JPH11163070A5 - - Google Patents

Info

Publication number
JPH11163070A5
JPH11163070A5 JP1997322643A JP32264397A JPH11163070A5 JP H11163070 A5 JPH11163070 A5 JP H11163070A5 JP 1997322643 A JP1997322643 A JP 1997322643A JP 32264397 A JP32264397 A JP 32264397A JP H11163070 A5 JPH11163070 A5 JP H11163070A5
Authority
JP
Japan
Prior art keywords
temperature
control method
treatment process
semiconductor device
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997322643A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11163070A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9322643A priority Critical patent/JPH11163070A/ja
Priority claimed from JP9322643A external-priority patent/JPH11163070A/ja
Publication of JPH11163070A publication Critical patent/JPH11163070A/ja
Publication of JPH11163070A5 publication Critical patent/JPH11163070A5/ja
Withdrawn legal-status Critical Current

Links

JP9322643A 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法 Withdrawn JPH11163070A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9322643A JPH11163070A (ja) 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9322643A JPH11163070A (ja) 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法

Publications (2)

Publication Number Publication Date
JPH11163070A JPH11163070A (ja) 1999-06-18
JPH11163070A5 true JPH11163070A5 (2) 2004-12-02

Family

ID=18146001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9322643A Withdrawn JPH11163070A (ja) 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法

Country Status (1)

Country Link
JP (1) JPH11163070A (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100974502B1 (ko) 2008-03-28 2010-08-10 우진 일렉트로나이트(주) 로내부의 온도감지장치
JP2016076529A (ja) * 2014-10-03 2016-05-12 東京エレクトロン株式会社 温度測定用支持部材及び熱処理装置
CN104460764A (zh) * 2014-11-28 2015-03-25 广东工业大学 一种基于去伪控制的模糊pid的挤出机机筒温度控制方法
EP4529612A1 (en) * 2022-05-23 2025-04-02 Watlow Electric Manufacturing Company Compliant temperature sensing system

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