JPS5247678A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5247678A
JPS5247678A JP50124096A JP12409675A JPS5247678A JP S5247678 A JPS5247678 A JP S5247678A JP 50124096 A JP50124096 A JP 50124096A JP 12409675 A JP12409675 A JP 12409675A JP S5247678 A JPS5247678 A JP S5247678A
Authority
JP
Japan
Prior art keywords
semiconductor device
facilitating
electrodes
formation
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50124096A
Other languages
Japanese (ja)
Other versions
JPS5712296B2 (en
Inventor
Masaharu Noyori
Isamu Kitahiro
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50124096A priority Critical patent/JPS5247678A/en
Publication of JPS5247678A publication Critical patent/JPS5247678A/en
Publication of JPS5712296B2 publication Critical patent/JPS5712296B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To make electrode wiring by way of the through-holes formed in the adhesive layer in the groove holes of an insulating film layer, thereby facilitating the formation of electrodes of a narrow space.
COPYRIGHT: (C)1977,JPO&Japio
JP50124096A 1975-10-14 1975-10-14 Semiconductor device Granted JPS5247678A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50124096A JPS5247678A (en) 1975-10-14 1975-10-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50124096A JPS5247678A (en) 1975-10-14 1975-10-14 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5247678A true JPS5247678A (en) 1977-04-15
JPS5712296B2 JPS5712296B2 (en) 1982-03-10

Family

ID=14876812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50124096A Granted JPS5247678A (en) 1975-10-14 1975-10-14 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5247678A (en)

Also Published As

Publication number Publication date
JPS5712296B2 (en) 1982-03-10

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