JPS54158863A - Integrated-circuit device - Google Patents

Integrated-circuit device

Info

Publication number
JPS54158863A
JPS54158863A JP6796778A JP6796778A JPS54158863A JP S54158863 A JPS54158863 A JP S54158863A JP 6796778 A JP6796778 A JP 6796778A JP 6796778 A JP6796778 A JP 6796778A JP S54158863 A JPS54158863 A JP S54158863A
Authority
JP
Japan
Prior art keywords
mounting part
leads
circumference
holding
current leaking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6796778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6156619B2 (2
Inventor
Masakazu Matsushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6796778A priority Critical patent/JPS54158863A/ja
Publication of JPS54158863A publication Critical patent/JPS54158863A/ja
Publication of JPS6156619B2 publication Critical patent/JPS6156619B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP6796778A 1978-06-05 1978-06-05 Integrated-circuit device Granted JPS54158863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6796778A JPS54158863A (en) 1978-06-05 1978-06-05 Integrated-circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6796778A JPS54158863A (en) 1978-06-05 1978-06-05 Integrated-circuit device

Publications (2)

Publication Number Publication Date
JPS54158863A true JPS54158863A (en) 1979-12-15
JPS6156619B2 JPS6156619B2 (2) 1986-12-03

Family

ID=13360244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6796778A Granted JPS54158863A (en) 1978-06-05 1978-06-05 Integrated-circuit device

Country Status (1)

Country Link
JP (1) JPS54158863A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663650A (en) * 1984-05-02 1987-05-05 Gte Products Corporation Packaged integrated circuit chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663650A (en) * 1984-05-02 1987-05-05 Gte Products Corporation Packaged integrated circuit chip

Also Published As

Publication number Publication date
JPS6156619B2 (2) 1986-12-03

Similar Documents

Publication Publication Date Title
JPS55111151A (en) Integrated circuit device
JPS5237721A (en) Semiconductor integrated circuit
JPS5591145A (en) Production of ceramic package
GB2009504A (en) Protected integrated electrical circuits
JPS5779652A (en) Resin-sealed semiconductor device
JPS57181144A (en) Semiconductor device
JPS5277684A (en) Exeternal wiring of integrated circuit
JPS54158863A (en) Integrated-circuit device
JPS54133878A (en) Semiconductor device
JPS534472A (en) Semiconductor package
JPS5543415A (en) Semiconductor pressure converter
JPS5521154A (en) Ceramic package
JPS5277587A (en) Wiring of integrated circuit outside chip
JPS55107251A (en) Electronic part and its packaging construction
JPS554988A (en) Semiconductor device
JPS6464347A (en) Semiconductor integrated circuit
JPS5618469A (en) Semiconductor device
JPS55140250A (en) Semiconductor device
JPS5339891A (en) Semiconductor integrated circuit device
GB1494653A (en) Charge coupled devices
JPS6453568A (en) Semiconductor package
JPS5441666A (en) Semiconductor integrated circuit element
JPS5789276A (en) Photo chip element
JPS5461471A (en) Semiconductor device
JPS5287363A (en) Semiconductor packdage