JPS5460582A - Electrode wiring and its forming method in semiconductor device - Google Patents

Electrode wiring and its forming method in semiconductor device

Info

Publication number
JPS5460582A
JPS5460582A JP12683877A JP12683877A JPS5460582A JP S5460582 A JPS5460582 A JP S5460582A JP 12683877 A JP12683877 A JP 12683877A JP 12683877 A JP12683877 A JP 12683877A JP S5460582 A JPS5460582 A JP S5460582A
Authority
JP
Japan
Prior art keywords
film
groove
wiring
electrode wiring
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12683877A
Other languages
English (en)
Other versions
JPS6041461B2 (ja
Inventor
Tatsu Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12683877A priority Critical patent/JPS6041461B2/ja
Publication of JPS5460582A publication Critical patent/JPS5460582A/ja
Publication of JPS6041461B2 publication Critical patent/JPS6041461B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP12683877A 1977-10-24 1977-10-24 半導体装置における電極配線の形成法 Expired JPS6041461B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12683877A JPS6041461B2 (ja) 1977-10-24 1977-10-24 半導体装置における電極配線の形成法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12683877A JPS6041461B2 (ja) 1977-10-24 1977-10-24 半導体装置における電極配線の形成法

Publications (2)

Publication Number Publication Date
JPS5460582A true JPS5460582A (en) 1979-05-16
JPS6041461B2 JPS6041461B2 (ja) 1985-09-17

Family

ID=14945136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12683877A Expired JPS6041461B2 (ja) 1977-10-24 1977-10-24 半導体装置における電極配線の形成法

Country Status (1)

Country Link
JP (1) JPS6041461B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582044A (ja) * 1981-06-26 1983-01-07 Seiko Epson Corp 半導体装置の製造方法
US4822753A (en) * 1988-05-09 1989-04-18 Motorola, Inc. Method for making a w/tin contact
US5059555A (en) * 1990-08-20 1991-10-22 National Semiconductor Corporation Method to fabricate vertical fuse devices and Schottky diodes using thin sacrificial layer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04114962U (ja) * 1991-03-27 1992-10-12 アイホン株式会社 筐体扉の開閉構造

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582044A (ja) * 1981-06-26 1983-01-07 Seiko Epson Corp 半導体装置の製造方法
US4822753A (en) * 1988-05-09 1989-04-18 Motorola, Inc. Method for making a w/tin contact
US5059555A (en) * 1990-08-20 1991-10-22 National Semiconductor Corporation Method to fabricate vertical fuse devices and Schottky diodes using thin sacrificial layer

Also Published As

Publication number Publication date
JPS6041461B2 (ja) 1985-09-17

Similar Documents

Publication Publication Date Title
JPS5690525A (en) Manufacture of semiconductor device
JPS5487172A (en) Manufacture for simiconductor device
JPS55138864A (en) Method of fabricating semiconductor assembling substrate
JPS5484932A (en) Forming method of multi-layer construction
JPS5480093A (en) Manufacture of semiconductor device
JPS57149752A (en) Structure of multilayer wiring
JPS5585042A (en) Semiconductor device
JPS5555546A (en) Method of wiring semiconductor device
JPS5272571A (en) Production of semiconductor device
JPS6477143A (en) Formation of copper thin film wiring
JPS5478659A (en) Menufacture of semiconductor device
JPS54111795A (en) Manufacture for semiconductor device
JPS5247689A (en) Process for production of semiconductor device
JPS539489A (en) Production of semiconductor device
JPS5678141A (en) Method of forming electrode for semiconductor device
JPS5732653A (en) Manufacture of semiconductor device
JPS5558547A (en) Wiring
JPS546775A (en) Semiconductor device featuring stepped electrode structure
JPS5671976A (en) Preparation method of mos type semiconductor system
JPS52113161A (en) Semiconductor device
JPS54162458A (en) Manufacture for semiconductor device
JPS5447475A (en) Electrode forming method of semiconductor devices
JPS5474384A (en) Manufacture of semiconductor device
JPS56134733A (en) Production of semiconductor
JPS56155552A (en) Manufacture of semiconductor device