JPS5253665A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5253665A
JPS5253665A JP50129215A JP12921575A JPS5253665A JP S5253665 A JPS5253665 A JP S5253665A JP 50129215 A JP50129215 A JP 50129215A JP 12921575 A JP12921575 A JP 12921575A JP S5253665 A JPS5253665 A JP S5253665A
Authority
JP
Japan
Prior art keywords
semiconductor device
adhesiveness
stem
improve
supporting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50129215A
Other languages
Japanese (ja)
Inventor
Hideo Enari
Naoyuki Nagashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50129215A priority Critical patent/JPS5253665A/en
Publication of JPS5253665A publication Critical patent/JPS5253665A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the adhesiveness between stem and sealing material by providing stepped holes in a supporting plate.
JP50129215A 1975-10-29 1975-10-29 Semiconductor device Pending JPS5253665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50129215A JPS5253665A (en) 1975-10-29 1975-10-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50129215A JPS5253665A (en) 1975-10-29 1975-10-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5253665A true JPS5253665A (en) 1977-04-30

Family

ID=15003971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50129215A Pending JPS5253665A (en) 1975-10-29 1975-10-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5253665A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53158863U (en) * 1977-05-19 1978-12-13
JPS5676542A (en) * 1979-11-28 1981-06-24 Hitachi Ltd Resin-sealed semiconductor device
US4326215A (en) * 1979-02-23 1982-04-20 Hitachi, Ltd. Encapsulated semiconductor device with a metallic base plate
JPS63224245A (en) * 1987-03-13 1988-09-19 Hitachi Ltd Lead frame and semiconductor device
JPH0629448A (en) * 1992-09-28 1994-02-04 Hitachi Ltd Lead frame and semiconductor device
US5336931A (en) * 1993-09-03 1994-08-09 Motorola, Inc. Anchoring method for flow formed integrated circuit covers
USRE37690E1 (en) 1987-02-25 2002-05-07 Hitachi, Ltd. Lead frame and semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53158863U (en) * 1977-05-19 1978-12-13
US4326215A (en) * 1979-02-23 1982-04-20 Hitachi, Ltd. Encapsulated semiconductor device with a metallic base plate
JPS5676542A (en) * 1979-11-28 1981-06-24 Hitachi Ltd Resin-sealed semiconductor device
USRE37690E1 (en) 1987-02-25 2002-05-07 Hitachi, Ltd. Lead frame and semiconductor device
JPS63224245A (en) * 1987-03-13 1988-09-19 Hitachi Ltd Lead frame and semiconductor device
JPH0629448A (en) * 1992-09-28 1994-02-04 Hitachi Ltd Lead frame and semiconductor device
US5336931A (en) * 1993-09-03 1994-08-09 Motorola, Inc. Anchoring method for flow formed integrated circuit covers

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