JPS579493B2 - - Google Patents
Info
- Publication number
- JPS579493B2 JPS579493B2 JP12613776A JP12613776A JPS579493B2 JP S579493 B2 JPS579493 B2 JP S579493B2 JP 12613776 A JP12613776 A JP 12613776A JP 12613776 A JP12613776 A JP 12613776A JP S579493 B2 JPS579493 B2 JP S579493B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12613776A JPS5352065A (en) | 1976-10-22 | 1976-10-22 | Wire procissing unit after wire bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12613776A JPS5352065A (en) | 1976-10-22 | 1976-10-22 | Wire procissing unit after wire bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5352065A JPS5352065A (en) | 1978-05-12 |
| JPS579493B2 true JPS579493B2 (ja) | 1982-02-22 |
Family
ID=14927579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12613776A Granted JPS5352065A (en) | 1976-10-22 | 1976-10-22 | Wire procissing unit after wire bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5352065A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993281A (ja) * | 1982-11-17 | 1984-05-29 | 富士通株式会社 | ロボツトハンド |
| JPS6062477A (ja) * | 1983-09-16 | 1985-04-10 | 株式会社日立製作所 | ウェハ−カセット搬送ロボット |
| JPS6114882A (ja) * | 1984-06-30 | 1986-01-23 | 株式会社東芝 | 把持機構の位置決め装置 |
-
1976
- 1976-10-22 JP JP12613776A patent/JPS5352065A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993281A (ja) * | 1982-11-17 | 1984-05-29 | 富士通株式会社 | ロボツトハンド |
| JPS6062477A (ja) * | 1983-09-16 | 1985-04-10 | 株式会社日立製作所 | ウェハ−カセット搬送ロボット |
| JPS6114882A (ja) * | 1984-06-30 | 1986-01-23 | 株式会社東芝 | 把持機構の位置決め装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5352065A (en) | 1978-05-12 |