JPS5389660A - Production apparatus of semiconductor device - Google Patents

Production apparatus of semiconductor device

Info

Publication number
JPS5389660A
JPS5389660A JP388577A JP388577A JPS5389660A JP S5389660 A JPS5389660 A JP S5389660A JP 388577 A JP388577 A JP 388577A JP 388577 A JP388577 A JP 388577A JP S5389660 A JPS5389660 A JP S5389660A
Authority
JP
Japan
Prior art keywords
semiconductor device
production apparatus
heads
frames
efficiently
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP388577A
Other languages
Japanese (ja)
Inventor
Hiromichi Sawatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP388577A priority Critical patent/JPS5389660A/en
Publication of JPS5389660A publication Critical patent/JPS5389660A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To bond semiconductor elements accurately and efficiently to frames by using a bonding agent feeder mounted with a plurality of heads and a semiconductor element sucker.
COPYRIGHT: (C)1978,JPO&Japio
JP388577A 1977-01-19 1977-01-19 Production apparatus of semiconductor device Pending JPS5389660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP388577A JPS5389660A (en) 1977-01-19 1977-01-19 Production apparatus of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP388577A JPS5389660A (en) 1977-01-19 1977-01-19 Production apparatus of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5389660A true JPS5389660A (en) 1978-08-07

Family

ID=11569627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP388577A Pending JPS5389660A (en) 1977-01-19 1977-01-19 Production apparatus of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5389660A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329335A (en) * 1989-06-26 1991-02-07 Tokyo Electron Ltd Semiconductor chip prober

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329335A (en) * 1989-06-26 1991-02-07 Tokyo Electron Ltd Semiconductor chip prober

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