JPS5243367A - Resin seal type semiconductor device - Google Patents

Resin seal type semiconductor device

Info

Publication number: JPS5243367A
Authority: JP; Japan
Prior art keywords: semiconductor device; type semiconductor; seal type; resin seal; resin
Prior art date: 1975-10-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP11770875A

Other languages

English (en)

Other versions

JPS6025902B2 (ja

Inventor

Masakazu Sakimoto

Toshihiko Ogu

Eiichi Yamada

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hitachi Ltd

Original Assignee

Hitachi Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-10-01

Filing date

1975-10-01

Publication date

1977-04-05

1975-10-01 Application filed by Hitachi Ltd filed Critical Hitachi Ltd

1975-10-01 Priority to JP11770875A priority Critical patent/JPS6025902B2/ja

1977-04-05 Publication of JPS5243367A publication Critical patent/JPS5243367A/ja

1985-06-20 Publication of JPS6025902B2 publication Critical patent/JPS6025902B2/ja

Status Expired legal-status Critical Current

Links

239000011347 resin Substances 0.000 title abstract 2
229920005989 resin Polymers 0.000 title abstract 2
239000004065 semiconductor Substances 0.000 title abstract 2
239000011248 coating agent Substances 0.000 abstract 1
238000000576 coating method Methods 0.000 abstract 1
239000000463 material Substances 0.000 abstract 1
239000000758 substrate Substances 0.000 abstract 1

Landscapes

Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

JP11770875A 1975-10-01 1975-10-01 樹脂封止型半導体装置 Expired JPS6025902B2 (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP11770875A JPS6025902B2 (ja)	1975-10-01	1975-10-01	樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP11770875A JPS6025902B2 (ja)	1975-10-01	1975-10-01	樹脂封止型半導体装置

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP59083702A Division JPS6034256B2 (ja)	1984-04-27	1984-04-27	樹脂封止型半導体装置の製法

Publications (2)

Publication Number	Publication Date
JPS5243367A true JPS5243367A (en)	1977-04-05
JPS6025902B2 JPS6025902B2 (ja)	1985-06-20

Family

ID=14718331

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP11770875A Expired JPS6025902B2 (ja)	1975-10-01	1975-10-01	樹脂封止型半導体装置

Country Status (1)

Country	Link
JP (1)	JPS6025902B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5693574A (en) *	1979-12-27	1981-07-29	Matsushita Electric Ind Co Ltd	Thermal head
JPS59210645A (ja) *	1984-04-27	1984-11-29	Hitachi Ltd	樹脂封止型半導体装置の製法
US10395963B2 (en)	2008-05-19	2019-08-27	Entegris, Inc.	Electrostatic chuck

1975
- 1975-10-01 JP JP11770875A patent/JPS6025902B2/ja not_active Expired

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5693574A (en) *	1979-12-27	1981-07-29	Matsushita Electric Ind Co Ltd	Thermal head
JPS59210645A (ja) *	1984-04-27	1984-11-29	Hitachi Ltd	樹脂封止型半導体装置の製法
US10395963B2 (en)	2008-05-19	2019-08-27	Entegris, Inc.	Electrostatic chuck

Also Published As

Publication number	Publication date
JPS6025902B2 (ja)	1985-06-20

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