JPH1111065A - Manufacture of ic card for identifying certification - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent distortion or deviation of an image receiving sheet while maintaining smoothness of an area for forming a certification identifying image by forming a mold of a porous material except a part in contact with a center of an image forming area, and injection molding while sucking it. SOLUTION: A writing sheet 1 adhered at its rear surface with an IC module 8 is placed in a lower mold 21 having a gate 23, and an image receiving sheet 6 is placed in an upper mold 22 so that an image receiving layer side is brought into contact with the mold. The mold is formed of porous material except a part 221 in contact with a center of a certification identifying image forming area 9 of the sheet 6. A sucking means is connected to the mold, and the sheet 1 and the sheet 6 are vacuum sucked and fixed. The molds are butted to form a cavity 24. Board resin is injected from a gate 23 in the cavity 24, and the cavity 24 is compressed by the upper mold. Thus, a distortion or deviation of the receiving sheet can be prevented while maintaining smoothness of an area for forming the certification identifying image.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card suitable for use as an identification card for a driver's license, an employee card, a membership card, an alien registration card, a student ID card, etc. by an injection molding method. It relates to a method of manufacturing.

[0002]

2. Description of the Related Art A non-contact type IC card is capable of forming an authentication identification image such as a face image and printing on the surface because electric parts are not exposed on the surface. By storing personal identification information or the like in the storage device, it is advantageous to prevent forgery and falsification, and is suitable for use as an authentication identification card. As the manufacturing method, a heat bonding method, an adhesive bonding method, and an injection molding method are known. Among them, the injection molding method is advantageous for mass production.

As a method of manufacturing an IC card by injection molding, Japanese Patent Application Laid-Open Nos. 5-286292 and 5-286294.
No. 5-286295 and No. 7-232345, an IC card substrate having a concave portion for accommodating an IC module is manufactured by injection molding, and the module is placed in the concave portion, and
Japanese Patent Application Laid-Open No. Hei 5-218237 discloses that a foamable resin is injected into a skin container having a part including an IC chip mounted therein and foamed to fill the inside of the IC card with a resin. Japanese Unexamined Patent Publication No. Sho 61-26285 discloses that an IC card is formed by mounting a part including a surface sheet and an IC chip on one surface of a mold and injecting resin.
-222712, 61-222713, 61-
No. 222715 describes that an IC card is formed by mounting a component including an IC chip at a predetermined position in a mold and injecting resin. Of these,
Parts including the both surface sheets and the IC chip are previously placed at predetermined positions in the mold, resin is injected, and the resin is integrally molded.
The advantage of using a C card is that the process can be simplified.

[0004]

However, when the topsheet is placed on a mold in advance and the resin is injected, the topsheet is distorted or the sheet is displaced due to the inflow of high-temperature resin. May be lost.

In recent years, a face image for authentication / identification is often formed by a sublimation thermal transfer system having high gradation and excellent resolution. In this case, the area where the authentication / identification image is formed is required to be very smooth. Can be

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an authentication identification IC capable of preventing distortion and displacement of an image receiving sheet while maintaining the smoothness of an area where an authentication identification image is formed. An object of the present invention is to provide a method for manufacturing a card.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an image receiving sheet having an area for forming an authentication identification image in a mold in advance with the image forming area on the mold side, and further mounting an IC chip. Injecting the resin by placing the parts including at a predetermined position in the mold, and injecting the resin, forming at least the mold with a porous material except for a portion in contact with the center of the image forming area, A method for manufacturing an authentication / identification IC card in which injection molding is performed while sucking, a portion formed of the porous material of the mold is other than a portion in contact with the image forming region, and the image receiving sheet receives a sublimation thermal transfer image. This is achieved by compressing the entire surface after the resin is injected, and further pressing the injection gate side.

That is, even if the present inventor employs a mold provided with a suction port for fixing the image receiving sheet, the distortion of the sheet due to the unevenness of the shrinkage of the sheet due to the inflow of the high-temperature resin can be effectively reduced. Although it is difficult to prevent this, distortion can be suppressed by evenly adsorbing the entire surface of the sheet to the mold, and even if fine and uniform irregularities due to uniform adsorption are present in the authentication identification image forming area, However, the present invention has been found that the distortion can be suppressed and the smoothness can be maintained without suction even in the region where the authentication identification image (face image) is formed, although the deterioration is not so large.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to embodiments, but embodiments of the present invention are not limited thereto.

FIG. 1 shows the configuration of a cross section in the long side direction of an IC card according to the present invention.

In FIG. 1, an IC chip 2 and a coiled antenna 3 are adhered to an underside of a writing sheet 1 having a writable surface directly or via a cushion layer with an adhesive 5 together with a joint 4 (adhesion). The whole enclosed with the agent 5 is also called an IC module). Reference numeral 6 denotes an image receiving sheet having an image receiving layer on its outer surface, and the substrate resin 7 between the writing sheet and the image receiving sheet is filled by injection.

The image receiving sheet can be formed of a polymer material such as polyvinyl chloride resin, polyester resin, polyvinyl acetal resin, polyvinyl butyral resin, epoxy resin and acrylic resin.

[0013] The writing sheet is prepared by adding an inorganic fine powder such as calcium carbonate, talc, diatomaceous earth, titanium oxide, barium sulfate or the like to a film of a thermoplastic resin (polyolefins such as polyethylene, various copolymers, etc.). Form.

As the substrate resin, an ABS resin is generally widely used and can be applied to the present invention. However, PET-G (R) of Eastman Chemical Co., Ltd., whose crystallization is controlled for injection molding, is: It is also preferable in that the image receiving sheet is easily fused.

Although the IC module shown in FIG. 1 has an antenna coil, an IC module having an antenna pattern formed on a printed circuit board may be used. As the printed circuit board, a thermoplastic film such as polyester is used, and when heat resistance is required, polyimide is advantageous. In this case, the bonding between the IC chip and the antenna pattern is performed using a conductive adhesive such as a silver paste, a copper paste, or a carbon paste (Hitachi Chemical's EN-4000 series,
This is performed using an anisotropic conductive film (such as Anisorm manufactured by Hitachi Chemical Co., Ltd.) or a Toshiba Chemical XAP series.

FIG. 2 is a view for explaining the integral molding method according to the present invention.

In FIG. 2, a writing sheet 1 having an IC module 8 adhered to a back surface is placed on a lower mold 21 having a gate 23, and an image is received on an upper mold 22 such that the image receiving layer side is in contact with the mold. The sheet 6 is placed. Both dies are made of a porous material except for at least a portion 221 in contact with the central portion of the authentication / identification image forming area 9 of the image receiving sheet 6. If possible, the entire area of the authentication identification image forming area 9 may be removed. Examples of the porous material include Porcelax II manufactured by Shinto Kogyo Co., Ltd., and the average pore size of the mold is 3 to 7 μm, the porosity is about 25%, and the thermal conductivity is 0. 07
It is preferably formed at about 0.08 cal / cm · sec · ° C. By connecting both dies to suction means (not shown), the writing sheet 1 and the image receiving sheet 6 are fixed by vacuum suction. A cavity 24 is formed by abutting both molds, and after injecting the substrate resin from the gate 23, the cavity 24 is compressed by the upper mold to a position corresponding to the thickness of the card indicated by the alternate long and short dash line as indicated by an arrow. Thus, the gate is cut and the mold is opened, whereby the IC card as shown in FIG. 1 is obtained.

In general, the thickness of the card on the gate side tends to increase. According to the present invention, both the writing sheet and the image receiving sheet are firmly fixed to the mold. There is a risk that the adhesion to the substrate will be weak. Therefore, after injecting the resin and compressing the entire surface, it is preferable to further press the injection gate side before the resin temperature decreases. As a result, the thickness of the card can be made uniform, and the adhesion between the sheet and the substrate resin can be increased.

In the present invention, it is preferable that the position of the gate is on one short side of the card. If the length of the long side of the card is L, the mounting position of the IC module is 1L / 4 from the gate side. It is preferably in the range of ３3 L / 4. If the IC chip is too close to the gate, it will be broken by thermal shock due to the inflow of high-temperature molten resin, or broken by applying pressure to the gate side to correct the thicker card on the gate side. May be done. If the IC module is too close to the short side facing the gate, the temperature of the substrate resin increases, the viscosity increases, and the fluidity becomes poor. Deteriorates smoothness,
In some cases, the adhesion is broken and the module is washed away and pressed against the short side facing the gate.

The position of the chip or the antenna coil in the IC module is not particularly limited as long as it is in the above-mentioned area. If the IC chip is not located in the area where the authentication identification image is formed, the image will not be affected even if the card surface has irregularities due to the presence of the IC chip. Also, if the IC chip overlaps the area where the authentication identification image is formed, attempting to modify the face image will destroy the junction between the chip and the antenna, which is effective in preventing false alteration. It is.

[0021]

According to the present invention, a mold is formed of a porous material except for at least a portion in contact with the central portion of the authentication / identification image forming area, and injection molding is performed while suction is performed. It is possible to prevent the image receiving sheet from being distorted or displaced while maintaining the smoothness of the region where the image is to be formed.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a cross section of a long side direction of an IC card according to the present invention.

FIG. 2 is a diagram illustrating an integral molding method according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Writing sheet 2 IC chip 3 Coiled antenna 4 Joining part 5 Adhesive 6 Image receiving sheet 7 Substrate resin 8 IC module 9 Authentication / identification image forming area 21 Lower mold 22 Upper mold 23 Gate 24 Cavity

Claims (4)

[Claims] An image receiving sheet having an area in which an authentication identification image is formed in advance on a mold is placed with the image forming area on the mold side, and a part including an IC chip is placed at a predetermined position in the mold. When the resin is placed and injected, and integrally molded, at least the mold is formed of a porous material except for a portion in contact with the center of the image forming area, and the injection molding is performed while sucking. Of manufacturing an authentication and identification IC card. 2. The method for manufacturing an authentication / identification IC card according to claim 1, wherein a portion formed of the porous material of the mold is other than a portion in contact with the image forming region. 3. The method of manufacturing an authentication / identification IC card according to claim 1, wherein the image receiving sheet receives a sublimation thermal transfer image. 4. The method for manufacturing an authentication / identification IC card according to claim 1, wherein after the resin is injected, the entire surface is compressed and the injection gate side is further pressed.