JPS5512751A - Compound integrated circuit device manufacturing method - Google Patents

Compound integrated circuit device manufacturing method

Info

Publication number
JPS5512751A
JPS5512751A JP8560378A JP8560378A JPS5512751A JP S5512751 A JPS5512751 A JP S5512751A JP 8560378 A JP8560378 A JP 8560378A JP 8560378 A JP8560378 A JP 8560378A JP S5512751 A JPS5512751 A JP S5512751A
Authority
JP
Japan
Prior art keywords
electrodes
shortcircuited
electrode
integrated circuit
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8560378A
Other languages
Japanese (ja)
Inventor
Hitoshi Toda
Takayoshi Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8560378A priority Critical patent/JPS5512751A/en
Publication of JPS5512751A publication Critical patent/JPS5512751A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To reduce number of operating process by forming, in advance, a dielctric layer between conductor electrodes to be shortcircuited and allowing the shortcircuit to occur between the electrodes during dip soldering process.
CONSTITUTION: A conductor electrode 5 is formed on a base plate 1 as one of the electrodes to be shortcircuited, a dielectric layer 7 such as a dielectric glass layer is provided, and the other electrode is provided in such a manner as to surround the counductor electrode 5 from 3 directions. By providing it in such a mechanism, it is possible to allow the conductor electrodes 5 and 6 to be shortcircuited during the dip soldering process.
COPYRIGHT: (C)1980,JPO&Japio
JP8560378A 1978-07-12 1978-07-12 Compound integrated circuit device manufacturing method Pending JPS5512751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8560378A JPS5512751A (en) 1978-07-12 1978-07-12 Compound integrated circuit device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8560378A JPS5512751A (en) 1978-07-12 1978-07-12 Compound integrated circuit device manufacturing method

Publications (1)

Publication Number Publication Date
JPS5512751A true JPS5512751A (en) 1980-01-29

Family

ID=13863393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8560378A Pending JPS5512751A (en) 1978-07-12 1978-07-12 Compound integrated circuit device manufacturing method

Country Status (1)

Country Link
JP (1) JPS5512751A (en)

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