JPS51140478A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS51140478A
JPS51140478A JP50064197A JP6419775A JPS51140478A JP S51140478 A JPS51140478 A JP S51140478A JP 50064197 A JP50064197 A JP 50064197A JP 6419775 A JP6419775 A JP 6419775A JP S51140478 A JPS51140478 A JP S51140478A
Authority
JP
Japan
Prior art keywords
lead frame
improve
rigid
yield
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50064197A
Other languages
English (en)
Inventor
Seishiro Owaki
Michio Tanimoto
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50064197A priority Critical patent/JPS51140478A/ja
Publication of JPS51140478A publication Critical patent/JPS51140478A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP50064197A 1975-05-30 1975-05-30 Lead frame Pending JPS51140478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50064197A JPS51140478A (en) 1975-05-30 1975-05-30 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50064197A JPS51140478A (en) 1975-05-30 1975-05-30 Lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP51101663A Division JPS5252370A (en) 1976-08-27 1976-08-27 Fabrication of glass-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS51140478A true JPS51140478A (en) 1976-12-03

Family

ID=13251091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50064197A Pending JPS51140478A (en) 1975-05-30 1975-05-30 Lead frame

Country Status (1)

Country Link
JP (1) JPS51140478A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5390868A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Semiconductor device of glass ceramic package type
JPS5867055A (ja) * 1981-10-19 1983-04-21 Toshiba Corp 半導体装置用リ−ドフレ−ム
JPS5867056A (ja) * 1981-10-19 1983-04-21 Toshiba Corp 半導体装置用リ−ドフレ−ム
JPS58115842A (ja) * 1981-12-28 1983-07-09 Fujitsu Ltd 半導体装置
JPS60143654A (ja) * 1983-12-29 1985-07-29 Matsushita Electric Ind Co Ltd 電子部品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844466U (ja) * 1971-09-30 1973-06-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844466U (ja) * 1971-09-30 1973-06-09

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5390868A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Semiconductor device of glass ceramic package type
JPS5867055A (ja) * 1981-10-19 1983-04-21 Toshiba Corp 半導体装置用リ−ドフレ−ム
JPS5867056A (ja) * 1981-10-19 1983-04-21 Toshiba Corp 半導体装置用リ−ドフレ−ム
JPS58115842A (ja) * 1981-12-28 1983-07-09 Fujitsu Ltd 半導体装置
JPS60143654A (ja) * 1983-12-29 1985-07-29 Matsushita Electric Ind Co Ltd 電子部品

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