JPS5623768A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5623768A
JPS5623768A JP9956979A JP9956979A JPS5623768A JP S5623768 A JPS5623768 A JP S5623768A JP 9956979 A JP9956979 A JP 9956979A JP 9956979 A JP9956979 A JP 9956979A JP S5623768 A JPS5623768 A JP S5623768A
Authority
JP
Japan
Prior art keywords
main surface
pellet
circuit portion
semiconductor
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9956979A
Other languages
Japanese (ja)
Inventor
Hitoshi Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9956979A priority Critical patent/JPS5623768A/en
Publication of JPS5623768A publication Critical patent/JPS5623768A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To increase the using area of other main surface of a semiconductor device used as a circuit portion by forming a wire for connecting a semiconductor area formed on a semiconductor substrate to a connecting terminal formed on the substrate to lead externally therefrom over the one main surface side to the other main surface side of the substrate. CONSTITUTION:A circuit portion 7 is formed on one main surface 2 of a semiconductor pellet 1, and no circuit is formed on the other main surface 8. When connecting wires to circuit portion 7 in the one main surface 2 in the pellet 1 thus formed, a plurality of connecting terminal 3 is formed on the peripheral side of the other main surface 8 not provided with the circuit, is connected with one end of aluminum wire 9, and is laid at the other end along the side surface of the pellet 1 toward the main surface 2 to be connected to the circuit portion. Then, said pellet 1 is contained in the case 4, whereupon the terminal 3a of the other main surface 8 is brought into contact with the terminals 5a, 5b for connection in the recess formed in the case 4 to integrate the pellet 1 with the case 4.
JP9956979A 1979-08-03 1979-08-03 Semiconductor device Pending JPS5623768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9956979A JPS5623768A (en) 1979-08-03 1979-08-03 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9956979A JPS5623768A (en) 1979-08-03 1979-08-03 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5623768A true JPS5623768A (en) 1981-03-06

Family

ID=14250750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9956979A Pending JPS5623768A (en) 1979-08-03 1979-08-03 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5623768A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155225U (en) * 1982-04-09 1983-10-17 山本産業株式会社 Surface-treated molded products
JPS61273933A (en) * 1985-05-30 1986-12-04 Nhk Spring Co Ltd Preparation of sheet
JPS62291129A (en) * 1986-06-11 1987-12-17 Nec Corp Semiconductor device
JPH02178939A (en) * 1988-12-29 1990-07-11 Sharp Corp Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336184A (en) * 1976-09-16 1978-04-04 Seiko Epson Corp Semiconductor integrated circuit
JPS5412263A (en) * 1977-06-28 1979-01-29 Seiko Instr & Electronics Ltd Semiconductor element and production of the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336184A (en) * 1976-09-16 1978-04-04 Seiko Epson Corp Semiconductor integrated circuit
JPS5412263A (en) * 1977-06-28 1979-01-29 Seiko Instr & Electronics Ltd Semiconductor element and production of the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155225U (en) * 1982-04-09 1983-10-17 山本産業株式会社 Surface-treated molded products
JPS61273933A (en) * 1985-05-30 1986-12-04 Nhk Spring Co Ltd Preparation of sheet
JPS62291129A (en) * 1986-06-11 1987-12-17 Nec Corp Semiconductor device
JPH02178939A (en) * 1988-12-29 1990-07-11 Sharp Corp Semiconductor device

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