JPS52117068A - Preparation of resin-sealed type semiconductor device - Google Patents

Preparation of resin-sealed type semiconductor device

Info

Publication number: JPS52117068A
Authority: JP; Japan
Prior art keywords: resin; preparation; semiconductor device; type semiconductor; sealed type
Prior art date: 1976-03-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP3400176A

Other languages

English (en)

Japanese (ja)

Other versions

JPS5641170B2 (2

Inventor

Masahiro Fukuyama

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NEC Home Electronics Ltd

NEC Corp

Original Assignee

NEC Home Electronics Ltd

Nippon Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1976-03-26

Filing date

1976-03-26

Publication date

1977-10-01

1976-03-26 Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd

1976-03-26 Priority to JP3400176A priority Critical patent/JPS52117068A/ja

1977-10-01 Publication of JPS52117068A publication Critical patent/JPS52117068A/ja

1981-09-26 Publication of JPS5641170B2 publication Critical patent/JPS5641170B2/ja

Status Granted legal-status Critical Current

Links

239000004065 semiconductor Substances 0.000 title 1
238000010438 heat treatment Methods 0.000 abstract 2
239000011347 resin Substances 0.000 abstract 2
229920005989 resin Polymers 0.000 abstract 2
230000002542 deteriorative effect Effects 0.000 abstract 1
239000012535 impurity Substances 0.000 abstract 1

Landscapes

Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

JP3400176A 1976-03-26 1976-03-26 Preparation of resin-sealed type semiconductor device Granted JPS52117068A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP3400176A JPS52117068A (en)	1976-03-26	1976-03-26	Preparation of resin-sealed type semiconductor device

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP3400176A JPS52117068A (en)	1976-03-26	1976-03-26	Preparation of resin-sealed type semiconductor device

Publications (2)

Publication Number	Publication Date
JPS52117068A true JPS52117068A (en)	1977-10-01
JPS5641170B2 JPS5641170B2 (2)	1981-09-26

Family

ID=12402202

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP3400176A Granted JPS52117068A (en)	1976-03-26	1976-03-26	Preparation of resin-sealed type semiconductor device

Country Status (1)

Country	Link
JP (1)	JPS52117068A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS59200077A (ja) *	1983-04-28	1984-11-13	Tohoku Mikuni Kogyo Kk	往復型電磁ポンプ

1976
- 1976-03-26 JP JP3400176A patent/JPS52117068A/ja active Granted

Also Published As

Publication number	Publication date
JPS5641170B2 (2)	1981-09-26

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