JPS5277668A - Production of semiconductive device - Google Patents

Production of semiconductive device

Info

Publication number
JPS5277668A
JPS5277668A JP50155309A JP15530975A JPS5277668A JP S5277668 A JPS5277668 A JP S5277668A JP 50155309 A JP50155309 A JP 50155309A JP 15530975 A JP15530975 A JP 15530975A JP S5277668 A JPS5277668 A JP S5277668A
Authority
JP
Japan
Prior art keywords
production
semiconductive device
emoploying
cheapen
compulsorily
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50155309A
Other languages
Japanese (ja)
Inventor
Ikuhisa Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP50155309A priority Critical patent/JPS5277668A/en
Publication of JPS5277668A publication Critical patent/JPS5277668A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To mount the semiconductor certainly and to cheapen the cost by mounting the pellet directly or after the solder is taken to the nickel metallizing plate on the stem compulsorily with emoploying the supersonic waves soldering in the inert atmosphere.
COPYRIGHT: (C)1977,JPO&Japio
JP50155309A 1975-12-24 1975-12-24 Production of semiconductive device Pending JPS5277668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50155309A JPS5277668A (en) 1975-12-24 1975-12-24 Production of semiconductive device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50155309A JPS5277668A (en) 1975-12-24 1975-12-24 Production of semiconductive device

Publications (1)

Publication Number Publication Date
JPS5277668A true JPS5277668A (en) 1977-06-30

Family

ID=15603065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50155309A Pending JPS5277668A (en) 1975-12-24 1975-12-24 Production of semiconductive device

Country Status (1)

Country Link
JP (1) JPS5277668A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194538A (en) * 1981-05-27 1982-11-30 Hitachi Ltd Semiconductor manufacturing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194538A (en) * 1981-05-27 1982-11-30 Hitachi Ltd Semiconductor manufacturing device

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