JPS5524726A - Soldering mechanism with face profiling mechanism - Google Patents

Soldering mechanism with face profiling mechanism

Info

Publication number
JPS5524726A
JPS5524726A JP9695878A JP9695878A JPS5524726A JP S5524726 A JPS5524726 A JP S5524726A JP 9695878 A JP9695878 A JP 9695878A JP 9695878 A JP9695878 A JP 9695878A JP S5524726 A JPS5524726 A JP S5524726A
Authority
JP
Japan
Prior art keywords
tip
lead
descent
descend
brought
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9695878A
Other languages
Japanese (ja)
Other versions
JPS5632072B2 (en
Inventor
Shinpei Ogino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9695878A priority Critical patent/JPS5524726A/en
Publication of JPS5524726A publication Critical patent/JPS5524726A/en
Publication of JPS5632072B2 publication Critical patent/JPS5632072B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To provide the subject soldering mechanism which assumes a tip structure in which said mechanism can follow the inclination of opposing printing plates thereby to enable the face profiling against the bowing of printing plates.
CONSTITUTION: An LSI 8 is inserted in a lead holder 19, and the planeness of the tip 17 is compensated by a lever 20 in a state of where a lead 9 is matched with the print wiring. Then, the descent of a pressure rod 11, a guide metallic material is caused to descend through a spring 21, and further a pressure rod 11' connected to the metallic material 23 is caused to descend. By the descent of the rod 11' a bearing 12 is brought into contact with a groove 16, a shaft 13 is brought into a free state in a hole 14, and the tip 17 is profiled on the surface of the printing substrate 7 to press the lead 9. Upon this occasion, since each tip 17 is suspended from a spring 26, each tip 17 profiles on the surfaces of the substrate 7, opposing to respective tips, and pressure distribution to respective sides is unreasonably unified, and irregularities of junctions are eliminated.
COPYRIGHT: (C)1980,JPO&Japio
JP9695878A 1978-08-09 1978-08-09 Soldering mechanism with face profiling mechanism Granted JPS5524726A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9695878A JPS5524726A (en) 1978-08-09 1978-08-09 Soldering mechanism with face profiling mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9695878A JPS5524726A (en) 1978-08-09 1978-08-09 Soldering mechanism with face profiling mechanism

Publications (2)

Publication Number Publication Date
JPS5524726A true JPS5524726A (en) 1980-02-22
JPS5632072B2 JPS5632072B2 (en) 1981-07-25

Family

ID=14178765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9695878A Granted JPS5524726A (en) 1978-08-09 1978-08-09 Soldering mechanism with face profiling mechanism

Country Status (1)

Country Link
JP (1) JPS5524726A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4720035A (en) * 1986-01-17 1988-01-19 Fujitsu Limited Method of reflow bonding electronic parts on printed circuit board and apparatus used therefor
US4735354A (en) * 1986-09-19 1988-04-05 Toyo Electronics Corp. Method of soldering component on printed circuit board
JPH02169178A (en) * 1988-10-24 1990-06-29 Hughes Aircraft Co Heater-rod device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0185271U (en) * 1987-11-28 1989-06-06

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4720035A (en) * 1986-01-17 1988-01-19 Fujitsu Limited Method of reflow bonding electronic parts on printed circuit board and apparatus used therefor
US4735354A (en) * 1986-09-19 1988-04-05 Toyo Electronics Corp. Method of soldering component on printed circuit board
JPH02169178A (en) * 1988-10-24 1990-06-29 Hughes Aircraft Co Heater-rod device

Also Published As

Publication number Publication date
JPS5632072B2 (en) 1981-07-25

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