JPS5352065A - Wire procissing unit after wire bonding - Google Patents

Wire procissing unit after wire bonding

Info

Publication number
JPS5352065A
JPS5352065A JP12613776A JP12613776A JPS5352065A JP S5352065 A JPS5352065 A JP S5352065A JP 12613776 A JP12613776 A JP 12613776A JP 12613776 A JP12613776 A JP 12613776A JP S5352065 A JPS5352065 A JP S5352065A
Authority
JP
Japan
Prior art keywords
wire
procissing
unit
equipment
providing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12613776A
Other languages
English (en)
Other versions
JPS579493B2 (ja
Inventor
Tadashi Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12613776A priority Critical patent/JPS5352065A/ja
Publication of JPS5352065A publication Critical patent/JPS5352065A/ja
Publication of JPS579493B2 publication Critical patent/JPS579493B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP12613776A 1976-10-22 1976-10-22 Wire procissing unit after wire bonding Granted JPS5352065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12613776A JPS5352065A (en) 1976-10-22 1976-10-22 Wire procissing unit after wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12613776A JPS5352065A (en) 1976-10-22 1976-10-22 Wire procissing unit after wire bonding

Publications (2)

Publication Number Publication Date
JPS5352065A true JPS5352065A (en) 1978-05-12
JPS579493B2 JPS579493B2 (ja) 1982-02-22

Family

ID=14927579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12613776A Granted JPS5352065A (en) 1976-10-22 1976-10-22 Wire procissing unit after wire bonding

Country Status (1)

Country Link
JP (1) JPS5352065A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5993281A (ja) * 1982-11-17 1984-05-29 富士通株式会社 ロボツトハンド
JPS6062477A (ja) * 1983-09-16 1985-04-10 株式会社日立製作所 ウェハ−カセット搬送ロボット
JPS6114882A (ja) * 1984-06-30 1986-01-23 株式会社東芝 把持機構の位置決め装置

Also Published As

Publication number Publication date
JPS579493B2 (ja) 1982-02-22

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