JPS5383463A - Packaging method of semiconductor device - Google Patents

Packaging method of semiconductor device

Info

Publication number
JPS5383463A
JPS5383463A JP15857776A JP15857776A JPS5383463A JP S5383463 A JPS5383463 A JP S5383463A JP 15857776 A JP15857776 A JP 15857776A JP 15857776 A JP15857776 A JP 15857776A JP S5383463 A JPS5383463 A JP S5383463A
Authority
JP
Japan
Prior art keywords
semiconductor device
packaging method
eaenly
spreading
working efficiency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15857776A
Other languages
Japanese (ja)
Inventor
Toshiichi Mita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP15857776A priority Critical patent/JPS5383463A/en
Publication of JPS5383463A publication Critical patent/JPS5383463A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Clocks (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To stabilize quality and improve working efficiency by eaenly spreading eposy resin within a potting frame.
COPYRIGHT: (C)1978,JPO&Japio
JP15857776A 1976-12-28 1976-12-28 Packaging method of semiconductor device Pending JPS5383463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15857776A JPS5383463A (en) 1976-12-28 1976-12-28 Packaging method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15857776A JPS5383463A (en) 1976-12-28 1976-12-28 Packaging method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5383463A true JPS5383463A (en) 1978-07-22

Family

ID=15674719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15857776A Pending JPS5383463A (en) 1976-12-28 1976-12-28 Packaging method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5383463A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4913930A (en) * 1988-06-28 1990-04-03 Wacker Silicones Corporation Method for coating semiconductor components on a dielectric film
JPH05226391A (en) * 1992-01-13 1993-09-03 Nec Corp Sealing of ic chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4913930A (en) * 1988-06-28 1990-04-03 Wacker Silicones Corporation Method for coating semiconductor components on a dielectric film
JPH05226391A (en) * 1992-01-13 1993-09-03 Nec Corp Sealing of ic chip

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