JPS5257972A - Method of plating conductive layer on circuit substrate - Google Patents

Method of plating conductive layer on circuit substrate

Info

Publication number
JPS5257972A
JPS5257972A JP51131173A JP13117376A JPS5257972A JP S5257972 A JPS5257972 A JP S5257972A JP 51131173 A JP51131173 A JP 51131173A JP 13117376 A JP13117376 A JP 13117376A JP S5257972 A JPS5257972 A JP S5257972A
Authority
JP
Japan
Prior art keywords
conductive layer
circuit substrate
plating conductive
plating
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51131173A
Other languages
English (en)
Japanese (ja)
Inventor
Etsuchi Horouei Pouru
Emu Matotsukusu Donarudo
Shii Neruson Jierarudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Government of the United States of America
Original Assignee
Government of the United States of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Government of the United States of America filed Critical Government of the United States of America
Publication of JPS5257972A publication Critical patent/JPS5257972A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP51131173A 1975-10-30 1976-10-29 Method of plating conductive layer on circuit substrate Pending JPS5257972A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62742075A 1975-10-30 1975-10-30

Publications (1)

Publication Number Publication Date
JPS5257972A true JPS5257972A (en) 1977-05-12

Family

ID=24514575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51131173A Pending JPS5257972A (en) 1975-10-30 1976-10-29 Method of plating conductive layer on circuit substrate

Country Status (5)

Country Link
JP (1) JPS5257972A (fr)
CA (1) CA1058330A (fr)
DE (1) DE2649091A1 (fr)
FR (1) FR2330245A1 (fr)
GB (1) GB1539272A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0074605B1 (fr) * 1981-09-11 1990-08-29 Kabushiki Kaisha Toshiba Procédé pour fabriquer un substrat pour circuit multicouches
JPS59167096A (ja) * 1983-03-11 1984-09-20 日本電気株式会社 回路基板
JPH0732158B2 (ja) * 1988-04-08 1995-04-10 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 電子部品のための多層金属構造

Also Published As

Publication number Publication date
FR2330245A1 (fr) 1977-05-27
GB1539272A (en) 1979-01-31
DE2649091A1 (de) 1977-05-12
CA1058330A (fr) 1979-07-10
FR2330245B3 (fr) 1979-07-13

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