adheres to the base film 9, so that the vapor deposition efficiency is improved, a uniform film thickness is obtained, and the quality can be stabilized.

When the second regulating plate is cleaned to remove the deposits, the regulating plate may be damaged. However, in this embodiment, the deposits can be sufficiently recycled. Cleaning of the regulating plate becomes easy or unnecessary.

Further, since the above-mentioned moving mechanism is installed below the crucible, the transmitting means, the driving motor and the like are less likely to receive a thermal load (heat of the vapor deposition material) and the mechanism can be simplified.

FIG. 18 is a partial sectional view of a main part 55 of a vacuum evaporation apparatus showing a third embodiment.

In this embodiment, as shown in the drawing, a third incidence control plate 59 is provided at a position facing the second incidence control plate 40 based on the apparatus of the second embodiment described above. As shown in the enlarged view of FIG. 18 on the left side of FIG. 18, the third incidence control plate 59 is provided with a horizontally elongated slit-shaped incidence hole 59a at the center of the main body. .

Therefore, the electron beam 17 emitted from the electron gun 4 enters from the entrance hole 59 a of the third incidence control plate 59 (this is not necessarily required) and irradiates the vapor deposition material 18 in the crucible 22. And heat. As a result, the flying material 18A that flies is regulated by the third incidence regulating plate 59 in addition to the regulation by the second incidence regulating plate 40. A suitable flying region A is formed by controlling the adhesion, and efficient vapor deposition becomes possible.

However, there is a limit to the height of the third incidence control plate 59. In other words, if it is too high, the second incidence control plate 4
The distance from 0 becomes narrower, so that the vapor deposition material hardly flies, and it becomes impossible to irradiate the beam 17 from above the third incidence control plate 59 without providing the entrance hole 59a.

Both the second incidence regulating plate 40 and the third incidence regulating plate 59 can melt and recycle the deposit 19 by the secondary electrons of the electron beam 17 and the radiant heat from the surface of the molten metal in the crucible 22. The second regulating plate 40 is formed as large as possible. Both the second and third incidence control plates are made of, for example, oxide ceramic.

As a result, the second incidence control plate 40 melts the attached matter on the surface and returns it to the crucible 22.
It works for recycling. Further, the third incidence control plate 59 is heated by the passage of the electron beam 17, melts the deposits attached to the third incidence control plate 59, and returns to the crucible 22.
Therefore, conventionally, the flying material 18A has scattered up to the upper portion of the side wall of the deposition-inhibiting plate 32. However, the installation of the third incidence control plate 59 enables control of the flying region of the flying material,
The amount of adhesion to the anti-deposition plate and shutter is reduced, and the deposition rate is about 5%
improves. Further, cleaning of the regulating plate is also facilitated.

FIG. 19 shows a state in which the attached matter 19 has been melted and returned into the crucible 22 from the state of FIG. 18 in which the attached matter 19 has adhered to the second incidence control plate 40.

As a modification of the present embodiment, a moving mechanism for moving the second incidence restricting plate 40 can be used in the same manner as in the second embodiment. FIG. 20 shows a moving mechanism (see FIGS. 14 to 17) provided with the moving mechanism (in FIG. 20, only a part is shown and other parts are not shown).

As a result, the deposit 19 accumulates on the second incidence control plate 40, and as described above, even if the deposit 19 is melted, a portion remains without being completely melted, and the deposit 19 is deposited. If there is any trouble, the normal incidence area A is restored again by operating the moving mechanism to retreat the second incidence control plate 40 rightward in the drawing as shown in FIG.

The third incidence control plate 59 in the present embodiment.
Does not have the entrance hole 59a, and the electron beam 17
May be made to enter the crucible 22 from above the incidence regulating plate 59. As described above, the above-described configuration is possible regardless of the incident path of the electron beam 17, and it is possible to use various types of incidence control plates.

According to the embodiment shown in FIGS. 18 to 21, the second incidence regulating plate 40 and the third incidence regulating plate 59 are provided opposite to the second incidence regulating plate 40, so that the second incidence regulating plate is provided. Since the plate 40 regulates the adhesion of the deposit 19 to the shutter 6 and the third incidence regulating plate 59 regulates the adhesion of the deposit 19 to the deposition-preventing plate 32 side, the overall optimum flying material 18A
Can be formed. Therefore, the deposition prevention plate 3
The adhesion of the deposit 19 to the shutter 2 and the shutter 6 can be reduced, and the deposition can be efficiently performed on the base film 9.

Further, the deposit 19 adhered to the second incidence regulating plate 40 and the third incidence regulating plate 59 is melted and crucible 2
2 and can be recycled and reused, so that the evaporation material 18 can be saved. However, when the deposit 19 on the second incident control plate 40 is not completely melted and there is a problem in the incident area, the second incident restricting plate 40 is moved backward to move the incident light to the required position. The area can be recovered.

The embodiments of the present invention have been described above. However, each of the above-described embodiments can be variously modified based on the technical idea of the present invention.

For example, the moving mechanism 21 of the vapor deposition material source in the first embodiment and the moving mechanism 21A of the vapor deposition material source in the second and third embodiments can be performed by an appropriate method other than the embodiment. is there. Further, any of vertical movement and horizontal movement may be used.

Further, the shape and size of the incidence control plate in the second and third embodiments may be any suitable shape and size other than those of the embodiment. May be used in combination with the embodiment.

The electron gun 4 may be installed in the first embodiment in a lateral irradiation manner as in the second and third embodiments, and the second and third embodiments may be employed. May be applied from above as in the first embodiment.

The essential parts of the above embodiment can be applied to a vacuum evaporation apparatus other than the vacuum evaporation apparatus used in the embodiment. For example, the present invention can also be applied to an apparatus for selectively heating and depositing with a heater. in this case,
Only the movement of the crucible needs to be controlled.

Each of the above embodiments can be applied to various magnetic cards other than magnetic tapes, and can also be applied to a numerical controller using a magnescale.

[0099]

As described above, the material flying device according to the present invention is a material flying device for adhering flying material from a flying source onto a substrate through an opening for regulating a flying region. Is adjusted so that the state of incidence of the flying material on the base is maintained, so that the flying material can be efficiently adhered to the base under a substantially constant incidence state. As a result, uniform adhesion can be obtained, and a product of constant quality can be produced at low cost.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a vacuum deposition apparatus according to a first embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of a part of the vacuum evaporation apparatus, showing a state before an adhered substance is attached.

FIG. 3 is an enlarged cross-sectional view of a part of the vacuum evaporation apparatus, showing a state where an adhered substance is attached.

FIG. 4 is a schematic side view showing a moving mechanism of a deposition source of the vacuum deposition apparatus.

FIG. 5 is an enlarged sectional view of a part of the vacuum evaporation apparatus, showing a state where an evaporation source is moved.

FIG. 6 is a schematic side view showing a state before and after movement of a deposition source of the vacuum deposition apparatus.

FIG. 7 is a schematic perspective view showing a cooling mechanism of a deposition-preventing plate of the vacuum evaporation apparatus.

FIG. 8 is a schematic diagram showing a deposited layer of a base film by the vacuum deposition apparatus.

FIG. 9 is a block diagram showing a control mechanism of the vacuum evaporation apparatus.

FIG. 10 is a schematic sectional view of a main part of a vacuum evaporation apparatus according to a second embodiment of the present invention.

FIG. 11 is a schematic perspective view showing a part of the vacuum evaporation apparatus.

FIG. 12 is a schematic sectional view of a main part of the vacuum evaporation apparatus,
It is a figure which shows the state to which the attached matter adhered.

FIG. 13 is a schematic sectional view of a main part of the vacuum evaporation apparatus,
It is a figure showing the state where the 2nd incidence control board was moved.

FIG. 14 is a front view (a cross-sectional view taken along the line XIV-XIV in FIG. 15) showing the vicinity of the flying material source of the vacuum evaporation apparatus and showing a part of the cross-section.

FIG. 15 is a plan view of FIG.

FIG. 16 is a left side view of FIG.

FIG. 17 is a bottom view of FIG.

FIG. 18 is a schematic cross-sectional view of a main part of a vacuum evaporation apparatus according to a third embodiment of the present invention, showing a state where an adhered substance has adhered.

FIG. 19 is an enlarged cross-sectional view of a part (a part of FIG. 17) of the vacuum evaporation apparatus, showing a state in which an adhered substance is melted and returned to the crucible.

FIG. 20 is an enlarged cross-sectional view of a part of the vacuum evaporation apparatus;
FIG. 9 is a diagram illustrating a state in which an adhering substance has adhered to a second incidence control plate.

FIG. 21 is an enlarged sectional view of a part of the vacuum evaporation apparatus,
It is a figure showing the state where the 2nd incidence control board was moved.

FIG. 22 is a schematic sectional view of a vacuum evaporation apparatus according to a conventional example.

FIG. 23 is an enlarged cross-sectional view of a part of the vacuum evaporation apparatus.
It is a figure which shows the state to which the attached matter adhered.

[Explanation of symbols]

2. Cooling roll, 3, 22 crucible (evaporation source), 4
... Electron gun, 5, 32 ... Deposition plate, 5a ... Arc portion of deposition plate, 6
... Shutter, 9 ... Base film, 10a, 10b ...
Opening, 12, 12A Lifter, 17 Electron beam, 1
8: evaporation material, 18A: flying material, 19: deposit, 20
... Evaporation apparatus, 21 ... Drive mechanism, 23 ... Upper stage, 2
4 lower stage, 25 rail, 26 engaging part, 27
... Rack, 28 ... Pinion, 29, 60 ... Pulse motor, 30, 44a, 45a, 50, 50A, 61, 64
... shaft, 31, 41 deflection coil, 33 cooling pipe, 34 magnetic film, 35 pulse generator, 36 ...
Driver 37 37 Memory unit 38 Electron beam deflection circuit 39 Amplifier 40 and 59 Incident control plate 42
Motor, 43a, 43b, 43c, 62, 63 ... bevel gear, 44 ... ball screw, 44b, 65 ... bearing, 45b ...
Slide bearing, 46: Fixing plate, 47: Rotating introducer, 48: Flexible wire, 49: Handle, 51: Coupling, 52: Chamber, 52a ...
Through holes, 53A, 53B ... yoke, 55 ... main parts, 56,
57: holding member, 57a: bolt, 58: base, 59
a: beam entrance hole, A: flight area

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Jun Sasaki 6-7-35 Kita Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation

Claims (28)

[Claims] 1. A material flying device for adhering flying material from a flying source onto a substrate through an opening for regulating a flying region, wherein the position of the flying source is adjusted, and the state of incidence of the flying material on the substrate. A material flying device characterized in that the material is held. 2. The apparatus according to claim 1, wherein the position of the flying source is adjusted by moving the flying source. 3. The apparatus according to claim 1, wherein the flying source moves in accordance with the amount of the flying material attached to the flying region regulating means having the opening. 4. The apparatus according to claim 1, wherein a beam irradiation position for heating the flying source is changed following the movement of the flying source. 5. The apparatus according to claim 4, wherein the movement of the flying source and the change of the beam irradiation position are performed during the flying operation of the material. 6. The apparatus according to claim 5, wherein the movement of the flight source and the change of the beam irradiation position are performed based on a predetermined program. 7. The apparatus according to claim 1, wherein during vacuum vapor deposition, the vapor deposition source moves according to the amount of the vapor deposition material deposited on the incident angle regulating mask having an opening. 8. The apparatus according to claim 7, wherein an irradiation position of an electron beam for heating the evaporation source is changed following movement of the evaporation source. 9. The apparatus according to claim 7, wherein a constituent material of the magnetic recording medium is deposited on the substrate. 10. The apparatus according to claim 9, wherein the vapor deposition is performed while the substrate is guided obliquely downward from above the vapor deposition source. 11. A material flying device which uses a regulating means having an opening for regulating a flying area, and attaches a flying material from a flying source to the substrate through the opening of the regulating means. At least the second regulating means of the second regulating means for regulating and the third regulating means opposed to the regulating means is provided in the flying source to fly the flying material adhered to the second and third regulating means. A material circulating device, wherein the position of the second regulating means is adjusted to maintain the state of incidence of the flying material on the substrate. 12. The apparatus according to claim 11, wherein the angle of incidence of the flying material is adjusted by moving the second regulating means. 13. The apparatus according to claim 11, wherein said control means moves according to the amount of flying material deposited on said second control means. 14. The apparatus according to claim 11, wherein a drive mechanism of the second restricting means is provided below the flying source. 15. The apparatus according to claim 14, wherein the drive mechanism is constituted by a drive motor and a transmission means for transmitting the drive of the motor to the second regulating means. 16. The driving mechanism is manually operated.
An apparatus according to claim 14. 17. The apparatus according to claim 11, wherein the movement of the second regulating means is performed based on a predetermined program. 18. The apparatus according to claim 11, wherein the second regulating means extends above the third regulating means. 19. The apparatus according to claim 11, wherein at the time of vacuum deposition, the second regulating means moves in accordance with the amount of deposition material deposited on the second regulating means. 20. The apparatus according to claim 18, wherein a constituent material of the magnetic recording medium is deposited on the substrate. 21. The apparatus according to claim 20, wherein the vapor deposition is performed while the substrate is guided obliquely downward from above the vapor deposition source to the second regulating means. 22. A material flying device which uses a regulating means having an opening for regulating a flying area, and attaches a flying material from a flying source to the substrate through the opening of the regulating means. A second regulating means for regulating and a third regulating means opposed thereto are provided in the flying source,
A flying material which circulates flying material adhering to the second and third regulating means to a flying position, and maintains an incident state of the flying material on the substrate. 23. The apparatus according to claim 11, wherein the third regulating means is provided on a beam incident side for heating the flying source. 24. The apparatus according to claim 11, wherein a heating beam passage hole is provided in the third regulating means. 25. The apparatus according to claim 22, wherein the second restricting means extends above the third restricting means. 26. The apparatus according to claim 22, wherein the constituent material is deposited on the magnetic recording medium on the substrate. 27. The apparatus according to claim 26, wherein the evaporation is performed while the substrate is guided obliquely downward from above the evaporation source toward the second regulating means. 28. A material flying source comprising the flying source according to any one of claims 1 to 27.