JPS5128555A - - Google Patents

Info

Publication number
JPS5128555A
JPS5128555A JP49100939A JP10093974A JPS5128555A JP S5128555 A JPS5128555 A JP S5128555A JP 49100939 A JP49100939 A JP 49100939A JP 10093974 A JP10093974 A JP 10093974A JP S5128555 A JPS5128555 A JP S5128555A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49100939A
Other languages
Japanese (ja)
Other versions
JPS5819385B2 (ja
Inventor
Shinzo Anazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP49100939A priority Critical patent/JPS5819385B2/ja
Publication of JPS5128555A publication Critical patent/JPS5128555A/ja
Publication of JPS5819385B2 publication Critical patent/JPS5819385B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP49100939A 1974-09-04 1974-09-04 ロウヅケホウホウ Expired JPS5819385B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49100939A JPS5819385B2 (ja) 1974-09-04 1974-09-04 ロウヅケホウホウ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49100939A JPS5819385B2 (ja) 1974-09-04 1974-09-04 ロウヅケホウホウ

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP57076941A Division JPS5890748A (ja) 1982-05-07 1982-05-07 半導体装置
JP57076942A Division JPS5890749A (ja) 1982-05-07 1982-05-07 半導体装置

Publications (2)

Publication Number Publication Date
JPS5128555A true JPS5128555A (2) 1976-03-10
JPS5819385B2 JPS5819385B2 (ja) 1983-04-18

Family

ID=14287309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49100939A Expired JPS5819385B2 (ja) 1974-09-04 1974-09-04 ロウヅケホウホウ

Country Status (1)

Country Link
JP (1) JPS5819385B2 (2)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54154970A (en) * 1978-05-26 1979-12-06 Kyushu Nippon Electric Semiconductor device
JPS5890748A (ja) * 1982-05-07 1983-05-30 Nec Corp 半導体装置
JPS5890749A (ja) * 1982-05-07 1983-05-30 Nec Corp 半導体装置
JPS6010762A (ja) * 1983-06-30 1985-01-19 Sumitomo Special Metals Co Ltd 複合ピン
JPS6213168U (2) * 1985-07-09 1987-01-27
JPH02224264A (ja) * 1990-01-20 1990-09-06 Sumitomo Electric Ind Ltd 半導体素子搭載用基板の製造方法
JP2023045408A (ja) * 2021-09-22 2023-04-03 本田技研工業株式会社 ろう付け方法
JP2024516742A (ja) * 2021-05-07 2024-04-16 マテリオン コーポレイション マイクロエレクトロニクスパッケージアセンブリおよび作製方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4887662U (2) * 1972-01-24 1973-10-23
JPS49674A (2) * 1972-04-19 1974-01-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4887662U (2) * 1972-01-24 1973-10-23
JPS49674A (2) * 1972-04-19 1974-01-07

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54154970A (en) * 1978-05-26 1979-12-06 Kyushu Nippon Electric Semiconductor device
JPS5890748A (ja) * 1982-05-07 1983-05-30 Nec Corp 半導体装置
JPS5890749A (ja) * 1982-05-07 1983-05-30 Nec Corp 半導体装置
JPS6010762A (ja) * 1983-06-30 1985-01-19 Sumitomo Special Metals Co Ltd 複合ピン
JPS6213168U (2) * 1985-07-09 1987-01-27
JPH02224264A (ja) * 1990-01-20 1990-09-06 Sumitomo Electric Ind Ltd 半導体素子搭載用基板の製造方法
JP2024516742A (ja) * 2021-05-07 2024-04-16 マテリオン コーポレイション マイクロエレクトロニクスパッケージアセンブリおよび作製方法
JP2023045408A (ja) * 2021-09-22 2023-04-03 本田技研工業株式会社 ろう付け方法

Also Published As

Publication number Publication date
JPS5819385B2 (ja) 1983-04-18

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