JPS51150972A - Process for cleaning semiconductor substrate polished - Google Patents

Process for cleaning semiconductor substrate polished

Info

Publication number
JPS51150972A
JPS51150972A JP51035225A JP3522576A JPS51150972A JP S51150972 A JPS51150972 A JP S51150972A JP 51035225 A JP51035225 A JP 51035225A JP 3522576 A JP3522576 A JP 3522576A JP S51150972 A JPS51150972 A JP S51150972A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
cleaning semiconductor
substrate polished
polished
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51035225A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5338592B2 (fr
Inventor
Guriesuhamaa Rudorufu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of JPS51150972A publication Critical patent/JPS51150972A/ja
Publication of JPS5338592B2 publication Critical patent/JPS5338592B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Detergent Compositions (AREA)
JP51035225A 1975-06-11 1976-04-01 Process for cleaning semiconductor substrate polished Granted JPS51150972A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2526052A DE2526052C2 (de) 1975-06-11 1975-06-11 Verfahren zum Reinigen polierter Halbleiterscheiben

Publications (2)

Publication Number Publication Date
JPS51150972A true JPS51150972A (en) 1976-12-24
JPS5338592B2 JPS5338592B2 (fr) 1978-10-16

Family

ID=5948838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51035225A Granted JPS51150972A (en) 1975-06-11 1976-04-01 Process for cleaning semiconductor substrate polished

Country Status (7)

Country Link
JP (1) JPS51150972A (fr)
BE (1) BE842810A (fr)
DE (1) DE2526052C2 (fr)
DK (1) DK144776A (fr)
GB (1) GB1553695A (fr)
IT (1) IT1061334B (fr)
NL (1) NL7603267A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126838A (ja) * 1983-12-13 1985-07-06 Mitsubishi Monsanto Chem Co ひ化ガリウム単結晶ウエハの洗滌液および洗滌方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129457A (en) * 1977-05-23 1978-12-12 International Business Machines Corporation Post-polishing cleaning of semiconductor surfaces
JPS6040705B2 (ja) * 1978-06-26 1985-09-12 インタ−ナシヨナル・ビジネス・マシ−ンンズ・コ−ポレ−シヨン 電子回路の保護被覆形成方法
DE3328639A1 (de) * 1983-08-09 1985-02-21 Merck Patent Gmbh, 6100 Darmstadt Reinigungsmittel fuer mechanisch bearbeitete halbleitermaterialien
DE3834396A1 (de) * 1988-10-10 1990-04-12 Telefunken Electronic Gmbh Verfahren zum entfernen von oberflaechenschichten
DE4103084A1 (de) * 1991-02-01 1992-08-13 Wacker Chemitronic Magazin zur halterung von scheibenfoermigen werkstuecken, insbesondere halbleiterscheiben, bei der nasschemischen oberflaechenbehandlung in fluessigkeitsbaedern
US5320706A (en) * 1991-10-15 1994-06-14 Texas Instruments Incorporated Removing slurry residue from semiconductor wafer planarization
US5911889A (en) * 1995-05-11 1999-06-15 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Aktiengesellschaft Method of removing damaged crystal regions from silicon wafers
US6074935A (en) * 1997-06-25 2000-06-13 Siemens Aktiengesellschaft Method of reducing the formation of watermarks on semiconductor wafers
RU2219002C1 (ru) * 2002-04-08 2003-12-20 Панчеха Юрий Степанович Способ очистки изделий

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3342652A (en) * 1964-04-02 1967-09-19 Ibm Chemical polishing of a semi-conductor substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126838A (ja) * 1983-12-13 1985-07-06 Mitsubishi Monsanto Chem Co ひ化ガリウム単結晶ウエハの洗滌液および洗滌方法

Also Published As

Publication number Publication date
DK144776A (da) 1976-12-12
DE2526052C2 (de) 1983-04-21
NL7603267A (nl) 1976-12-14
BE842810A (fr) 1976-12-10
IT1061334B (it) 1983-02-28
JPS5338592B2 (fr) 1978-10-16
DE2526052A1 (de) 1976-12-30
GB1553695A (en) 1979-09-26

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