JPS5329088A - Production of semiconductor integrated circuit device - Google Patents
Production of semiconductor integrated circuit deviceInfo
- Publication number
- JPS5329088A JPS5329088A JP10330576A JP10330576A JPS5329088A JP S5329088 A JPS5329088 A JP S5329088A JP 10330576 A JP10330576 A JP 10330576A JP 10330576 A JP10330576 A JP 10330576A JP S5329088 A JPS5329088 A JP S5329088A
- Authority
- JP
- Japan
- Prior art keywords
- production
- integrated circuit
- semiconductor integrated
- circuit device
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 230000003628 erosive effect Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000012212 insulator Substances 0.000 abstract 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Abstract
PURPOSE: To obtain multilayer wirings free from any disconnection by stepping by providing a protecting film having erosion resistance to the etching solution used for forming patterns to wiring layers, on an insulator layer and forming wiring papatterns on said film.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10330576A JPS5329088A (en) | 1976-08-30 | 1976-08-30 | Production of semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10330576A JPS5329088A (en) | 1976-08-30 | 1976-08-30 | Production of semiconductor integrated circuit device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58071214A Division JPS58194356A (en) | 1983-04-22 | 1983-04-22 | Semiconductor integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5329088A true JPS5329088A (en) | 1978-03-17 |
Family
ID=14350507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10330576A Pending JPS5329088A (en) | 1976-08-30 | 1976-08-30 | Production of semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5329088A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4994402A (en) * | 1987-06-26 | 1991-02-19 | Hewlett-Packard Company | Method of fabricating a coplanar, self-aligned contact structure in a semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50137086A (en) * | 1974-04-17 | 1975-10-30 |
-
1976
- 1976-08-30 JP JP10330576A patent/JPS5329088A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50137086A (en) * | 1974-04-17 | 1975-10-30 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4994402A (en) * | 1987-06-26 | 1991-02-19 | Hewlett-Packard Company | Method of fabricating a coplanar, self-aligned contact structure in a semiconductor device |
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