JPS5451966A - Preparation of clad material in metal with high melting point - Google Patents

Preparation of clad material in metal with high melting point

Info

Publication number
JPS5451966A
JPS5451966A JP11877777A JP11877777A JPS5451966A JP S5451966 A JPS5451966 A JP S5451966A JP 11877777 A JP11877777 A JP 11877777A JP 11877777 A JP11877777 A JP 11877777A JP S5451966 A JPS5451966 A JP S5451966A
Authority
JP
Japan
Prior art keywords
substrate
metal
powder grain
clad material
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11877777A
Other languages
Japanese (ja)
Inventor
Hideo Koizumi
Yoichi Miyashita
Kazunori Yokosu
Isamu Abe
Hiroshi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11877777A priority Critical patent/JPS5451966A/en
Publication of JPS5451966A publication Critical patent/JPS5451966A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE: To produce a clad material, which surface has oxidation resistance, by forming a metallic film on a surface of a substrate by mounting metallic powder grain with lower m.p. than the surface of the substrate of metal with high m.p. to said surface and by melting the surface by irradiating laser in a non-oxidation at mosphere.
CONSTITUTION: Metallic powder grain 2 of Ni, Al, Si, Cu, Pt, etc. with lower m.p. than W, Mo or these alloys is spread on an upper surface of a substrate 1 in metal with high m.p. consisting of W, Mo or these alloys in approx. unifrom thickness. The substrate is received in a box in a non-oxidation stmosphere, laser is irradiated to the metallic powder grain 2 from a laser oscillator 3, the substrate 1 is scanned, and the metallic powder grain 2 is successively disolved. Consequently, melted meatal uniformly spreads on the surface of the substrate 1 and is solidified, thus obtaining a clad material 6 in metal with high m.p., to which a metallic film 5 is compounded. This method can improve adhesion between substrates in metal with high m.p., such as, a bulb material, a disc for a rectifying element, etc. and other metallic materials and the oxidation resistance of the substrates
COPYRIGHT: (C)1979,JPO&Japio
JP11877777A 1977-10-03 1977-10-03 Preparation of clad material in metal with high melting point Pending JPS5451966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11877777A JPS5451966A (en) 1977-10-03 1977-10-03 Preparation of clad material in metal with high melting point

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11877777A JPS5451966A (en) 1977-10-03 1977-10-03 Preparation of clad material in metal with high melting point

Publications (1)

Publication Number Publication Date
JPS5451966A true JPS5451966A (en) 1979-04-24

Family

ID=14744810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11877777A Pending JPS5451966A (en) 1977-10-03 1977-10-03 Preparation of clad material in metal with high melting point

Country Status (1)

Country Link
JP (1) JPS5451966A (en)

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