JPS5468178A - Wiring construction of integrated circuit - Google Patents

Wiring construction of integrated circuit

Info

Publication number
JPS5468178A
JPS5468178A JP13526077A JP13526077A JPS5468178A JP S5468178 A JPS5468178 A JP S5468178A JP 13526077 A JP13526077 A JP 13526077A JP 13526077 A JP13526077 A JP 13526077A JP S5468178 A JPS5468178 A JP S5468178A
Authority
JP
Japan
Prior art keywords
wiring
fundamental functional
functional elements
integrated circuit
fundamental
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13526077A
Other languages
Japanese (ja)
Inventor
Akira Honma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13526077A priority Critical patent/JPS5468178A/en
Publication of JPS5468178A publication Critical patent/JPS5468178A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To remarkably reduce the capcitance between the second wiring group and the silicon semiconductor substrate without lowering the manufacture yield rate, by making thick the insulation layer between the both coupling the fundamental functional elements.
CONSTITUTION: In the large scale integrated circuit consisting of the fundamental functional element forming regions 1 and 2 and the wiring region 3 to locate the functional wiring group, first the fundamental functional elements 5 and 6 are formed on the silicon semiconductor substrate 4. Next, after forming the first layer silicon dioxide layer 7, the first wiring goups 8 and 9 to couple a plurality of circuit elements in the fundamental functional elements 5 and 6 are formed. Further, the silicon dioxide layer 10 is laminated thickly on the wiring region 3 and the second wiring group 11 to couple the fundamental functional elements is formed on it.
COPYRIGHT: (C)1979,JPO&Japio
JP13526077A 1977-11-11 1977-11-11 Wiring construction of integrated circuit Pending JPS5468178A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13526077A JPS5468178A (en) 1977-11-11 1977-11-11 Wiring construction of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13526077A JPS5468178A (en) 1977-11-11 1977-11-11 Wiring construction of integrated circuit

Publications (1)

Publication Number Publication Date
JPS5468178A true JPS5468178A (en) 1979-06-01

Family

ID=15147533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13526077A Pending JPS5468178A (en) 1977-11-11 1977-11-11 Wiring construction of integrated circuit

Country Status (1)

Country Link
JP (1) JPS5468178A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5867047A (en) * 1981-10-19 1983-04-21 Oki Electric Ind Co Ltd Manufacture of semiconductor integrated circuit device
JPS58105551A (en) * 1981-11-20 1983-06-23 Fujitsu Ltd Semiconductor device
JPH01270248A (en) * 1988-04-22 1989-10-27 Hitachi Ltd Manufacturing method of semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037508A (en) * 1973-08-10 1975-04-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037508A (en) * 1973-08-10 1975-04-08

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5867047A (en) * 1981-10-19 1983-04-21 Oki Electric Ind Co Ltd Manufacture of semiconductor integrated circuit device
JPS58105551A (en) * 1981-11-20 1983-06-23 Fujitsu Ltd Semiconductor device
JPH01270248A (en) * 1988-04-22 1989-10-27 Hitachi Ltd Manufacturing method of semiconductor device

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