JPS538565A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS538565A JPS538565A JP8269176A JP8269176A JPS538565A JP S538565 A JPS538565 A JP S538565A JP 8269176 A JP8269176 A JP 8269176A JP 8269176 A JP8269176 A JP 8269176A JP S538565 A JPS538565 A JP S538565A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- unused
- electrodes
- ensure
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To ensure a constant connection condition and thus to obtain a semiconductor device featuring a high reliability by connecting even the element electrode unused electrically to the lead wire along with other electrodes.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51082691A JPS5823945B2 (en) | 1976-07-12 | 1976-07-12 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51082691A JPS5823945B2 (en) | 1976-07-12 | 1976-07-12 | semiconductor equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57088459A Division JPS5850028B2 (en) | 1982-05-24 | 1982-05-24 | semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS538565A true JPS538565A (en) | 1978-01-26 |
| JPS5823945B2 JPS5823945B2 (en) | 1983-05-18 |
Family
ID=13781428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51082691A Expired JPS5823945B2 (en) | 1976-07-12 | 1976-07-12 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5823945B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4950878A (en) * | 1972-09-18 | 1974-05-17 | ||
| JPS4995575A (en) * | 1973-01-12 | 1974-09-10 |
-
1976
- 1976-07-12 JP JP51082691A patent/JPS5823945B2/en not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4950878A (en) * | 1972-09-18 | 1974-05-17 | ||
| JPS4995575A (en) * | 1973-01-12 | 1974-09-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5823945B2 (en) | 1983-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS538565A (en) | Semiconductor device | |
| JPS5362471A (en) | Semiconductor device | |
| JPS5623768A (en) | Semiconductor device | |
| JPS5258391A (en) | Piezo electric element | |
| JPS5212572A (en) | Semi-conductor device | |
| JPS53124072A (en) | Semiconductor device | |
| JPS547272A (en) | Semiconductor package | |
| JPS53124975A (en) | Semiconductor device | |
| JPS5313877A (en) | Semiconductor device | |
| JPS5375763A (en) | Manufacture for semiconductor device | |
| JPS5360176A (en) | Semiconductor device | |
| JPS51130894A (en) | Electric lead use conductor device | |
| JPS5211772A (en) | Semiconductor device | |
| JPS5356970A (en) | Tape for tape carrier | |
| JPS5317274A (en) | Electrode structure of semiconductor element | |
| JPS52151565A (en) | Semiconductor device and its production | |
| JPS5299068A (en) | Semiconductor device | |
| JPS53108372A (en) | Substrate for wireless bonding | |
| JPS52144276A (en) | Semiconductor device | |
| JPS52108774A (en) | Fitting material for integrated circuit | |
| JPS5366369A (en) | Semiconductor device | |
| JPS5226197A (en) | Display unit | |
| JPS5333057A (en) | Bump type semiconductor device | |
| JPS5297673A (en) | Semiconductor device | |
| JPS52146562A (en) | Semiconductor integrated circuit device |