CA1058330A - Methode de depose de couches conductrices sur des supports - Google Patents

Methode de depose de couches conductrices sur des supports

Info

Publication number
CA1058330A
CA1058330A CA259,725A CA259725A CA1058330A CA 1058330 A CA1058330 A CA 1058330A CA 259725 A CA259725 A CA 259725A CA 1058330 A CA1058330 A CA 1058330A
Authority
CA
Canada
Prior art keywords
layer
metal
adhesion
thickness
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA259,725A
Other languages
English (en)
Inventor
Donald M. Mattox
Paul H. Holloway
Gerald C. Nelson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
US Department of Energy
Original Assignee
US Department of Energy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by US Department of Energy filed Critical US Department of Energy
Application granted granted Critical
Publication of CA1058330A publication Critical patent/CA1058330A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CA259,725A 1975-10-30 1976-08-24 Methode de depose de couches conductrices sur des supports Expired CA1058330A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62742075A 1975-10-30 1975-10-30

Publications (1)

Publication Number Publication Date
CA1058330A true CA1058330A (fr) 1979-07-10

Family

ID=24514575

Family Applications (1)

Application Number Title Priority Date Filing Date
CA259,725A Expired CA1058330A (fr) 1975-10-30 1976-08-24 Methode de depose de couches conductrices sur des supports

Country Status (5)

Country Link
JP (1) JPS5257972A (fr)
CA (1) CA1058330A (fr)
DE (1) DE2649091A1 (fr)
FR (1) FR2330245A1 (fr)
GB (1) GB1539272A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0074605B1 (fr) * 1981-09-11 1990-08-29 Kabushiki Kaisha Toshiba Procédé pour fabriquer un substrat pour circuit multicouches
JPS59167096A (ja) * 1983-03-11 1984-09-20 日本電気株式会社 回路基板
JPH0732158B2 (ja) * 1988-04-08 1995-04-10 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 電子部品のための多層金属構造

Also Published As

Publication number Publication date
FR2330245A1 (fr) 1977-05-27
GB1539272A (en) 1979-01-31
DE2649091A1 (de) 1977-05-12
FR2330245B3 (fr) 1979-07-13
JPS5257972A (en) 1977-05-12

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